Study on Signal Integrity Simulation for High Speed Serial Rapid IO

2013 ◽  
Vol 340 ◽  
pp. 881-886 ◽  
Author(s):  
Hong Xu Jiang ◽  
Xiao Hong Zhang ◽  
Wei Zhao ◽  
Jin Yuan Lu

With the increases of signal transmission rate in digital systems, the signal integrity becomes increasingly important in high-speed circuit design. During the hardware design of high-speed serial Rapid IO, signal integrity simulation of 5Gbps high-speed serial bus had been carried out by using Channel Analysis tools. Reliable data was formed by effectively analysis and evaluation of pre-simulation, the signal quality of high-speed serial Rapid IO was verified by post-simulation. The non-ideal design parameters were optimized by referring to the effective data obtained in pre-simulation. Signal quality has been greatly improved by parameters optimization. Signal integrity simulation analysis and verification of serial Rapid IO provides strong support for the design and significantly improves the efficiency of hardware design.

2021 ◽  
Vol 16 (5) ◽  
pp. 773-780
Author(s):  
Bing-Jie Li ◽  
Zhen-Song Li ◽  
Yan-Ping Zhao ◽  
Zheng-Wang Li ◽  
Min Miao

The signal integrity (SI) analysis of a high-speed signal interconnect channel composed of through silicon vias (TSVs) and horizontal re-distribution layers (RDL) is carried out, and the problems of SI, such as transmission loss, crosstalk and coupling effect in the transmission channel, are analyzed and studied. These signal integrity issues are considered in this paper, a signal interconnect channel model is proposed and the equivalent circuit model is deduced as well. Compared with the traditional one, this interconnect channel model has better performance in SI. Further sweep frequency analysis is carried out for different material parameters to achieve signal transmission performance optimization aimed at this model. Test samples of the proposed signal interconnect channel model are designed and fabricated according to the process index, and measured to verify the actual transmission performance. The design and optimization rule of high-speed signal interconnect channel are summarized which proved that the proposed structure has more advantages in signal transmission performance, and has important guiding significance for practical design.


2012 ◽  
Vol 190-191 ◽  
pp. 962-967
Author(s):  
Jun Yang ◽  
Hong Wei Ding ◽  
Ga Zhao ◽  
Ping Ping Shu

This paper designed an OFDM baseband signal transmission system, which adopted CORDIC algorithm, pipeline organization and high-speed floating-point butterfly unit to complete the customized FFT Processor, and the modulation of the signal was realized by enhancing modulation mode (64-QAM) in the adaptive modulation mode. Meanwhile, due to FPGA technology is reconfigurable and parallel, the signal has a higher transmission rate. The system used FPGA resources reasonably and integrated highly, simplifying the complexity of the system; eventually it was adapted to the EP2C35F672C6 chip of Altera, and can be normally operated in the clock frequency of 100 MHz; At the same time, this system the system has high flexibility and generality, simple structure, and good clutter suppression, so it has a certain application prospects.


2013 ◽  
Vol 760-762 ◽  
pp. 320-324
Author(s):  
Shi Lei Zhou ◽  
Ya Lin Guan ◽  
Xin Kun Tang

High-speed signal connector has become a key factor of the signal transmission quality in telecommunications and data communications system. Signal integrity of connector is an inevitable problem. This paper based on the theory of differential transmission lines and Multimode S-Parameters, analyzed the USB3.0 connector signal integrity. And use 3D simulation software CST to build model and analyze the relationship of signal integrity and connectors geometry.


2019 ◽  
Vol 2019 (02) ◽  
pp. 107-116
Author(s):  
Karrupusamy P.

As the telecommunication services totally relies on the optical fiber for extending communications, it necessary that the optical communication system be capable of handling high speed, multiple channels and long haul signal transmission. recently the emergence of the optical coherent 100 GB/s and the digital signal processing has made possible the perfect signal transmission even for the MIMO (multiple input multiple output system) as they are well reformed to permit multiple wireless signal that holds different carrier frequencies. So the optical fiber system has become prominent among the applications like, large universities, banks and other private networks. However the speed in the transmission of the multiple wireless signals through single cable experiences performance issues in terms of speed, so the proposed method utilizes the 60 GHz, radio over fiber MIMO with effective spectrum allocation and the return zero differential phase shift keying to improve the communication speed and suppress the crosstalk respectively. The proposed system enriches the seamless communication with the QPSK-OFDM MIMO channels achieving 85 % in the data transmission rate, reducing the error correction rate to 5%.


2012 ◽  
Vol 195-196 ◽  
pp. 1153-1157
Author(s):  
Liang Qi Gui ◽  
Cao Yang ◽  
Jia He ◽  
Xiao Ping Gao ◽  
Ke Chen ◽  
...  

