Improving High-Speed Nanomaterials Printing With Sub-Process-Decoupled Gravure Printer Design

2017 ◽  
Author(s):  
William Scheideler ◽  
Vivek Subramanian
Keyword(s):  
Thin Film ◽  
Contact Mechanics ◽  
Smart Materials ◽  
High Speed ◽  
Large Scale ◽  
Squeezing Flow ◽  
Print Quality ◽  
Wearable Electronics ◽  
Gravure Printing ◽  
Artifact Formation

Printing technologies are attractive methods for high-throughput additive manufacturing of nanomaterials-based thin film electronics. Roll-to-roll (R2R) compatible techniques such as gravure printing can operate at high-speed (1–10 m/s) and high-resolution (< 10 μm) to drive down manufacturing costs and produce higher quality flexible electronic devices. However, large-scale deployment of printed wireless sensors, flexible displays, and wearable electronics, will require greater understanding of the printing physics of nanomaterial-based inks in order to improve the resolution, reliability, and uniformity of printed systems. In this study, we designed and constructed a custom sheet-fed gravure printer which features registered multilayer printing for nanomaterial exploration and thin film device development. The design allows precise, independent control of the speeds and forces of each of the subprocesses of gravure (ink filling, wiping, and transfer), enabling novel experimental controls for dissecting the printing process fluid mechanics. We use these new capabilities to investigate the primary artifacts which distort printed nanomaterial patterns, such as dragout tails, edge roughness, and pinholes. These artifacts are studied as a function of print parameters such as contact pressure, wiping speed, and transfer speed, by printing silver nanoparticle ink to form continuous features with dimensions in the range of 100 μm to 10 mm. We found that the contact mechanics of the ink transfer process have a strong influence on the formation of dragout artifacts, indicating the presence of a transfer-driven squeezing flow which distorts the trailing edges of features. By engineering the transfer contact mechanics with varying rubber substrate backing stiffness, we found it is also possible to suppress this artifact formation for a particular nanomaterial ink. The improved areal uniformity and print quality achieved using these methods highlight the potential for gravure printing to be a versatile nano-manufacturing tool for patterning a variety of thin film smart materials. We also hope that the open-source printer designs presented here can serve to accelerate the development of high-speed nanomaterial printing.

scholarly journals Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 946
Author(s):  
Zhihao Ren ◽  
Jikai Xu ◽  
Xianhao Le ◽  
Chengkuo Lee
Keyword(s):  
Thin Film ◽  
Wafer Bonding ◽  
Composite Structures ◽  
High Speed ◽  
Silicon On Insulator ◽  
Wearable Electronics ◽  
Next Generation ◽  
Bonding Technology ◽  
Film Transfer ◽  
Bandgap Semiconductors

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.

The Structure and Properties of MoSi2 Thin Film in Mos Process

1980 ◽  
Vol 38 ◽  
pp. 326-327
Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
High Performance ◽  
Large Scale ◽  
Process Development ◽  
Structure And Properties ◽  
Metal Silicides ◽  
High Oxidation ◽  
Important Approach ◽  
High Oxidation Resistance

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.

Do elite soccer players cover longer distance when losing? Differences between attackers and defenders

2020 ◽  
pp. 174795412098227
Author(s):  
Carlos Lago-Peñas ◽  
Anton Kalén ◽  
Miguel Lorenzo-Martinez ◽  
Roberto López-Del Campo ◽  
Ricardo Resta ◽  
...  
Keyword(s):  
New York ◽  
High Speed ◽  
Large Scale ◽  
Tracking System ◽  
Soccer Players ◽  
Running Performance ◽  
Situational Variables ◽  
Total Distance ◽  
Professional Soccer ◽  
Score Line

