A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001727-001758
Author(s):  
Johann Weinhaendler ◽  
Rudolf Kaiser ◽  
Hardy Kellermann
Keyword(s):  
Form Factors ◽  
High Volume ◽  
High Accuracy ◽  
Success Factor ◽  
Cycle Times ◽  
Laboratory Setup ◽  
Aspect Ratios ◽  
Die Attach ◽  
Alignment Algorithms ◽  
Vision Alignment

Fueled by the Internet and nowadays unlimited connectivity expectations, the assembly of optoelectronic packages became a key element to enable the explosive growth in the communication field around the entire globe. The primary challenge in the field of advanced optoelectronics and photonic device packaging (e.g. laser diodes, VCSEL's, optical benches, lenses etc.) is to accurately align the different optical components in reference to each other for optimal optical device performance. This growing need for high precision die attach (<= 0.5um @ 3 sigma) systems and solutions at the shortest possible cycle times has been studied and implemented by AMICRA Microtechnologies. AMICRA's state of the art high accuracy automated assembly system solutions have been successfully used for over a decade in both a laboratory setup and a high volume manufacturing environment. From handling a large variety of substrate materials, thin and fragile chips with odd aspect ratios, lenses and other components, the flexible and dynamic vision alignment concept and the bonding process controls required to achieve high overall component placement accuracies has been AMCIRA's industry focus since the company's inception. While significant progress has been made to provide solutions for all communications and photonics applications there are currently still some challenges out there to be overcome, challenges that can also change on an application by application basis. Besides the technical challenges the cost effectiveness or cost per bond for those applications is a very critical overall success factor as well. This paper will elaborate on manufacturability concerns and equipment automation challenges associated with the key parameters of a Photonics applications high accuracy die attach process which, amongst others, not only require highly sophisticated vision alignment algorithms but also thermal transfer processes either using an eutectic process or a laser soldering technique. Given the ever shrinking packaging form factors, all of AMICRA's research and developments in the Photonics field have also been successfully introduced and applied in more traditional semiconductor applications which have an increasing need for high accuracy die attach.

Automated Precision Assembly for High-Volume HB LEDs

2011 ◽  
Vol 2011 (1) ◽  
pp. 000117-000122
Author(s):  
Donald J. Beck ◽  
Jessica Sylvester
Keyword(s):  
Light Emitting Diode ◽  
High Reliability ◽  
Bright Light ◽  
High Volume ◽  
Commercial Production ◽  
Production Lines ◽  
Light Emitting ◽  
Die Attach ◽  
High Volume Production ◽  
Volume Production

Since the introduction of automated die and wire bonders in the 1980s, equipment manufacturers and process engineers have been challenged to balance speed with repeatability. Today, die bonders can perform epoxy die attach at a rate of 1.5 to 4 thousand die per hour [6]; and wire bonders can interconnect complex packages at speeds of more than 10 wires per second [7]. The advantage of automation is speed and consistency—however, there is one major concern with operating at these speeds: if something in the assembly process is wrong, everything will be wrong. Having tightly regulated assembly processes helps avoid the risk of building a large batch of rejected product. This paper presents a methodology and process flow supporting High Bright Light Emitting Diode (HB LED) automated assembly, supported by equipment certification, product inspection and SPC data collection methods. The methods presented in this paper have been formulated through extensive work in the high-reliability microelectronics industry and commercial production lines over the last three decades. To ensure time-to-market success in high-volume production, specific methods to achieve throughput and quality are required. This paper will cover the strategies and methods necessary to achieve the ultimate goal of an automated precision HB LED assembly—to blend the requirements of high-reliability and high-throughput to support high-volume commercial production.

scholarly journals Scalar isoscalar form factors for energies above 1 GeV

2019 ◽  
Vol 202 ◽  
pp. 06002
Author(s):  
Stefan Ropertz ◽  
Christoph Hanhart ◽  
Bastian Kubis
Keyword(s):  
Experimental Data ◽  
Scattering Amplitudes ◽  
Form Factors ◽  
Padé Approximants ◽  
High Accuracy ◽  
Data Description ◽  
Pade Approximants ◽  
Low Energies

We present a new parametrization for scattering amplitudes and form factors, which is consistent with high-accuracy dispersive representations at low energies but at the same time allows for a data description of higher mass resonances such as the f0(1500) and f0(2020). The formalism is general and thus can be applied to many decay processes. As an example we discuss the decay of $ \bar {B}_s^0 $ → J/ψππ(KK). From the amplitude fixed in a fit to the experimental data pole positions and residues are extracted via Padé approximants.

