Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

2016 ◽  
Vol 138 (1) ◽  
Author(s):  
Xuchen Zhang ◽  
Xuefei Han ◽  
Thomas E. Sarvey ◽  
Craig E. Green ◽  
Peter A. Kottke ◽  
...  

This paper reports on novel thermal testbeds with embedded micropin-fin heat sinks that were designed and microfabricated in silicon. Two micropin-fin arrays were presented, each with a nominal pin height of 200 μm and pin diameters of 90 μm and 30 μm. Single-phase and two-phase thermal testing of the micropin-fin array heat sinks were performed using de-ionized (DI) water as the coolant. The tested mass flow rate was 0.001 kg/s, and heat flux ranged from 30 W/cm2 to 470 W/cm2. The maximum heat transfer coefficient reached was 60 kW/m2 K. The results obtained from the two testbeds were compared and analyzed, showing that density of the micropin-fins has a significant impact on thermal performance. The convective thermal resistance in the single-phase region was calculated and fitted to an empirical model. The model was then used to explore the tradeoff between the electrical and thermal performance in heat sink design.

Author(s):  
S. S. Bahga ◽  
A. Bhattacharya ◽  
Roop L. Mahajan

This paper investigates the effects of the presence of unheated and heated shrouds on the thermal performance of longitudinal finned heat sinks. A comprehensive numerical study was conducted to determine the impact of the shroud clearance from the tip of the fins and shroud heating. The first part of the study deals with the effects of an unheated shroud on finned heat sinks of different fin height, fin pitch and length in an attempt to cover a wide range of geometry. The numerical results reveal an optimum clearance for maximum heat transfer. For all heat sinks studied the unheated shroud improved the performance by as much as 15% until the shroud was very close when the performance decreased by as much as 10%. In the second part of the paper, the effects of heating of the shroud were considered. In these numerical runs, an isothermal boundary condition was imposed on the shroud. For the heating levels considered, it was found that heating of the shrouds can increase or lower the thermal performance of the heat sink depending on the heat sink geometry and shroud clearance. Finally, the numerical results also revealed a systematic dependence of the normalized Nusselt number on the Rayleigh number for a given heat sink geometry.


2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).


1967 ◽  
Vol 89 (4) ◽  
pp. 577-586 ◽  
Author(s):  
P. Cooper

A model is developed for analytically determining pump inducer performance in both the single-phase and cavitating flow regimes. An equation of state for vaporizing flow is used in an approximate, three-dimensional analysis of the flow field. The method accounts for losses and yields internal distributions of fluid pressure, velocity, and density together with the resulting overall efficiency and pressure rise. The results of calculated performance of two sample inducers are presented. Comparison with recent theory for fluid thermal effects on suction head requirements is made with the aid of a resulting dimensionless vaporization parameter.


2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.


2003 ◽  
Vol 2 (2) ◽  
pp. 65 ◽  
Author(s):  
R. S. Matos ◽  
T. A. Laursen ◽  
J. V. C. Vargas ◽  
A. Bejan

This work presents a three-dimensional (3-D) numerical and experimental geometric optimization study to maximize the total heat transfer rate between a bundle of finned tubes in a given volume and a given external flow both for circular and elliptic arrangements, for general staggered configurations. The optimization procedure started by recognizing the design limited space availability as a fixed volume constraint. The experimental results were obtained for circular and elliptic configurations with a fixed number of tubes (12), starting with an equilateral triangle configuration, which fitted uniformly into the fixed volume with a resulting maximum dimensionless tube-to-tube spacing S/2b = 1.5, where S is the actual spacing and b is the smaller ellipse semi-axis. Several experimental configurations were built by reducing the tube-to-tube spacings, identifying the optimal spacing for maximum heat transfer. Similarly, it was possible to investigate the existence of optima with respect to other two geometric degrees of freedom, i.e., tube eccentricity and fin-to-fin spacing. The results are reported for air as the external fluid in the laminar regime, for 125 and 100 Re 2b , where 2b is the ellipses smaller axis length. Circular and elliptic arrangements with the same flow obstruction cross-sectional area were compared on the basis of maximum total heat transfer. This criterion allows one to quantify the heat transfer gain in the most isolated way possible, by studying arrangements with equivalent total pressure drops independently of the tube cross section shape. This paper reports three-dimensional (3- D) numerical optimization results for finned circular and elliptic tubes arrangements, which are validated by direct comparison with experimental measurements with good agreement. Global optima with respect to tube-to-tube spacing, eccentricity and fin-tofin spacing ( 0.5 e 0.5, S/2b and 06 . 0 f for 125 and 100 Re 2b , respectively) were found and reported in general dimensionless variables. A relative heat transfer gain of up to 19% is observed in the optimal elliptic arrangement, as compared to the optimal circular one. The heat transfer gain, combined with the relative material mass reduction of up to 32% observed in the optimal elliptic arrangement in comparison to the circular one, show the elliptical arrangement has the potential for a considerably better overall performance and lower cost than the traditional circular geometry.


