Low cost 400-ps rise-time circuit-board Marx generator

2011 ◽  
Author(s):  
C. Nunnally ◽  
Matthew B. Lara ◽  
J. R. Mayes ◽  
T.R. Smith
Keyword(s):  
Rise Time ◽  
Low Cost ◽  
Circuit Board ◽  
Marx Generator

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

High-speed electro-optic switch using buried electrode structure in polymer Mach–Zehnder waveguide

2016 ◽  
Vol 30 (06) ◽  
pp. 1650063 ◽  
Author(s):  
Jingwen Sun ◽  
Jian Sun ◽  
Yunji Yi ◽  
Lucheng Qv ◽  
Shiqi Sun ◽  
...  
Keyword(s):  
Insertion Loss ◽  
Rise Time ◽  
High Speed ◽  
Low Cost ◽  
Characteristic Parameters ◽  
Electrode Structure ◽  
Processing Cost ◽  
Electro Optic ◽  
Disperse Red 1 ◽  
Excellent Photostability

A low-cost and high-speed electro-optic (EO) switch using the guest–host EO material Disperse Red 1/Polymethyl Methacrylate (DR1/PMMA) was designed and fabricated. The DR1/PMMA material presented a low processing cost, an excellent photostability and a large EO coefficient of 13.1 pm/V. To improve the performance of the switch, the in-plane buried electrode structure was introduced in the polymer Mach–Zehnder waveguide to improve the poling and modulating efficiency. The characteristic parameters of the waveguide and the electrodes were carefully designed and the fabrication process was strictly controlled. Under 1550 nm, the insertion loss of the device was 12.7 dB. The measured switching rise time and fall time of the switch were 50.00 ns and 54.29 ns, respectively.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

scholarly journals Research of the anti-resonance pulse forming network and its application in the Marx generator

2016 ◽  
Vol 34 (4) ◽  
pp. 675-686 ◽  
Author(s):  
Z.-L. Pan ◽  
J.-H. Yang ◽  
X.-B. Cheng
Keyword(s):  
Equivalent Circuit ◽  
Rise Time ◽  
Pulse Width ◽  
Marx Generator ◽  
Full Width ◽  
Half Maximum ◽  
Compact Structure ◽  
Fall Time ◽  
Pulse Forming Network ◽  
Load Pulse

AbstractAn anti-resonance pulse forming network (PFN) has been designed, analyzed, and tested for its application in generating quasi-square pulses. According to the circuit simulations, a compact generator based on two/three-section network was constructed. Two-section network is applied in the generator due to its compact structure, while three-section network is employed for generating pulses with higher quality. When two-section network is applied in the generator, the full-width at half-maximum of the load pulse is 400 ns, at the same time, its rise time, flat top and fall time are 90, 180 and 217 ns, respectively. When the three-section network is applied with the same pulse width of the load pulse, the rise time of the output decreases to 60 ns, while the flat top increases to 240 ns and the fall time reduces to 109 ns. Meanwhile, this kind of network could be used to shape the output pulses of generators whose equivalent circuit is LC series discharge network, such as MARX generator, into quasi-square pulses. And the preliminary experiment demonstrates that anti-resonance network could work well on four-stage Marx generators. A sine pulse generated by the four-stage Marx generator is shaped into a quasi-square pulse with voltage of 11.8 kV and pulse width about 110 ns based on two-section anti-resonance network.

EFFECT OF HYDROTHERMAL TIME ON THE GROWTH OF ZnO NANORODS

2020 ◽  
pp. 84-91
Author(s):  
Hanh
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Cell Structure ◽  
Zno Nanorods ◽  
Zinc Nitrate ◽  
Circuit Board ◽  
Nitrate Hexahydrate ◽  
Hydrothermal Time ◽  
One Step ◽  
Surface Morphologies

In this work, ZnO nanorods (NRs) were successfully grown on printed circuit board substrates (PCBs) by utilizing a one-step, seedless, low-cost hydrothermal method. It was shown that by implementing a galvanic cell structure in an aqueous solution of 80 mM of zinc nitrate hexahydrate and hexamethylenetetramine, ZnO NRs can directly grow on the PCBs substrate without the assistance of a seed layer. The effect of hydrothermal time on the surface morphologies, and the crystallinity of the as-grown ZnO nanorods (NRs) was also investigated. The as-grown ZnO NRs also exhibited a significant enhancement in vertical growth and their crystallinity with 5 hour growth.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

Teaching Classical Control System Course With Portable Student-Owned Mechatronic Kits

2012 ◽  
Author(s):  
Eniko T. Enikov ◽  
Estelle Eke
Keyword(s):  
Carbon Fiber ◽  
Mechanical Engineering ◽  
Low Cost ◽  
Systems Design ◽  
Circuit Board ◽  
System Level ◽  
Linear Feedback ◽  
Phase System ◽  
Phase Lead ◽  
Controls Systems

