scholarly journals The manufacturing of a surface anchor structure for the electroless plating of a three-dimensional antenna integrated with a mobile device case

2020 ◽  
Vol 12 (9) ◽  
pp. 168781402095857
Author(s):  
Woong Ki Jang ◽  
Yoo Su Kang ◽  
Young Ho Seo ◽  
Byeong Hee Kim
Keyword(s):  
Mobile Device ◽  
Bonding Strength ◽  
Laser Processing ◽  
Three Dimensional ◽  
Scanning Speed ◽  
Injection Mold ◽  
Bonding Properties ◽  
Anchor Structure ◽  
Plating Solution ◽  
Recurrence Frequency

This study proposes a method to improve the manufacturing process of a surface anchor structure for the injection molding along with bonding properties of the plating layer for antennas, which can be applied to the Laser Direct Plating (LDP) process for the production of a three-dimensional antenna integrated with a mobile device case. By adjusting parameters such as the output of the laser processing, scanning speed, and pulse recurrence frequency, a micro anchor structure was developed on the surface of the injection mold. The measurement of the surface roughness using a 3D surface profiler showed that the roughness improved by approximately 3.6 times, from 0.96 to 3.24 µm. In addition, the zigzag arrangement of the micro anchor structure was improved by 1.2 times compared to the even arrangement. Furthermore, if the micro anchor structure contained a wall after laser processing, the bonding strength of the plating solution was 69%; with no wall, it was 94% or higher. Thus, the existence of walls resulted in a difference of 1.4 times in the bonding strength. The laser processing improved the bonding strength of the plating solution on the micro anchor structure by approximately 19 times.

scholarly journals Time efficient laser modification of steel surfaces for advanced bonding in hybrid materials

2020 ◽  
Author(s):  
D. Voswinkel ◽  
D. Kloidt ◽  
O. Grydin ◽  
M. Schaper
Keyword(s):  
Adhesive Bonding ◽  
Scanning Speed ◽  
Laser Source ◽  
Lap Shear ◽  
Carbon Fibre Reinforced Polymer ◽  
Bonding Properties ◽  
Fibre Reinforced Polymer ◽  
Yvo4 Laser ◽  
Steel Surfaces ◽  
High Scanning Speed

AbstractLaser surface treatment of metals is one option to improve their properties for adhesive bonding. In this paper, a pulsed YVO4 Laser source with a wavelength of 1064 nm and a maximum power of 25 W was utilized to increase the surface area of the steel HCT490X in order to improve its bonding properties with a carbon fibre reinforced polymer (CFRP). Investigated was the influence of the scanning speed of the laser source on the bonding properties. For this purpose, the steel surfaces were ablated at a scanning speed between 1500 and 4500 mm/s. Afterwards the components were bonded with the adhesive HexBond™ 677. After lap shear tests were carried out on the specimen, the surfaces were inspected using scanning electron microscopy (SEM). The experiments revealed that the bonding quality can be improved with a high scanning speed, even when the surface is not completely ablated.

Runner Balance Design of Soap Box Compounding Cavity Based on Moldflow

2014 ◽  
Vol 941-944 ◽  
pp. 1678-1681
Author(s):  
Hong Bing Wang ◽  
Zhi Rong Li ◽  
Chun Hua Sun ◽  
Yi Ping Zhang
Keyword(s):  
Three Dimensional ◽  
Simulation Software ◽  
Injection Mold ◽  
Balance Design ◽  
Filling Time ◽  
Critical Defect ◽  
Filling Analysis ◽  
Different Dimensions ◽  
Moldflow Simulation

Filling unbalance is a critical defect for injection mould. When the upper and lower covers of soap plastic box are produced by injection mold at the same time, filling unbalance in injection would appear because of the different dimensions of the two parts. For advancing the quality of the soap plastic box, the runner system is optimized with the filling analysis module and flow runner balance module of moldflow simulation software. The three-dimensional geometrical models of the two covers are constructed using Pro/e software. In moldflow the runner balance optimization of the soap box compounding cavity is analysis. The results indicate the optimized cross section of the runners can reduce the flow unbalance ratio from 3.38% to 0.73%, and the filling time and pressure can satisfy the demands. According to the analysis results moldflow is appropriate for runner balance design of the plastic products.

