Influence of NiCoCrAlY and Diffusion Aluminide Coating on Oxidation and Hot Corrosion of a Ni-Based Superalloy

2007 ◽  
Vol 546-549 ◽  
pp. 1739-1746 ◽  
Author(s):  
Dong Bai Xie ◽  
Sheng Long Zhu ◽  
Wen Jun Dai ◽  
Fu Hui Wang
Keyword(s):  
Vapor Deposition ◽  
Hot Corrosion ◽  
Oxidation Rate ◽  
Physical Vapor Deposition ◽  
Cast Alloy ◽  
Aluminide Coating ◽  
Chemical Vapor ◽  
Isothermal Oxidation ◽  
Flame Spraying ◽  
And Diffusion

The most common metallic coatings used in today’s gas turbine engines are MCrAlX (where M is Ni and/or Co and X is one or more reactive elements such as Y, Hf, etc.) type overlay coatings. However, overlay coating techniques (plasma and flame spraying or physical vapor deposition) are line-of-site processes, and so, it is possible not to deposit coating on some surface of the complex turbine components. The diffusion aluminide coatings can solve this problem. A NiCoCrAlY and diffusion aluminide coating were prepared on K38G cast alloy by multi-arc ion plating and low pressure chemical vapor deposition (LP-CVD) techniques, respectively. The isothermal oxidation behavior of K38G and the coatings was studied in air at 900 and 1000 oC. Their hot corrosion behaviors in the presence of 75 wt.% Na2SO4+K2SO4 and 75wt.%Na2SO4+NaCl film at 900oC were studied. The results showed that the two kinds coatings exhibited low oxidation rate at 900 and 1000oC and the presence of salt accelerated the oxidation rate. The NiCoCrAlY coating showed the better hot corrosion resistance than the aluminide coating.

scholarly journals Application of a Novel CVD TiN Coating on a Biomedical Co–Cr Alloy: An Evaluation of Coating Layer and Substrate Characteristics

Materials ◽  
2020 ◽  
Vol 13 (5) ◽  
pp. 1145 ◽  
Author(s):  
Si Hoon Song ◽  
Bong Ki Min ◽  
Min-Ho Hong ◽  
Tae-Yub Kwon
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Cast Alloy ◽  
Chemical Vapor ◽  
Scratch Test ◽  
Face Centered Cubic ◽  
Cobalt Chromium ◽  
Tin Coating ◽  
Promising Alternative ◽  
Coated Alloy

Titanium nitride (TiN) was deposited on the surface of a cobalt–chromium (Co–Cr) alloy by a hot-wall type chemical vapor deposition (CVD) reactor at 850 °C, and the coating characteristics were compared with those of a physical vapor deposition (PVD) TiN coating deposited on the same alloy at 450 °C. Neither coating showed any reactions at the interface. The face-centered cubic (fcc) structure of the alloy was changed into a hexagonal close-packed (hcp) phase, and recrystallization occurred over at 10 μm of depth from the surface after CVD coating. Characteristic precipitates were also generated incrementally depending on the depth, unlike the precipitates in the matrix of the as-cast alloy. On the other hand, the microstructure and phase of the PVD-coated alloy did not change. Depth-dependent nano-hardness measurements showed a greater increase in hardness in the recrystallization zone of the CVD-coated alloy than in the bulk center of the alloy. The CVD coating showed superior adhesion to the PVD coating in the progressive scratch test. The as-cast, PVD-coated, and CVD-coated alloys all showed negative cytotoxicity. Within the limitations of this study, CVD TiN coating to biomedical Co–Cr alloy may be considered a promising alternative to PVD technique.

scholarly journals Noble Metals for Modern Implant Materials: MOCVD of Film Structures and Cytotoxical, Antibacterial, and Histological Studies

Biomedicines ◽  
2021 ◽  
Vol 9 (8) ◽  
pp. 851
Author(s):  
Svetlana I. Dorovskikh ◽  
Evgeniia S. Vikulova ◽  
Elena V. Chepeleva ◽  
Maria B. Vasilieva ◽  
Dmitriy A. Nasimov ◽  
...  
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Noble Metals ◽  
Mononuclear Cells ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Ti Alloy ◽  
Peripheral Blood Mononuclear ◽  
Histological Studies