The Hybrid Compression Moulding of Structural Composite Materials for Automotive Applications

2020 ◽  
Vol 843 ◽  
pp. 3-8 ◽  
Author(s):  
Helena C. Simmonds ◽  
Neil C. Reynolds ◽  
Kenneth N. Kendall
Keyword(s):  
Composite Materials ◽  
Manufacturing Process ◽  
Fibre Composite ◽  
Material Design ◽  
High Volume ◽  
Ford Motor Company ◽  
Compression Moulding ◽  
Cycle Times ◽  
Class Project ◽  
Automotive Suspension

The Innovate-UK-funded Composite Lightweight Automotive Suspension System (CLASS) project, led by Ford Motor Company and partnered by Gestamp UK, GRM Consulting and WMG, investigated the use of carbon fibre reinforced composite materials to decrease the weight of a complex automotive rear suspension component in support of reduction in vehicle emissions. A multi-material design comprising discontinuous fibre composite (C-SMC), aligned fibre composite laminate (prepreg) and steel was developed. A high volume hybrid compression moulding manufacturing process was developed at WMG, achieving total press cycle times of around 5 minutes. Prototype parts were manufactured and evaluated using materials characterisation techniques to validate the manufacturing methods. The optimum C-SMC charge pattern was investigated to achieve complete fill with minimal pre-processing. Destructive and nondestructive analysis of the hybrid parts was performed to understand resultant hybrid material macrostructure. This innovative design and manufacturing process resulted in a component 35% lighter than the original multi-piece steel design.

scholarly journals Design of an Axial Turbine for Highly Downsized Internal Combustion Engines

2020 ◽  
Vol 10 (17) ◽  
pp. 5935
Author(s):  
Lorenzo Baietta ◽  
Mamdouh Alshammari ◽  
Apostolos Pesyridis ◽  
Dhrumil Gohil
Keyword(s):  
Internal Combustion Engines ◽  
High Volume ◽  
Cnc Machining ◽  
Numerical Control ◽  
Driving Experience ◽  
Aspect Ratios ◽  
Efficient Reduction ◽  
High Volume Production ◽  
Axial Turbines ◽  
Efficient Power

This paper describes and discusses the development of an axial turbocharger turbine concept as a potential substitute to commercial radial turbines for high-volume production. As turbo-lag is one of the main issues related to the inertia of the rotating parts in a turbocharger, leading to less responsive and drive-cycle efficient power units, the use of axial turbines, with their inherently lower inertia than radial types for the same application, enables the efficient reduction of the spool-up time of the system, to the benefit of the driving experience and emissions. However, axial turbines for this application usually show complicated blades and level of twist, leading to efficient but expensive designs compared to their radial counterparts. Based on this challenge, the idea of comparing prismatic (generally less efficient, but cheaper) and twisted 3D-bladed axial turbines showed that for lower blade aspect ratios, the efficiency is of the same order. For these reasons, many turbines with a range of different sizes were designed with both layouts (3D and prismatic blades) and compared. Further, the use of 3D optical scanning, as well as dyno-calibrated 1D engine models enabled the gathering of invaluable data to design the proposed solution and compare it to the Original Equipment Manufacturer (OEM) version. Thanks to these processes, the comparison between the proposed design and the OEM one was not limited to the performance, and also included the manufacturing costs, which were calculated via Computer Aided Manufacturing (CAM) programs, with the limitation of using only Computer Numerical Control (CNC) machining for production. To conclude, the work showed a notable performance superiority of the proposed turbine in respect to the OEM one, despite a slightly higher estimated production cost.

Thermoactivated Pinning - A Novel Joining Technique for Thermoplastic Composites

2012 ◽  
Vol 188 ◽  
pp. 176-181 ◽  
Author(s):  
Werner Hufenbach ◽  
Robert Kupfer ◽  
Andreas Hornig
Keyword(s):  
Mechanical Properties ◽  
High Volume ◽  
Tensile Tests ◽  
Thermoplastic Composites ◽  
Structural Effects ◽  
Short Cycle ◽  
Cycle Times ◽  
Lap Shear ◽  
Thermoplastic Matrix ◽  
Manufacturing Techniques

Due to their good mechanical properties and short cycle times during processing, textile-reinforced thermoplastic composites gain increasing relevance for high-volume lightweight applications. Beyond that, by exploiting its specific processing capabilities, this composite material enables a variety of novel manufacturing techniques, e.g. for assembling. In this paper a joining technique is presented, which utilises the meltability of the thermoplastic matrix to establish a material-adapted joining method by introducing slender metallic pins into the composite structure. The processing principle is described and structural effects in the joining zone are analysed by means of microscopy. The load bearing behaviour is characterised by tensile tests on double-lap-shear specimen.

