The effect of bis allyl benzoxazine on the thermal, mechanical and dielectric properties of bismaleimide–cyanate blend polymers

A high-performance polymer composite was fabricated using Bz-allyl/BMI/BADCy resin, in which the BMI/BADCy resin was modified with Bz-allyl to improve its dielectric, thermal and mechanical properties and the cross-linking degree after curing.

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Study on Thermal and Mechanical Properties of Polyurethane Systems for In-Mould Decoration Ink

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.881-883.850 ◽

2014 ◽

Vol 881-883 ◽

pp. 850-853

Author(s):

Jing Lin ◽

Cheng Zheng ◽

Shu Xuan Qian ◽

Xian Fang Cai ◽

Yong Shun Lan ◽

...

Keyword(s):

Mechanical Properties ◽

Water Sorption ◽

Phenolic Resin ◽

Cross Linking ◽

Thermal And Mechanical Properties ◽

Elongation At Break ◽

Swell Ratio ◽

System A ◽

Gel Fraction ◽

The Cross

In this study, three polyurethane systems A (A450/RD181/L75), B(A450/RD181/N3390) and C(A450/RD181/2104/N3390) for in-mould decoration ink were studied. The results of thermogravimetric analysis showed that introducing rosin modified phenolic resin 2104 (RMPR) and N3390 into PU system A can improve the thermal stability, Moreover, Measurements of gel fraction and swell ratio showed that incorporation of N3390 is benificial for increasing the cross-linking density of PU systems as compared to L75 so as to increase the gel fraction and decrease the swell ratio.The tensile strength of cured PU systems increased following in the order: A<B<C, elongation at break is just the opposite. In addition, it is indicated that incorporation of N3390 is benificial for increasing the cross-linking density of PUs so as to improve the the shore A hardness and decease the water sorption.

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The Influence of Pressure-Induced-Flow Processing on the Morphology, Thermal and Mechanical Properties of Polypropylene Blends

Journal of Composites Science ◽

10.3390/jcs5030064 ◽

2021 ◽

Vol 5 (3) ◽

pp. 64

Author(s):

Pengfei Li ◽

Yanpei Fei ◽

Shilun Ruan ◽

Jianjiang Yang ◽

Feng Chen ◽

...

Keyword(s):

Mechanical Properties ◽

High Performance ◽

Polyamide 6 ◽

Polymer Materials ◽

Thermal And Mechanical Properties ◽

High Performance Polymer ◽

Polyolefin Elastomer ◽

Induced Flow ◽

Polypropylene Blends ◽

Structure Research

The pressure-induced-flow (PIF) processing can effectively prepare high-performance polymer materials. This paper studies the influence of pressure-induced-flow processing on the morphology, thermodynamic and mechanical properties of polypropylene (PP)/polyamide 6 (PA6) blends, PP/polyolefin elastomer (POE) blends and PP/thermoplastic urethane (TPU) blends. The results show that pressure-induced-flow processing can significantly improve the thermodynamic and mechanical properties of the blends by regulating internal structure. Research shows that the pressure-induced-flow processing can increase the strength and the toughness of the blends, particularly in PP/TPU blends.

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Investigation of the functional network modifier loading on the stoichiometric ratio of epoxy resins and their dielectric properties

Journal of Materials Science ◽

10.1007/s10853-021-06113-8 ◽

2021 ◽

Author(s):

Istebreq A. Saeedi ◽

Sunny Chaudhary ◽

Thomas Andritsch ◽

Alun S. Vaughan

Keyword(s):

Glass Transition ◽

Dielectric Properties ◽

Electrical Properties ◽

Epoxy Resins ◽

Functional Network ◽

Cross Linking ◽

Network Modifier ◽

Epoxy Resin System ◽

The Cross ◽

The Impact

AbstractReactive molecular additives have often been employed to tailor the mechanical properties of epoxy resins. In addition, several studies have reported improved electrical properties in such systems, where the network architecture and included function groups have been modified through the use of so-called functional network modifier (FNM) molecules. The study reported here set out to investigate the effect of a glycidyl polyhedral oligomeric silsesquioxane (GPOSS) FNM on the cross-linking reactions, glass transition, breakdown strength and dielectric properties of an amine-cured epoxy resin system. Since many previous studies have considered POSS to act as an inorganic filler, a key aim was to consider the impact of GPOSS addition on the stoichiometry of curing. Fourier transform infrared spectroscopy revealed significant changes in the cross-linking reactions that occur if appropriate stoichiometric compensation is not made for the additional epoxide groups present on the GPOSS. These changes, in concert with the direct effect of the GPOSS itself, influence the glass transition temperature, dielectric breakdown behaviour and dielectric response of the system. Specifically, the work shows that the inclusion of GPOSS can result in beneficial changes in electrical properties, but that these gains are easily lost if consequential changes in the matrix polymer are not appropriately counteracted. Nevertheless, if the system is appropriately optimized, materials with pronounced improvements in technologically important characteristics can be designed.