On three-dimensional printing of 17-4 precipitation-hardenable stainless steel with direct metal laser sintering in aircraft structural applications

2021 ◽  
pp. 146442072110448
Author(s):  
Rupinder Singh ◽  
Rishab ◽  
Jashanpreet S Sidhu
Keyword(s):  
Stainless Steel ◽  
Structural Engineering ◽  
Three Dimensional ◽  
Surface Hardness ◽  
Dimensional Accuracy ◽  
Scanning Speed ◽  
Laser Sintering ◽  
Structural Components ◽  
Direct Metal Laser Sintering ◽  
Structural Applications

The martensitic 17-4 precipitation-hardenable stainless steel is one of the commercially established materials for structural engineering applications in aircrafts due to its superior mechanical and corrosion resistance properties. The mechanical processing of this alloy through a conventional manufacturing route is critical from the dimensional accuracy (Δ d) viewpoint for development of innovative structural components such as: slat tracks, wing flap tracks, etc. In past two decades, a number of studies have been reported on challenges being faced while conventional processing of 17-4 precipitation-hardenable stainless steel for maintaining uniform thickness of aircraft structural components. However, hitherto little has been reported on direct metal laser sintering of 17-4 precipitation-hardenable stainless steel for development of innovative functional prototypes with uniform surface hardness (HV), Δ d, and surface roughness ( Ra) in aircraft structural engineering. This paper reports the effect of direct metal laser sintering process parameters on HV, Δ d, and Ra for structural components. The results of study suggest that optimized settings of direct metal laser sintering from multifactor optimization viewpoint are laser power 100 W, scanning speed 1400 mm/s, and layer thickness 0.02 mm. The results have been supported with scanning electron microscopy analysis (for metallurgical changes such as porosity (%), HV, grain size, etc.) and international tolerance grades for ensuring assembly fitment.

scholarly journals Multiscale, thermomechanical topology optimization of self-supporting cellular structures for porous injection molds

2019 ◽  
Vol 25 (9) ◽  
pp. 1482-1492
Author(s):  
Tong Wu ◽  
Andres Tovar
Keyword(s):  
Topology Optimization ◽  
Mechanical Performance ◽  
Mechanical Load ◽  
Design Method ◽  
Three Dimensional ◽  
Optimization Method ◽  
Cellular Structures ◽  
Injection Mold ◽  
Computationally Efficient ◽  
Content Type

Purpose This paper aims to establish a multiscale topology optimization method for the optimal design of non-periodic, self-supporting cellular structures subjected to thermo-mechanical loads. The result is a hierarchically complex design that is thermally efficient, mechanically stable and suitable for additive manufacturing (AM). Design/methodology/approach The proposed method seeks to maximize thermo-mechanical performance at the macroscale in a conceptual design while obtaining maximum shear modulus for each unit cell at the mesoscale. Then, the macroscale performance is re-estimated, and the mesoscale design is updated until the macroscale performance is satisfied. Findings A two-dimensional Messerschmitt Bolkow Bolhm (MBB) beam withstanding thermo-mechanical load is presented to illustrate the proposed design method. Furthermore, the method is implemented to optimize a three-dimensional injection mold, which is successfully prototyped using 420 stainless steel infiltrated with bronze. Originality/value By developing a computationally efficient and manufacturing friendly inverse homogenization approach, the novel multiscale design could generate porous molds which can save up to 30 per cent material compared to their solid counterpart without decreasing thermo-mechanical performance. Practical implications This study is a useful tool for the designer in molding industries to reduce the cost of the injection mold and take full advantage of AM.

scholarly journals Pulsed UV Laser Processing of Carbosilane and Silazane Polymers

Materials ◽  
2019 ◽  
Vol 12 (3) ◽  
pp. 372 ◽  
Author(s):  
Samuel Ligon ◽  
Gurdial Blugan ◽  
Jakob Kuebler
Keyword(s):  
Laser Beam ◽  
Laser Processing ◽  
Scanning Speed ◽  
Inert Atmosphere ◽  
Laser Wavelength ◽  
Uv Laser ◽  
Glass Substrates ◽  
Polymer Precursors ◽  
Laser Systems ◽  
Pre Treatment

Freestanding SiCNO ceramic pieces with sub-mm features were produced by laser crosslinking of carbosilane and silazane polymer precursors followed by pyrolysis in inert atmosphere. Three different pulsed UV laser systems were investigated, and the influence of laser wavelength, operating power and scanning speed were all found to be important. Different photoinitiators were tested for the two lasers operating at 355 nm, while for the 266 nm laser, crosslinking occurred also without photoinitiator. Pre-treatment of glass substrates with fluorinated silanes was found to ease the release of green bodies during solvent development. Polymer crosslinking was observed with all three of the laser systems, as were bubbles, surface charring and in some cases ablation. By focusing the laser beam several millimeters above the surface of the resin, selective polymer crosslinking was observed exclusively.