Teaching classical controls systems design to mechanical engineering students presents unique challenges. While most mechanical engineering programs prepare students to be well-versed in the application of physical principles and modeling aspects of physical systems, implementation of closed loop control and system-level analysis is lagging. It is not uncommon that students report difficulty in conceptualizing even common controls systems terms such as steady-state error and disturbance rejection. Typically, most courses focus on the theoretical analysis and modeling, but students are left asking the questions…How do I implement a phase-lead compensator? …What is a non-minimum phase system? This paper presents an innovative approach in teaching control systems design course based on the use of a low-cost apparatus that has the ability to directly communicate with MATLAB and its Simulink toolbox, allowing students to drag-and-drop controllers and immediately test their effect on the response of the physical plant. The setup consists of a DC micro-motor driving a propeller attached to a carbon-fiber rod. The angular displacement of the rod is measured with an analog potentiometer, which acts as the pivot point for the carbon fiber rod. The miniature circuit board is powered by the USB port of a laptop and communicates to the host computer using the a virtual COM port. MATLAB/Simulink communicates to the board using its serial port read/write blocks to command the motor and detect the deflection angle. This presentation describes a typical semester-long experimental protocol facilitated by the low-cost kit. The kit allows demonstration of classical PID, phase lead and lag controllers, as well as non-linear feedback linearization techniques. Comparison between student gains before and after the introduction of the mechatronic kits are also provided.

A PCB Sensor for Magnetic Materials

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 001323-001342
Author(s):  
Robert N. Dean ◽  
Lauren E. Beckingham
Keyword(s):  
Magnetic Materials ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Complex Impedance ◽  
Corrosion Products ◽  
Physical Contact ◽  
Circuit Board ◽  
Sensor Technology ◽  
Printed Circuit ◽  
Surrounding Environment

Printed circuit board (PCB) sensors are a sensor technology where the layout of traces on a PCB has been optimized so that the traces electromagnetically interact with the surrounding environment. These types of sensors can be manufactured at very low cost using standard commercially available low-cost printed circuit board fabrication. Exposed conductive electrodes on the circuit board are useful for measuring the electrical conductivity of the surrounding environment, and these sensors have been used in applications such as salinity measurement and dissolved ion content measurement of aqueous solutions. Insulated interdigitated electrode sensors are useful for capacitively analyzing the surrounding environment, and these sensors have been used to detect the presence of liquid water and to measure the moisture content of substances in physical contact with the sensor. Additionally, by measuring the complex impedance of the capacitive sensor over a wide frequency range, information concerning the chemical composition of the substance in contact with the sensor can be determined. In addition to conducive and capacitive PCB sensors, the third type of PCB sensor would be an inductive sensor. Although it is challenging to realize 3D coils in PCB technology, planar inductors can be realized in a single Cu layer on a PCB, and insulated from the environment using a cover layer of polymeric solder mask. This type of electrode structure can inductively couple with magnetic materials in close proximity to the sensor. A variety of magnetic materials exist, including iron, nickel and cobalt. Additionally, many alloys of these elements are also magnetic. Of particular interest are corrosion products with magnetic properties, such as iron(III) oxide, Fe3O2, also known as common rust. A thin layer of iron(III) oxide powder deposited on the sensor's active area results in a measureable increase in the sensor's inductance. As such, an inductive PCB sensor could be a low-cost option for detecting the presence of some corrosion products in its operating environment.

A Wireless Hay Bale Status Sensor Suite Using PCB Sensor Technology

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-31
Author(s):  
Jeff D. Craven ◽  
Andrew W. Muscha ◽  
R. Chase Harrison ◽  
Markus A. R. Kreitzer ◽  
Robert N. Dean ◽  
...  
Keyword(s):  
Moisture Content ◽  
Spontaneous Combustion ◽  
Thermophilic Bacteria ◽  
Low Cost ◽  
The United States ◽  
Circuit Board ◽  
Sensor Technology ◽  
Moisture Content Level ◽  
Suitable Environment ◽  
Sensor Suite

The spontaneous combustion of curing hay bales poses serious safety and financial issues to farmers and ranchers across the United States and abroad. The primary cause of this spontaneous combustion is the baling of hay before it has adequately dried and reached a sufficiently low moisture content level. This inadequate drying is primarily due to the farmer allowing the hay to dry in the field after cutting for a given period of time. But unfortunately, this does not always ensure that the hay has sufficiently dried before baling. Spontaneous combustion of hay bales is due to a proliferation of thermophilic bacteria that thrive in a moist and hot environment. If the moisture content of hay is greater than 20%, it provides a suitable environment for mesophilic bacteria, which can heat the hay to as a high as 140°F. Although this is not problematic in and of itself, a 140°F hay bale is a suitable environment for the proliferation of thermophilic bacteria, which can further heat the hay to 170oF. At this temperature, the hay can spontaneous combust, destroying the hay and risking the loss of buildings, equipment, livestock and agricultural workers. To combat this problem, a low-cost, low-power, wireless hay bale status sensor suite has been developed so that the farmer can easily and safely monitor the conditions inside a curing hay bale, to give the farmer time to take action before the bale spontaneously combusts. The battery operated sensor suite has two sensors in contact with the hay inside the bale, a printed circuit board (PCB) moisture content sensor and a discrete temperature sensor. The extremely low-cost of the PCB moisture content sensor is what enables the practicality of the sensor suite. WiFi is used to transmit moisture content and temperature data to the farmer's smartphone when it comes within range. The sensor suite is placed inside the bale at the time of baling. After the bale has fully cured, in four to six weeks, the reusable sensor suite can be removed and used in a new bale.

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