This work is aimed at developing the modification of the surface of medical implants with film materials based on noble metals in order to improve their biological characteristics. Gas-phase transportation methods were proposed to obtain such materials. To determine the effect of the material of the bottom layer of heterometallic structures, Ir, Pt, and PtIr coatings with a thickness of 1.4–1.5 μm were deposited by metal–organic chemical vapor deposition (MOCVD) on Ti6Al4V alloy discs. Two types of antibacterial components, namely, gold nanoparticles (AuNPs) and discontinuous Ag coatings, were deposited on the surface of these coatings. AuNPs (11–14 nm) were deposited by a pulsed MOCVD method, while Ag films (35–40 nm in thickness) were obtained by physical vapor deposition (PVD). The cytotoxic (24 h and 48 h, toward peripheral blood mononuclear cells (PBMCs)) and antibacterial (24 h) properties of monophase (Ag, Ir, Pt, and PtIr) and heterophase (Ag/Pt, Ag/Ir, Ag/PtIr, Au/Pt, Au/Ir, and Au/PtIr) film materials deposited on Ti-alloy samples were studied in vitro and compared with those of uncoated Ti-alloy samples. Studies of the cytokine production by PBMCs in response to incubation of the samples for 24 and 48 h and histological studies at 1 and 3 months after subcutaneous implantation in rats were also performed. Despite the comparable thickness of the fibrous capsule after 3 months, a faster completion of the active phase of encapsulation was observed for the coated implants compared to the Ti alloy analogs. For the Ag-containing samples, growth inhibition of S. epidermidis, S. aureus, Str. pyogenes, P. aeruginosa, and Ent. faecium was observed.

scholarly journals Characterization of Thin Chromium Coatings Produced by PVD Sputtering for Optical Applications

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 215
Author(s):  
Andreia A. Ferreira ◽  
Francisco J. G. Silva ◽  
Arnaldo G. Pinto ◽  
Vitor F. C. Sousa
Keyword(s):  
Automotive Industry ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Early Stage ◽  
Chemical Vapor ◽  
Experimental Tests ◽  
Scratch Test ◽  
Industrial Sectors ◽  
Deposition Processes ◽  
Optical Applications

PVD (physical vapor deposition) and CVD (chemical vapor deposition) have gained greater significance in the last two decades with the mandatory shift from electrodeposition processes to clean deposition processes due to environmental, public safety, and health concerns. Due to the frequent use of coatings in several industrial sectors, the importance of studying the chromium coating processes through PVD–sputtering can be realized, investing in a real alternative to electroplated hexavalent chromium, usually denominated by chromium 6, regularly applied in electrodeposition processes of optical products in the automotive industry. At an early stage, experimental tests were carried out to understand which parameters are most suitable for obtaining chromium coatings with optical properties. To study the coating in a broad way, thickness and roughness analysis of the coatings obtained using SEM and AFM, adhesion analyzes with the scratch-test and transmittance by spectrophotometry were carried out. It was possible to determine that the roughness and transmittance decreased with the increase in the number of layers, the thickness of the coating increased linearly, and the adhesion and resistance to climatic tests remained positive throughout the study. Thus, this study allows for the understanding that thin multilayered Cr coatings can be applied successfully to polymeric substrates regarding optical applications in the automotive industry.

scholarly journals CVD and PVD coating process modelling by using artificial neural networks

2012 ◽  
Vol 1 (1) ◽  
pp. 46 ◽  
Author(s):  
Amir Mahyar Khorasani ◽  
Mohammad Reza Solymany yazdi ◽  
Mehdi Faraji ◽  
Alex Kootsookos
Keyword(s):  
Thin Film ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Film Coating ◽  
Deposition Process ◽  
Thin Film Coating ◽  
Mlp Neural Network ◽  
Titanium Thin Film ◽  
Pvd Coating

Thin-film coating plays a prominent role on the manufacture of many industrial devices. Coating can increase material performance due to the deposition process. Having adequate and precise model that can predict the hardness of PVD and CVD processes is so helpful for manufacturers and engineers to choose suitable parameters in order to obtain the best hardness and decreasing cost and time of industrial productions. This paper proposes the estimation of hardness of titanium thin-film layers as protective industrial tools by using multi-layer perceptron (MLP) neural network. Based on the experimental data that was obtained during the process of chemical vapor deposition (CVD) and physical vapor deposition (PVD), the modeling of the coating variables for predicting hardness of titanium thin-film layers, is performed. Then, the obtained results are experimentally verified and very accurate outcomes had been attained.

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

1995 ◽  
Vol 403 ◽  
Author(s):  
G. Bai ◽  
S. Wittenbrock ◽  
V. Ochoa ◽  
R. Villasol ◽  
C. Chiang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Diffusion Barriers ◽  
Copper Interconnects ◽  
Time To Failure ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron

AbstractCu has two advantages over Al for sub-quarter micron interconnect application: (1) higher conductivity and (2) improved electromigration reliability. However, Cu diffuses quickly in SiO2and Si, and must be encapsulated. Polycrystalline films of Physical Vapor Deposition (PVD) Ta, W, Mo, TiN, and Metal-Organo Chemical Vapor Deposition (MOCVD) TiN and Ti-Si-N have been evaluated as Cu diffusion barriers using electrically biased-thermal-stressing tests. Barrier effectiveness of these thin films were correlated with their physical properties from Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM), Secondary Electron Microscopy (SEM), and Auger Electron Spectroscopy (AES) analysis. The barrier failure is dominated by “micro-defects” in the barrier film that serve as easy pathways for Cu diffusion. An ideal barrier system should be free of such micro-defects (e.g., amorphous Ti-Si-N and annealed Ta). The median-time-to-failure (MTTF) of a Ta barrier (30 nm) has been measured at different bias electrical fields and stressing temperatures, and the extrapolated MTTF of such a barrier is > 100 year at an operating condition of 200C and 0.1 MV/cm.

