scholarly journals Implementation and Experimental Verification of Smart Junction Box for Low-Voltage Automotive Electronics in Electric Vehicles

2020 ◽  
Vol 10 (7) ◽  
pp. 2214
Author(s):  
Sang Wook Lee ◽  
Soo-Whang Baek
Keyword(s):  
Electric Vehicles ◽  
Printed Circuit Board ◽  
Pulse Width Modulation ◽  
Low Voltage ◽  
Short Circuit ◽  
Circuit Board ◽  
Area Network ◽  
Automotive Electronics ◽  
Overload Protection ◽  
The Impact

In this study, we designed and implemented a smart junction box (SJB) that was optimized for supplying power to low-voltage headlights (13.5 V) in electric vehicles. The design incorporated a number of automotive semiconductor devices, and components were placed in a high-density arrangement to reduce the overall size of the final design. The heat generated by the SJB was efficiently managed to mount an Intelligent Power Switch (IPS), which was used to power the headlights onto the printed circuit board (PCB) to minimize the impact on other components. The SJB was designed to provide power to the headlights via pulse width modulation to extend their lifetime. In addition, overload protection and fail/safe functions were implemented in the software to improve the stability of the system, and a controller area network (CAN) bus was provided for communications with various components in the SJB as well as with external controllers. The performance of the SJB was validated via a load operation test to assess the short circuit and overload protection functions, and the output duty cycle was evaluated across a range of input voltages to ensure proper operation. Based on our results, the power supplied to the headlights was found to be uniform and stable.

scholarly journals Optimized Strategic Planning of Future Norwegian Low-Voltage Networks with a Genetic Algorithm Applying Empirical Electric Vehicle Charging Data

Electricity ◽  
2021 ◽  
Vol 2 (1) ◽  
pp. 91-109
Author(s):  
Julian Wruk ◽  
Kevin Cibis ◽  
Matthias Resch ◽  
Hanne Sæle ◽  
Markus Zdrallek
Keyword(s):  
Genetic Algorithm ◽  
Electric Vehicle ◽  
Electric Vehicles ◽  
Low Voltage ◽  
Network Planning ◽  
Voltage Regulation ◽  
Electric Vehicle Charging ◽  
Vehicle Charging ◽  
The Impact

This article outlines methods to facilitate the assessment of the impact of electric vehicle charging on distribution networks at planning stage and applies them to a case study. As network planning is becoming a more complex task, an approach to automated network planning that yields the optimal reinforcement strategy is outlined. Different reinforcement measures are weighted against each other in terms of technical feasibility and costs by applying a genetic algorithm. Traditional reinforcements as well as novel solutions including voltage regulation are considered. To account for electric vehicle charging, a method to determine the uptake in equivalent load is presented. For this, measured data of households and statistical data of electric vehicles are combined in a stochastic analysis to determine the simultaneity factors of household load including electric vehicle charging. The developed methods are applied to an exemplary case study with Norwegian low-voltage networks. Different penetration rates of electric vehicles on a development path until 2040 are considered.

scholarly journals A Self-Powered Nanogenerator for the Electrical Protection of Integrated Circuits from Trace Amounts of Liquid

2019 ◽  
Vol 12 (1) ◽  
Author(s):  
Zhuang Hui ◽  
Ming Xiao ◽  
Daozhi Shen ◽  
Jiayun Feng ◽  
Peng Peng ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Printed Circuit Board ◽  
Short Circuit ◽  
High Sensitivity ◽  
Short Circuit Current ◽  
Fast Response ◽  
Open Circuit ◽  
Circuit Board ◽  
Self Powered

Abstract With the increase in the use of electronic devices in many different environments, a need has arisen for an easily implemented method for the rapid, sensitive detection of liquids in the vicinity of electronic components. In this work, a high-performance power generator that combines carbon nanoparticles and TiO2 nanowires has been fabricated by sequential electrophoretic deposition (EPD). The open-circuit voltage and short-circuit current of a single generator are found to exceed 0.7 V and 100 μA when 6 μL of water was applied. The generator is also found to have a stable and reproducible response to other liquids. An output voltage of 0.3 V was obtained after 244, 876, 931, and 184 μs, on exposure of the generator to 6 μL of water, ethanol, acetone, and methanol, respectively. The fast response time and high sensitivity to liquids show that the device has great potential for the detection of small quantities of liquid. In addition, the simple easily implemented sequential EPD method ensures the high mechanical strength of the device. This compact, reliable device provides a new method for the sensitive, rapid detection of extraneous liquids before they can impact the performance of electronic circuits, particularly those on printed circuit board.

Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test

2009 ◽  
Vol 419-420 ◽  
pp. 37-40
Author(s):  
Shiuh Chuan Her ◽  
Shien Chin Lan ◽  
Chun Yen Liu ◽  
Bo Ren Yao
Keyword(s):  
Finite Element ◽  
Experimental Measurement ◽  
Test Specimen ◽  
Printed Circuit Board ◽  
Drop Impact ◽  
Simulation Technique ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit ◽  
The Impact

Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique. The test specimen of a printed circuit board is clamped at two edges on a test fixture and mounted on the drop test machine platform. The drop table is raised at the height of 50mm and dropped with free fall to impinge four half-spheres of Teflon. One accelerometer is mounted on the center of the specimen to measure the impact pulse. The commercial finite element software ANSYS/LS-DYNA is applied to compute the impact acceleration and dynamic strain on the test specimen during the drop impact. The finite element results are compared to the experimental measurement of acceleration with good correlation between simulation and drop testing. With the accurate simulation technique, one is capable of predicting the impact response and characterizing the failure mode prior to real reliability test.

A high-power PCCM LED driver based on GaN eHEMT with hybrid dimming modes

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xixian Lin ◽  
Yuming Zhang ◽  
Yimeng Zhang ◽  
Guangjian Rong
Keyword(s):  
Printed Circuit Board ◽  
Pulse Width Modulation ◽  
Circuit Board ◽  
Switching Frequency ◽  
Led Driver ◽  
Power Circuit ◽  
Content Type ◽  
Wide Range ◽  
Circuit Function ◽  
Pwm Dimming

Purpose The purpose of this study is to design a more flexible and larger range of the dimming circuit that achieves the independence of multiple LED strings drive and can time-multiplex the power circuit. Design/methodology/approach The state-space method is used to model the BUCK circuit working in Pseudo continuous conduction mode, analyze the frequency characteristics of the system transfer function and design the compensation network. Build a simulation platform on the Orcad PSPICE platform and verify the function of the designed circuit through the simulation results. Use Altium Designer 16 to draw the printed circuit board, complete the welding of various components and use the oscilloscope, direct current (DC) power supply and a signal generator to verify the circuit function. Findings A prototype of the proposed LED driver is fabricated and tested. The measurement results show that the switching frequency can be increased to 1 MHz, Power inductance is 2.2 µH, which is smaller than current research. The dimming ratio can be set from 10% to 100%. The proposed LED driver can output more than 48 W and achieve a peak conversion efficiency of 91%. Originality/value The proposed LED driver adopts pulse width modulation (PWM) dimming at a lower dimming ratio and adopts DC dimming at a larger dimming ratio to realize switching PWM dimming to analog dimming. The control strategy can be more precise and have a wide range of dimming.

scholarly journals Active Control of Regenerative Brake for Electric Vehicles

Actuators ◽  
2018 ◽  
Vol 7 (4) ◽  
pp. 84 ◽  
Author(s):  
Chun-Liang Lin ◽  
Hao-Che Hung ◽  
Jia-Cheng Li
Keyword(s):  
Control System ◽  
Electric Vehicles ◽  
Pulse Width Modulation ◽  
Short Circuit ◽  
Stopping Time ◽  
Motor Speed ◽  
Short Period ◽  
Braking Torque ◽  
Braking Control ◽  
A Charge

Looking at new trends in global policies, electric vehicles (EVs) are expected to increasingly replace gasoline vehicles in the near future. For current electric vehicles, the motor current driving system and the braking control system are two independent issues with separate design. If a self-induced back-EMF voltage from the motor is a short circuit, then short-circuiting the motor will result in braking. The higher the speed of the motor, the stronger the braking effect. However, the effect is deficient quickly once the motor speed drops quickly. Traditional kinetic brake (i.e., in the short circuit is replaced by a resistor) and dynamic brake (the short circuit brake is replaced by a capacitor) rely on the back EMF alone to generate braking toque. The braking torque generated is usually not enough to effectively stop a rotating motor in a short period of time. In this research task, an integrated driving and braking control system is considered for EVs with an active regenerative braking control system where back electromagnetic field (EMF), controlled by the pulse-width modulation (PWM) technique, is used to charge a pump capacitor. The capacitor is used as an extra energy source cascaded with the battery as a charge pump. This is used to boost braking torque to stop the rotating motor in an efficient way while braking. Experiments are conducted to verify the proposed design. Compared to the traditional kinetic brake and dynamic brake, the proposed active regenerative control system shows better braking performance in terms of stopping time and stopping distance.

Research on Liberation Mechanism of the Impact Crushing Waste Printed Circuit Board

2010 ◽  
Vol 113-116 ◽  
pp. 730-734 ◽  
Author(s):  
Chen Long Duan ◽  
Yue Min Zhao ◽  
Jing Feng He ◽  
Nian Xin Zhou
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Distribution Model ◽  
Evaluation Indexes ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Waste Printed Circuit Board ◽  
Impact Crushing ◽  
The Impact

The reutilization of waste Printed Circuit Boards (PCB) is a focused topic in the field of environment protection and resource recycling, and the crushing is the crucial process for recycling waste PCB. A hamper impacting crusher was used to achieve metals crushing liberation from non-metals, the liberation mechanism of PCB can be explained by dispersion liberation accompanied disengaging liberation. The Rosin-Rammler distribution model of crushed PCB particle was put forward. The evaluation indexes show that Rosin-Rammler function can accurately describe size distribution of PCB particles because the convergence property R2 is 0.99694 and fitting error E is 4.80658. The selective crushing is appearance with metals concentrated in coarser fraction and non-metals in finer size during comminution processing. The impact crushing is an effective method to metals liberation of PCB particles.