This study aimed to evaluate the effects playing position, match location (home or away), quality of opposition (strong or weak), effective playing time (total time minus stoppages), and score-line on physical match performance in professional soccer players using a large-scale analysis. A total of 10,739 individual match observations of outfield players competing in the Spanish La Liga during the 2018–2019 season were recorded using a computerized tracking system (TRACAB, Chyronhego, New York, USA). The players were classified into five positions (central defenders, players = 94; external defenders, players = 82; central midfielders, players = 101; external midfielders, players = 72; and forwards, players = 67) and the following match running performance categories were considered: total distance covered, low-speed running (LSR) distance (0–14 km · h−1), medium-speed running (MSR) distance (14–21 km · h−1), high-speed running (HSR) distance (>21 km · h−1), very HSR (VHSR) distance (21–24 km · h−1), sprint distance (>24 km · h−1) Overall, match running performance was highly dependent on situational variables, especially the score-line condition (winning, drawing, losing). Moreover, the score-line affected players running performance differently depending on their playing position. Losing status increased the total distance and the distance covered at MSR, HSR, VHSR and Sprint by defenders, while attacking players showed the opposite trend. These findings may help coaches and managers to better understand the effects of situational variables on physical performance in La Liga and could be used to develop a model for predicting the physical activity profile in competition.

scholarly journals Modeling Fused Filament Fabrication using Artificial Neural Networks

2021 ◽  
Author(s):  
Paul Oehlmann ◽  
Paul Osswald ◽  
Juan Camilo Blanco ◽  
Martin Friedrich ◽  
Dominik Rietzel ◽  
...  
Keyword(s):  
Real Time ◽  
Large Scale ◽  
Cost Effective ◽  
Print Quality ◽  
Ann Model ◽  
Production Environment ◽  
Fused Filament Fabrication ◽  
Artificial Neural ◽  
Using Data ◽  
Artificial Neural Network Ann

AbstractWith industries pushing towards digitalized production, adaption to expectations and increasing requirements for modern applications, has brought additive manufacturing (AM) to the forefront of Industry 4.0. In fact, AM is a main accelerator for digital production with its possibilities in structural design, such as topology optimization, production flexibility, customization, product development, to name a few. Fused Filament Fabrication (FFF) is a widespread and practical tool for rapid prototyping that also demonstrates the importance of AM technologies through its accessibility to the general public by creating cost effective desktop solutions. An increasing integration of systems in an intelligent production environment also enables the generation of large-scale data to be used for process monitoring and process control. Deep learning as a form of artificial intelligence (AI) and more specifically, a method of machine learning (ML) is ideal for handling big data. This study uses a trained artificial neural network (ANN) model as a digital shadow to predict the force within the nozzle of an FFF printer using filament speed and nozzle temperatures as input data. After the ANN model was tested using data from a theoretical model it was implemented to predict the behavior using real-time printer data. For this purpose, an FFF printer was equipped with sensors that collect real time printer data during the printing process. The ANN model reflected the kinematics of melting and flow predicted by models currently available for various speeds of printing. The model allows for a deeper understanding of the influencing process parameters which ultimately results in the determination of the optimum combination of process speed and print quality.

scholarly journals 1.5 °C degrowth scenarios suggest the need for new mitigation pathways

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Lorenz T. Keyßer ◽  
Manfred Lenzen
Keyword(s):  
Technological Change ◽  
High Speed ◽  
Large Scale ◽  
High Energy ◽  
Climate Mitigation ◽  
Intergovernmental Panel ◽  
Economic Output ◽  
Integrated Assessment Modelling ◽  
Negative Emissions ◽  
Energy Emissions

Abstract1.5  °C scenarios reported by the Intergovernmental Panel on Climate Change (IPCC) rely on combinations of controversial negative emissions and unprecedented technological change, while assuming continued growth in gross domestic product (GDP). Thus far, the integrated assessment modelling community and the IPCC have neglected to consider degrowth scenarios, where economic output declines due to stringent climate mitigation. Hence, their potential to avoid reliance on negative emissions and speculative rates of technological change remains unexplored. As a first step to address this gap, this paper compares 1.5  °C degrowth scenarios with IPCC archetype scenarios, using a simplified quantitative representation of the fuel-energy-emissions nexus. Here we find that the degrowth scenarios minimize many key risks for feasibility and sustainability compared to technology-driven pathways, such as the reliance on high energy-GDP decoupling, large-scale carbon dioxide removal and large-scale and high-speed renewable energy transformation. However, substantial challenges remain regarding political feasibility. Nevertheless, degrowth pathways should be thoroughly considered.