Effect of Laser Processing Parameters on Microhole Quality of Aluminium Nitride Ceramics

2021 ◽  
Vol 871 ◽  
pp. 277-283
Author(s):  
Chun Yan Yang ◽  
Yun Hao ◽  
Bozhe Wang ◽  
Hai Yuan ◽  
Liu Hui Li
Keyword(s):  
Laser Processing ◽  
Laser Power ◽  
Picosecond Laser ◽  
Scanning Speed ◽  
Processing Parameters ◽  
Recast Layer ◽  
Aluminium Nitride ◽  
Obvious Effect ◽  
Nitride Ceramics

A picosecond laser in spin-cutting mode was used to drill 500μm diameter microholes on 150μm thick aluminium nitride ceramic. The effects of laser processing parameters such as the laser power, scanning speed, and defocus amount on the microhole quality were studied. The results show that as the laser power increases, the inlet and outlet diameters of the holes increase, the taper decreases slightly, and the thickness of the recast layer decreases evidently. The scanning speed has no obvious effect on the diameter and taper of the hole; however, the hole can not be drilled through when the speed is too large. Positive defocus can effectively reduce the taper of the hole. Under 28.5W laser power, 400Hz frequency, 200mm/s scanning speed, and zero defocus amount conditions, high-quality microholes with a taper of 0.85° were obtained.

The Application of Moldflow in Injection Mold Design of Mobile Phone Cover

2011 ◽  
Vol 228-229 ◽  
pp. 542-547
Author(s):  
Wen Jian Zhang ◽  
Qi Zhang
Keyword(s):  
Mobile Phone ◽  
Simulation Analysis ◽  
Three Dimensional ◽  
Element Model ◽  
Mold Design ◽  
Injection Mold ◽  
Three Dimensional Model ◽  
Molding Process ◽  
Injection Mold Design ◽  
Cae Technology

Based the CAE technology, the paper introduced the application of Moldflow Insight in injection mold design of mobile phone cover. First, we must preprocess the finite element model, including importing three-dimensional model, meshing, and process setting. And then, we can use preliminary simulation analysis to determine the number and location of the gate. Finally to filling, cooling, packing and warpage analysis for part which can help us to find the causes from warpage generated. By optimizing the molding process parameters, adjusting the dwell pressure and the dwell time we can get less warpage, which can meet the precision demand of parts, consequently, the result can provide gist for the mold designers to design and for the injection molding technologist to process parameter adjustment.

Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers

2006 ◽  
Vol 970 ◽  
Author(s):  
Ronald J. Gutmann ◽  
J. Jay McMahon ◽  
Jian-Qiang Lu
Keyword(s):  
Bonding Strength ◽  
Adhesive Bonding ◽  
Process Integration ◽  
Three Dimensional ◽  
Adhesive Layer ◽  
Wafer Level ◽  
Technology Platform ◽  
Metal Bonding ◽  
Wafer Level Packaging ◽  
Metal Metal

ABSTRACTA monolithic, wafer-level three-dimensional (3D) technology platform is described that is compatible with next-generation wafer level packaging (WLP) processes. The platform combines the advantages of both (1) high bonding strength and adaptability to IC wafer topography variations with spin-on dielectric adhesive bonding and (2) process integration and via-area advantages of metal-metal bonding. A copper-benzocyclobutene (Cu-BCB) process is described that incorporates single-level damascene-patterned Cu vias with partially-cured BCB as the bonding adhesive layer. A demonstration vehicle consisting of a two-wafer stack of 2-4 μm diameter vias has shown the bondability of both Cu-to-Cu and BCB-to-BCB. Planarization conditions to achieve BCB-BCB bonding with low-resistance Cu-Cu contacts have been examined, with wafer-scale planarization requirements compared to other 3D platforms. Concerns about stress induced at the tantalum (Ta) liner-to-BCB interface resulting in partial delamination are discussed. While across-wafer uniformity has not been demonstrated, the viability of this WLP-compatible 3D platform has been shown.

Experimental Study on Geometric Precision of Microholes Drilling by Picosecond Laser

2019 ◽  
Author(s):  
Zhanfei Zhang ◽  
Wenhu Wang ◽  
Ruisong Jiang ◽  
Chengcheng Jin ◽  
Xiaoxiang Zhu ◽  
...  
Keyword(s):  
Film Cooling ◽  
Three Dimensional ◽  
Great Influence ◽  
Picosecond Laser ◽  
Scanning Speed ◽  
Cooling Efficiency ◽  
Measuring Instrument ◽  
Geometric Precision ◽  
Cooling Hole ◽  
Film Cooling Holes

Abstract The geometric precision of the film cooling hole has a great influence on the cooling efficiency and fatigue life of the turbine blade. In the paper, the processing of film cooling holes on DD6 single crystal superalloy by picosecond laser is investigated. The pulse laser at pulse duration of 2.1ps, the wavelength of 1030 nm and the repetition frequency of 75 kHz are selected to study the pulse energy, scanning speed, defocus and scanning width on the geometric precision of the film cooling hole. After drilling, the three-dimensional coordinates of the entrance and exit plane of the film cooling holes are obtained by using the three-dimensional surface measuring instrument. The diameter, roundness and taper of the film cooling holes are calculated by extracting and processing the coordinate points of the contour around the microholes. The experimental results show that defocusing has the greatest influence on the taper and roundness of film cooling holes. Negative defocusing can produce severe plasma shielding, which makes the exit roundness and taper larger. With larger pulses, positive defocusing and larger scanning width, smaller roundness and taper can be produced.

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