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
Hung-Jen Chang ◽  
Chau-Jie Zhan ◽  
Tao-Chih Chang ◽  
Jung-Hua Chou
Keyword(s):  
Printed Circuit Board ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit Board Assembly ◽  
Printed Circuit ◽  
Plastic Ball ◽  
Circuit Board Assembly ◽  
Halogen Free ◽  
Board Level ◽  
The Impact

In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn4.0Ag0.5Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn1.0Ag0.5Cu solder paste on the Cu pad surfaces of either organic solderable preservative (OSP) or electroless nickel immersion gold (ENIG). The assembly was tested for the effect of the formation extent of Ag3Sn intermetallic compound. Afterward a board-level pulse-controlled drop test was conducted on the as-reflowed assemblies according to the JESD22-B110 and JESD22-B111 standards, the impact performance of various surface finished halogen-free printed circuit board assembly was evaluated. The test results showed that most of the fractures occurred around the pad on the test board first. Then cracks propagated across the outer build-up layer. Finally, the inner copper trace was fractured due to the propagated cracks, resulting in the failure of the PCB side. Interfacial stresses numerically obtained by the transient stress responses supported the test observation as the simulated initial crack position was the same as that observed.

Nonlinear Response of a Printed Circuit Board in Shock

2009 ◽  
Author(s):  
M. Vujosevic ◽  
P. Raghavan ◽  
G. Ramanathan ◽  
W. Hezeltine ◽  
K. Blue
Keyword(s):  
Printed Circuit Board ◽  
Transfer Functions ◽  
Numerical Approach ◽  
Circuit Board ◽  
Special Importance ◽  
Strain Measurements ◽  
Printed Circuit ◽  
Numerical Finite Element ◽  
Nonlinear Deformations ◽  
The Impact

This work focuses on deformation mechanisms taking place in a Printed Circuit Board (PCB) exposed to high impact shock. A combined experimental, theoretical, and numerical approach has been applied to address both the nature of the observed deformation and its modeling and test metrology implications. Experimental evidence overwhelmingly indicates that a PCB in both test and system applications undergoes nonlinear deformations. Geometric nonlinearity of board response is attributed to the elevated in-plane (membrane) stresses that develop when a drop height and/or inertia forces are significant. The impact of these stresses on deformations (board strain) was quantified using a specially designed test. Membrane stresses were also accounted for in a numerical (Finite Element Method) model developed and carefully validated in the course of this study. The model shows a very good agreement with test data. The nonlinearity of PCB deformation in shock, i.e. the fact that both bending moments and in-plane forces are present in the board has important implications on test metrology development and on correlation between the measured board strain and stresses in interconnects of surface mounted components. Of special importance is the impact that nonlinearity can have on development of transfer functions between strain measurements on system boards and strain measurements on test boards, which is also addressed in the paper.

scholarly journals Dynamic and Static Calibration of Ultra-Low-Voltage, Digital-Based Operational Transconductance Amplifiers

Electronics ◽  
2020 ◽  
Vol 9 (6) ◽  
pp. 983 ◽  
Author(s):  
Pedro Toledo ◽  
Paolo Crovetti ◽  
Hamilton Klimach ◽  
Sergio Bampi
Keyword(s):  
Pulse Width Modulation ◽  
Low Voltage ◽  
Process Variations ◽  
Pulse Modulation ◽  
Silicon Area ◽  
Operational Transconductance Amplifiers ◽  
Static Calibration ◽  
Digital Pulse ◽  
Transconductance Amplifiers ◽  
The Impact

The calibration of the effects of process variations and device mismatch in Ultra Low Voltage (ULV) Digital-Based Operational Transconductance Amplifiers (DB-OTAs) is addressed in this paper. For this purpose, two dynamic calibration techniques, intended to dynamically vary the effective strength of critical gates by different modulation strategies, i.e., Digital Pulse Width Modulation (DPWM) and Dyadic Digital Pulse Modulation (DDPM), are explored and compared to classic static calibration. The effectiveness of the calibration approaches as a mean to recover acceptable performance in non-functional samples is verified by Monte-Carlo (MC) post-layout simulations performed on a 300 mV power supply, nW-power DB-OTA in 180 nm CMOS. Based on the same MC post-layout simulations, the impact of each calibration strategy on silicon area, power consumption, and OTA performance is discussed.

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