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Hyperbranched polyamide modified graphene oxide-reinforced polyurethane nanocomposites with enhanced mechanical properties

RSC Advances ◽

10.1039/d1ra00654a ◽

2021 ◽

Vol 11 (24) ◽

pp. 14484-14494

Author(s):

Yahao Liu ◽

Jian Zheng ◽

Xiao Zhang ◽

Yongqiang Du ◽

Guibo Yu ◽

...

Keyword(s):

Mechanical Properties ◽

Graphene Oxide ◽

High Performance ◽

Cross Linking ◽

Elongation At Break ◽

Modified Graphene Oxide ◽

High Performance Composite ◽

Modified Graphene ◽

Polyurethane Nanocomposites ◽

Hyperbranched Polyamide

We successfully modified graphene oxide with amino-terminated hyperbranched polyamide (HGO), and obtained a high-performance composite with enhanced strength and elongation at break via cross-linking hydroxyl-terminated polybutadiene chains with HGO.

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Structure and properties of a phenylethynyl-terminated PMDA-type asymmetric polyimide

High Performance Polymers ◽

10.1177/0954008318762592 ◽

2018 ◽

Vol 31 (3) ◽

pp. 261-272 ◽

Cited By ~ 7

Author(s):

Yixiang Zhang ◽

Masahiko Miyauchi ◽

Steven Nutt

Keyword(s):

Mechanical Properties ◽

Thermal Processing ◽

Amorphous Structure ◽

Decomposition Temperature ◽

Thermal And Mechanical Properties ◽

Chain Mobility ◽

Amorphous Structures ◽

The Cross ◽

Imide Oligomers ◽

The Relationship

A new polymerized monomeric reactant (PMR)-type polyimide, designated TriA X, was investigated to determine polymer structure, processability, thermal, and mechanical properties and establish the relationship between the molecular structure and those properties. TriA X is a PMR-type polyimide with an asymmetric, irregular, and nonplanar backbone. Both the imide oligomers and the cross-linked polyimides of TriA X exhibited loose-packed amorphous structures, independent of thermal processing. The peculiar structures were attributed to the asymmetric backbone, which effectively prevented the formation of closed-packed chain stacking typically observed in polyimides. The imide oligomers exhibited a lower melt viscosity than a control imide oligomer (symmetric and semi-crystalline), indicating a higher chain mobility above the glass transition temperature ( Tg). The cured polyimide exhibited a Tg = 362°C and a decomposition temperature = 550°C. The cross-linked TriA X exhibited exceptional toughness and ductility (e.g. 15.1% at 23°C) for a polyimide, which was attributed to the high-molecular-weight oligomer and loose-packed amorphous structure. The thermal and mechanical properties of TriA X surpass those of PMR-15 and AFR-PE-4.

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Planarization and Dielectric Properties of Thin Photosensitive and Nonphotosensitive BCB

Journal of Microelectronics and Electronic Packaging ◽

10.4071/1551-4897-1.2.47 ◽

2004 ◽

Vol 1 (2) ◽

pp. 47-52

Author(s):

Brian Dusch ◽

Paul A. Kohl

Keyword(s):

Thin Films ◽

Dielectric Properties ◽

Thick Films ◽

Cross Linking ◽

Low Loss ◽

The Cross

Thin films (0.2 μm to 1.8 μm) of photosensitive and nonphotosensitive BCB were fabricated and the degree of planarization (DOP) and dielectric properties were investigated. It was found that a high DOP for wide spaces (>20 μm spaces with 1 μm of BCB) was possible with nonphotosensitive BCB but not photosensitive BCB because of the cross-linking reaction during the photo-process. Thin films (as thin as 0.2 μm) exhibited dielectric properties similar to thick films. The dielectric properties of the photosensitive BCB were slightly higher than nonphotosensitive BCB. Low loss properties were observed at all thickness.