scholarly journals Prevention of Mountain Disasters and Maintenance of Residential Area through Real-Time Terrain Rendering

2021 ◽  
Vol 13 (5) ◽  
pp. 2950
Author(s):  
Su-Kyung Sung ◽  
Eun-Seok Lee ◽  
Byeong-Seok Shin
Keyword(s):  
Real Time ◽  
Graphics Processing Units ◽  
High Speed ◽  
Large Scale ◽  
Civil Engineering ◽  
Three Dimensional ◽  
Sampled Data ◽  
Residential Areas ◽  
Terrain Rendering ◽  
Mountain Disasters

Climate change increases the frequency of localized heavy rains and typhoons. As a result, mountain disasters, such as landslides and earthworks, continue to occur, causing damage to roads and residential areas downstream. Moreover, large-scale civil engineering works, including dam construction, cause rapid changes in the terrain, which harm the stability of residential areas. Disasters, such as landslides and earthenware, occur extensively, and there are limitations in the field of investigation; thus, there are many studies being conducted to model terrain geometrically and to observe changes in terrain according to external factors. However, conventional topography methods are expressed in a way that can only be interpreted by people with specialized knowledge. Therefore, there is a lack of consideration for three-dimensional visualization that helps non-experts understand. We need a way to express changes in terrain in real time and to make it intuitive for non-experts to understand. In conventional height-based terrain modeling and simulation, there is a problem in which some of the sampled data are irregularly distorted and do not show the exact terrain shape. The proposed method utilizes a hierarchical vertex cohesion map to correct inaccurately modeled terrain caused by uniform height sampling, and to compensate for geometric errors using Hausdorff distances, while not considering only the elevation difference of the terrain. The mesh reconstruction, which triangulates the three-vertex placed at each location and makes it the smallest unit of 3D model data, can be done at high speed on graphics processing units (GPUs). Our experiments confirm that it is possible to express changes in terrain accurately and quickly compared with existing methods. These functions can improve the sustainability of residential spaces by predicting the damage caused by mountainous disasters or civil engineering works around the city and make it easy for non-experts to understand.

scholarly journals Performance Improvement of ZnSnO Thin-Film Transistors with Low-Temperature Self-Combustion Reaction

Electronics ◽  
2021 ◽  
Vol 10 (9) ◽  
pp. 1099
Author(s):  
Ye-Ji Han ◽  
Se Hyeong Lee ◽  
So-Young Bak ◽  
Tae-Hee Han ◽  
Sangwoo Kim ◽  
...  
Keyword(s):  
Thin Film ◽  
Photoelectron Spectroscopy ◽  
Large Scale ◽  
Low Cost ◽  
Thermal Analyses ◽  
Thin Film Transistor ◽  
Sol Gel ◽  
Annealing Temperatures ◽  
Zinc Tin Oxide ◽  
Thermal Limitation

Conventional sol-gel solutions have received significant attention in thin-film transistor (TFT) manufacturing because of their advantages such as simple processing, large-scale applicability, and low cost. However, conventional sol-gel processed zinc tin oxide (ZTO) TFTs have a thermal limitation in that they require high annealing temperatures of more than 500 °C, which are incompatible with most flexible plastic substrates. In this study, to overcome the thermal limitation of conventional sol-gel processed ZTO TFTs, we demonstrated a ZTO TFT that was fabricated at low annealing temperatures of 350 °C using self-combustion. The optimized device exhibited satisfactory performance, with μsat of 4.72 cm2/V∙s, Vth of −1.28 V, SS of 0.86 V/decade, and ION/OFF of 1.70 × 106 at a low annealing temperature of 350 °C for one hour. To compare a conventional sol-gel processed ZTO TFT with the optimized device, thermogravimetric and differential thermal analyses (TG-DTA) and X-ray photoelectron spectroscopy (XPS) were implemented.

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