Author(s):  
Ning Zhang ◽  
Pankaj R. Chandra ◽  
Ryan Robledo ◽  
Sree Harsha Balijepalli

Computers are crucial to nearly every endeavor in the modern world. Some computers, particularly those used in military applications, are required to endure extreme conditions with limited maintenance and few parts. Units such as these will hereafter be referred to as “rugged computers.” This series of experiments aims to produce improvements to rugged computers currently in service. Using heat pipes and finned heat sinks on an enclosed box, a computer’s Central Processing Unit (CPU) is able to reject heat without suffering contamination from unforgiving environments. A modular prototype was designed to allow for three distinct cases; a case with no heat pipes and fins, a cast with heat-pipes mounted internally with exterior fins and a case with heat-pipes extended externally with exterior fins. Each case was tested at three different heat loads, with a copper plate heated by a silicone heat strip simulating the heat load generated by a CPU. Each case/load combination was run many times to check for repeatability. The aim of this research is to discover the ideal case for maximum heat transfer from the CPU to the external environment. In addition to the experiments, numerical simulation of these modular prototypes with different designs of heat pipes were conducted in this research. Creating an accurate model for computer simulations will provide validation for the experiments and will prove useful in testing cases not represented by the modular prototype. The flow and heat transfer simulations were conducted using Autodesk CFD. The aim here is to create a model that accurately reflects the experimentally-verified results from the modular prototype’s cases and loads, thereby providing a base from whence further designs can branch off and be simulated with a fair degree of accuracy.


Author(s):  
Tariq Amin Khan ◽  
Nasir Mehdi Gardezi ◽  
Wei Li ◽  
Yang Zhou ◽  
Zahid Ayub

Abstract The performance on the air side flow is often limited due to its lower heat transfer coefficient. This work is related to numerical simulation to study the significance of employing delta winglets in flat finned and wavy finned-tube heat exchangers. For this purpose, three-dimensional simulation data and a multi-objective genetic algorithm are employed. The angle of attack (α) of delta winglets and Reynolds number varied from 15° to 75° and 500 to 1300, respectively. Employing delta winglets has increased the heat transfer per unit temperature and per unit volume (Z) and the fan power per unit core volume (E) for both flat finned and wavy finned-tube heat exchangers. To achieve a maximum heat transfer enhancement and a minimum friction factor, the optimal values of these parameters (Re and α) are calculated using the Pareto optimal strategy. For this purpose, CFD data, a surrogate model (neural network) and a multi-objective optimization genetic algorithm are combined. Results show that the performance of wavy finned-tube heat exchangers is higher than flat-finned tube heat exchangers which signify the importance of delta winglets in the wavy finned-tube heat exchangers.


Author(s):  
Manjinder Singh ◽  
Naresh Varma Datla ◽  
Supreet Singh Bahga ◽  
Sasidhar Kondaraju

Continuous increase in the integration density of microelectronic units necessitates the use of MHPs with enhanced thermal performance. Recently, the use of wettability gradients have been shown to enhance the heat transfer capacity of MHPs. In this paper, we present an optimization of axial wettability gradient to maximize the heat transfer capacity of the MHP. We use an experimentally validated mathematical model and interior point method to optimize the wettability gradient. For our analysis, we consider two cases wherein (i) the mass of working fluid is constrained, (ii) mass of working fluid is a design variable. Compared to MHP with uniform high wettability and filled with a fixed mass of working fluid, optimization of the wettability gradient leads to 65% enhancement in heat transfer capacity. Similar comparisons for MHP filled with variable mass of working fluid shows more than 90% increase in the maximum heat transfer capacity due to optimization of wettability gradient.


Author(s):  
Johnathan S. Coursey ◽  
Jungho Kim ◽  
Kenneth T. Kiger

Spraying a dielectric liquid such as PF-5060 (95% pure FC-72) has been shown to be an effective method of cooling high power electronics. Recent studies have illustrated the potential enhancement of spray cooling by the addition of extended structures, particularly straight fins, to the heated surface. In the current work, these studies are extended to finer fin widths and pitches and longer fin lengths. Four such heat sinks were EDM wire machined. These 1.41 × 1.41 cm2 heat sinks featured a fin pitch of 0.86 mm; a fin width of 0.5 mm; and fin lengths of 0.5 mm, 1 mm, 3 mm, and 5 mm, which substantially increase the total area, allowing more residence time for the incoming liquid to be heated by the wall. The four enhanced surfaces and a flat surface with the same projected area were sprayed with a full cone nozzle using PF-5060 at 96 mL/min, 24°C, and 3.65 atm (38.5 psig). In all cases, the enhanced surfaces improved thermal performance. Longer fins were found to outperform shorter ones in the single-phase regime. Adding fins also resulted in two-phase effects and higher heat transfer at lower wall temperatures than the flat surface. Finally, the two-phase regime appeared to be marked by a balance between added area, changing flow flux, channeling, and added conduction resistance. Although critical heat flux (CHF) was not reached for the finned surfaces, fin lengths between 1–3 mm appeared to be optimum for heat fluxes as high as 131 W/cm2 and the range of conditions studied.


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