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Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Advances in Electronic Packaging, Parts A, B, and C ◽

10.1115/ipack2005-73490 ◽

2005 ◽

Author(s):

Arun Gowda ◽

Annita Zhong ◽

Sandeep Tonapi ◽

Kaustubh Nagarkar ◽

K. Srihari

Keyword(s):

Mechanical Properties ◽

Thermal Performance ◽

Cross Linking ◽

Thermal Interface Materials ◽

Material System ◽

Thermal And Mechanical Properties ◽

Thermal Impedance ◽

Operating Life ◽

Thermal Interface ◽

Interface Materials

Thermal Interface Materials (TIMs) play a key role in the thermal management of microelectronics by providing a path of low thermal impedance between the heat generating devices and the heat dissipating components (heat spreader/sink). In addition, TIMs need to reliably maintain this low thermal resistance path throughout the operating life of the device. Currently, several different TIM material solutions are employed to dissipate heat away from semiconductor devices. Thermal greases, adhesives, gels, pads, and phase change materials are among these material solutions. Each material system has its own advantages and associated application space. While thermal greases offer excellent thermal performance, their uncured state makes them susceptible to pump-out and other degradation mechanisms. On the other hand, adhesives offer structural support but offer a higher heat resistance path. Gels are designed to provide a level of cross-linking to allow the thermal performance of greases and prevent premature degradation. However, the degree of crosslinking can have a significant effect of the behavior of gels. In this research, TIMs with varying cross-linking densities are studied and their thermal and mechanical properties reported. The base resin systems and fillers were maintained constant, while slight compositional alternations were made to induce different degrees of cross-linking.

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Effect of Diatomaceous Biosilica and Talc on the Properties of Dielectric Elastomer Based Composites

Energies ◽

10.3390/en13215828 ◽

2020 ◽

Vol 13 (21) ◽

pp. 5828

Author(s):

Ewa Olewnik-Kruszkowska ◽

Weronika Brzozowska ◽

Arkadiusz Adamczyk ◽

Magdalena Gierszewska ◽

Izabela Wojtczak ◽

...

Keyword(s):

Mechanical Properties ◽

Dielectric Constant ◽

Dielectric Properties ◽

Environmentally Friendly ◽

Polymeric Materials ◽

Dielectric Elastomer ◽

Thermal And Mechanical Properties ◽

Valuable Source ◽

Natural Fillers

Currently, scientists are still looking for new polymeric materials characterized by improved mechanical, thermal as well as dielectric properties. Moreover, it should be stressed that new composites should be environmentally friendly. For this reason, the aim of this work is to establish the influence of natural fillers in the form of diatomaceous biosilica (B) and talc (T) on the properties of dielectric elastomer (DE)-based composites. The dielectric elastomer-based materials have been tested taking into account their morphology, thermal and mechanical properties. Moreover, the dielectric constant of the obtained materials was evaluated. Obtained results revealed that the presence of both diatomaceous biosilica and talc significantly increases dielectric properties while having no significant effect on the mechanical properties of the obtained composites. It should be stressed that the performed analyses constitute a valuable source of knowledge on the effective modification of the thermal and dielectric properties of newly obtained materials.

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Mechanical Properties and Biodegradability of the Kenaf/Soy Protein Isolate-PVA Biocomposites

International Journal of Polymer Science ◽

10.1155/2015/860617 ◽

2015 ◽

Vol 2015 ◽

pp. 1-11 ◽

Cited By ~ 6

Author(s):

Jong Sung Won ◽

Ji Eun Lee ◽

Da Young Jin ◽

Seung Goo Lee

Keyword(s):

Mechanical Properties ◽

Soy Protein ◽

Low Cost ◽

Soy Protein Isolate ◽

Natural Fibers ◽

Protein Isolate ◽

Poly Vinyl Alcohol ◽

Cross Linking ◽

Adhesion Properties ◽

The Cross

The effective utilization of original natural fibers as indispensable components in natural resins for developing novel, low-cost, eco-friendly biocomposites is one of the most rapidly emerging fields of research in fiber-reinforced composite. The objective of this study is to investigate the interfacial adhesion properties, water absorption, biodegradation properties, and mechanical properties of the kenaf/soy protein isolate- (SPI-) PVA composite. Experimental results showed that 20 wt% poly (vinyl alcohol) (PVA) and 8 wt% glutaraldehyde (GA) created optimum conditions for the consolidation of the composite. The increase of interfacial shear strength enhanced the composites flexural and tensile strength of the kenaf/SPI-PVA composite. The kenaf/SPI-PVA mechanical properties of the composite also increased with the content of cross-linking agent. Results of the biodegradation test indicated that the degradation time of the composite could be controlled by the cross-linking agent. The degradation rate of the kenaf/SPI-PVA composite with the cross-linking agent was lower than that of the composite without the cross-linking agent.

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