Grounded vias modeling is used to analyze the impact on the high speed PCB EMC and SI issues in three aspects, including theoretical analysis, simulator modeling and practical PCB test. In this paper, we discuss the full-wave complex scattering parameter model and full-wave model. Then the full-wave analysis model of the through holes for model validation and comparison are established, by using numerical simulation software HFSS and CST Microwave Studio. The initial test results on the practical PCB show that the analyzed method is reasonable and accurate. And optimized design parameters can ensure the continuity of the impedance of vias, and introduce lesser return loss and insertion loss. It is shown that the signal transmission performance is greatly improved with the grounded via added, which is helpful in specifying the manufacturing tolerance of via designs.


2013 ◽  
Vol 385-386 ◽  
pp. 163-167
Author(s):  
Long Miao Chen ◽  
Lin Fang Qian ◽  
Rui Xue Zhao

To prolong the life of cartridge retaining pawl and link stopper in a gun cartridge retaining Mechanism, three compression springs stiffness are reduced via design study and optimization design based on dynamic analysis. Presenting the load of shell on a typical stage while entering-bore, differential equations of motion in this mechanism are established. With translational velocity of shell as the design variable, a design research and simulation analysis are made. And the relationship between shell velocity and proper shell-feed is acquired. An evaluation function is built using springs stiffness with preference-selection. With this evaluation function as the optimum objective, spring stiffness as design variables, and proper shell-feed as constraint condition, the minimum of three spring stiffness is obtained after calculation. The results indicate that compared with the original design parameters optimization results, are significantly improved with the stiffness decreased separately by 20.27%, 11.99% and 6.86%.


2012 ◽  
Vol 220-223 ◽  
pp. 2297-2300 ◽  
Author(s):  
Ling Feng Shi ◽  
Cheng Shan Cai ◽  
Yuan Ming Xiao ◽  
Li Ye Cheng ◽  
Chen Meng ◽  
...  

With the electronic toward miniaturization and multifunctional development, such as System-in-Package (SIP), Package-on-Package (POP), these packages have been widely used. Signal speeds increase and then require that signal has a good transmission quality. Therefore the design of signal integrity should take into account these issues from the beginning design. In this paper, a model about the wire bonding transmission problem between the upper and lower levels of chip is proposed. The simulation results are shown at the different height and radius of the equivalent model. Meanwhile, researching in different cases, noise interference source makes the influence on signal quality. Finally, by adding the signal return path, signal integrity is achieved well by the eye diagram analysis.


2012 ◽  
Vol 225 ◽  
pp. 492-496
Author(s):  
Syahrim Azhan bin Ibrahim ◽  
Sharizal Fadlie Sabri ◽  
Nor'Asnilawati Salleh

Malaysia had in the past sent two remote sensing satellites to orbit by collaborating with foreign space companies to build homegrown capacities for space technology development. At the educational institutions, a pico-satellite development program would be an ideal first step to establish such capacity as students could gain the experience and know-how through the complete cycle of designing, building and testing a satellite. As it is now, some of their overseas counterparts have already succeeded in running CubeSat programs due to strong support from kit manufacturers and their national space agencies. However, the cost to purchase such kits could be discouraging and National Space Agency (ANGKASA) recognises the needs to initiate some designs that could be used or referred to for further development or expansion. In this paper, a hardware design of On-Board Data Handling (OBDH) board using PIC Microcontroller is presented. OBDH is a main subsystem which controls all subsystems in the satellite. It provides a series of important services like command, telemetry, data communication, data acquisition, process, storage and management. The PIC Microcontroller made by Microchip Corporation is chosen as it is widely used by the industry and academia in Malaysia. The 16-bit PIC24 microcontroller has been recognized as a suitable part due to its performance, memory, peripherals, cost effective solutions as well as availability. The method used in designing the OBDH in this pico-satellite is first based on a main mission to investigate ionospheric effect on GPS signal transmission. Other considerations taken are that the parts used should be of commercial off the shelf product and having its own development board for ease of testing. The expected result would be the successful arrangement of all required parts in limited pico-satellite’s size and the accomplishment in achieving the satellite’s missions through simulation.


2020 ◽  
Vol 15 ◽  
Author(s):  
Fei Sun ◽  
Guohe Li ◽  
Qi Zhang ◽  
Meng Liu

: Cr12MoV hardened steel is widely used in the manufacturing of stamping die because of its high strength, high hardness, and good wear resistance. As a kind of mainstream cutting technology, high-speed machining has been applied in the machining of Cr12MoV hardened steel. Based on the review of a large number of literature, the development of high-speed machining of Cr12MoV hardened steel was summarized, including the research status of the saw-tooth chip, cutting force, cutting temperature, tool wear, machined surface quality, and parameters optimization. The problems that exist in the current research were discussed and the directions of future research were pointed out. It can promote the development of high-speed machining of Cr12MoV hardened steel.


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