Next Generation Electrochemical Deposition TSV Fill

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001523-001535
Author(s):  
Bioh Kim ◽  
Stephen Golovato ◽  
Tyler Barbera ◽  
Keiichi Fujita ◽  
Takashi Tanaka
Keyword(s):  
Aspect Ratio ◽  
Electrochemical Deposition ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Scale Production ◽  
Next Generation ◽  
Typical Structure ◽  
Die Stacking ◽  
Seed Deposition

The first generation of through silicon via (TSV) designs for interposer and 3D die stacking has concentrated on TSV features with aspect ratio (AR) on the order of ten. Typical via sizes are 10 X 100 um for interposer and 5 X 50 um for 3D applications. Ionized physical vapor deposition (IPVD) has been successful in depositing barrier and seed layers in these AR=10 vias that allow efficient “bottom-up” filling by electrochemical deposition (ECD) using available chemistries. While these applications are currently moving to pilot lines and low scale production, research and development has already begun on the next generation of TSV structures for interposer and die stacking. These may be based on via middle or via last designs. They are expected to increase in aspect ratio for denser TSV arrays while maintaining similar wafer thickness. Structures with AR in the range of 15–20 are being designed and produced. For interposer, a typical structure might be 8 X 120 um and 2 X 40 um for 3D stacks. These structures will challenge all TSV formation processes, including etch, dielectric liner deposition, barrier-seed deposition and TSV fill. This paper will focus on barrier-seed and TSV fill processes. IPVD barrier-seed deposition will be difficult for AR~15–20 and will require much longer deposition times for complete via coverage. Long IPVD times will produce thick overburden and pinch off the opening at the top of vias. Even if successful, IPVD may not be viable economically. More conformal deposition processes, such as atomic layer deposition (ALD), chemical vapor deposition (CVD) and wet processes, like electro-less plating and conformal ECD, may be better alternatives to IPVD. A conformal process only needs to deposit the minimum required seed thickness in the via for successful ECD filling with the overburden being nearly the same thickness. The development of a successful conformal barrier-seed process may even challenge IPVD for AR=10. This paper presents ECD TSV fill results using several conformal barrier-seed processes, demonstrating the feasibility of this approach for structures with AR = 10–20.

scholarly journals Welding, Joining, and Coating of Metallic Materials

Materials ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2640
Author(s):  
Michael Zinigrad ◽  
Konstantin Borodianskiy
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Metallic Substrate ◽  
Metallic Materials ◽  
Special Issue ◽  
Different Types ◽  
Recent Developments ◽  
Micro Arc Oxidation

Welding, joining, and coating of metallic materials are among the most applicable fabrication processes in modern metallurgy. Welding or joining is the manufacture of a metal one-body workpiece from several pieces. Coating is the process of production of metallic substrate with required properties of the surface. A long list of specific techniques is studied during schooling and applied in industry; several include resistant spot, laser or friction welding, micro arc oxidation (MAO), chemical vapor deposition (CVD), and physical vapor deposition (PVD), among others. This Special Issue presents 21 recent developments in the field of welding, joining, and coating of various metallic materials namely, Ti and Mg alloys, different types of steel, intermetallics, and shape memory alloys.

Deposition and Characterization of Carbon Nitride Films by Laser Processed Methods

1998 ◽  
Vol 526 ◽  
Author(s):  
Ashok Kumar ◽  
R. Alexandrescu ◽  
Michael A. George
Keyword(s):  
Thin Films ◽  
Comparative Analysis ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Carbon Nitride ◽  
Pyrolytic Graphite ◽  
Chemical Vapor ◽  
Nitrogen Atmosphere ◽  
Graphite Target

AbstractLaser assisted methods such as laser physical vapor deposition (LPVD) and laser induced chemical vapor deposition (LCVD) have been utilized to grow carbon nitride (CNx) films on various substrates. It has been shown that the both techniques produce good quality thin films of CNx. In LPVD, a laser beam (λ= 248 nm) has been used to ablate the pyrolytic graphite target in nitrogen atmosphere, where as CO2 laser was to irradiate carbon-nitrogen containing mixtures such as C2H2/N2O/NH3 in LCVD method. A comparative analysis will be presented in terms of structural properties of CNx films prepared by both techniques.

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