Self Calibrated and High Accuracy Thermal Control in Cavities

2005 ◽  
Author(s):  
Francisco Antonio Belo ◽  
Marcelo Magalha˜es A´vila Paz ◽  
Antonio Pralon Ferreira Leite ◽  
Leonaldo Jose´ Lira do Nascimento
Keyword(s):  
Copper Wire ◽  
Thermal Inertia ◽  
Dimensional Accuracy ◽  
Thermal Control ◽  
High Accuracy ◽  
Circuit Board ◽  
Sensor Resistance ◽  
Aspect Ratios ◽  
Electronic Response ◽  
Cad Cam

The study of thermal control in different geometry cavities (cylindrical and rectangular), to obtain high accuracy, short and long term stability responses applied to electronic instruments, is presented. Automatic dynamic electrical compensation is achieved by a feedback electronic circuit and low thermal inertia sensors. One sensor element is also employed as an actuator (heat generator) and the other as a reference sensor (resistance of manganine wire). In the rectangular cavity, the transducer (that is sensor and heater) is manufactured directly in the circuit board surface using a CAD/CAM equipment. This architecture allows a high dimensional accuracy of the sensor/actuator with a minimum track thickness, i.e., around 100 μm. In the cylindrical cavity, the transducer is manufactured using a copper wire. For this geometry, low aspect ratios were analyzed. Electronic response equations are derived and coupled to those governing the heat transfer phenomenon in cavities. After several tests, the model is compared to the experimental data. The obtained results seem to confirm the validity of the proposed idea, allowing an accurate temperature control in cavities with a self calibrating feature. At present time, we have obtained for both geometries a precision around of 0.01°C and an accuracy around of 0.1°C.

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

2018 ◽  
Author(s):  
Dinesh P. R. Thanu ◽  
Roozbeh Danaei ◽  
Alexander Bermudez ◽  
Sergio A. Chan ◽  
Suzana Prstic
Keyword(s):  
Integrated Circuit ◽  
High Performance ◽  
Failure Modes ◽  
Form Factors ◽  
High Volume ◽  
Production Costs ◽  
Interfacial Chemistry ◽  
Fundamental Study ◽  
Metal Bonding ◽  
Polymer Metal

Nowadays microelectronic packaging has become a billion dollar business. Due to the increased material and production costs per package, manufacturing yield loss in this state-of-art business is expected to be at a bare minimum which is tough to persevere in a high volume manufacturing environment. Additionally, high performance and varied power computing needs in the electronic business demands microprocessors with different form factors and complex package designs. One of the most common joint which is extensively used in such a complicated package is the polymer to metal bonding. In the latest technology products involving high package warpage, interfacial bonding has to be strong enough to withstand the dynamic warpage and high mechanical stresses associated with it and hence the reliability of polymer to metal adhesion is critical. In this paper, fundamental mechanisms related to adhesion phenomena of polymer-metal interface are proposed. Adhesive failure modes related to polymer-metal bonding and key variables influencing the bonding of silicone based polymer material to nickel electroplated on copper in an integrated circuit heat spreader assembly are experimentally studied. Factors modulating polymer to metal bonding including interfacial chemistry, surface contamination and material roughness are evaluated.

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

2017 ◽  
Author(s):  
Sandeep Mallampati ◽  
Liang Yin ◽  
David Shaddock ◽  
Harry Schoeller ◽  
Junghyun Cho
Keyword(s):  
Thermal Conductivity ◽  
Plastic Deformation ◽  
Shear Strength ◽  
High Temperature ◽  
Heat Dissipation ◽  
Volume Fraction ◽  
High Volume ◽  
Die Attach ◽  
Average Shear Strength ◽  
Average Shear

Predominant high melting point solders for high temperature and harsh environment electronics (operating temperatures from 200 to 250°C) are Pb-based systems, which are being subjected to RoHS regulations because of their toxic nature. In this study, high bismuth (Bi) alloy compositions with Bi-XSb-10Cu (X from 10 wt.% to 20 wt.%) were designed and developed to evaluate their potential as high-temperature, Pb-free replacements. Reflow processes were developed to make die-attach samples made out of the cast Bi alloys. In particular, die-attach joints made out of Bi-15Sb-10Cu alloy exhibited an average shear strength of 24 MPa, which is comparable to that of commercially available high Pb solders. These alloy compositions also retained original shear strength even after thermal shock between −55°C and +200°C and high temperature storage at 200°C. Brittle interfacial fracture sometimes occurred along the interfacial NiSb layer formed between Bi(Sb) matrix and Ni metallized surface. In addition, heat dissipation capabilities, using flash diffusivity, were measured on the die-attach assembly, compared to the corresponding bulk alloys. The thermal conductivity of all the Bi-Sb alloys was higher than that of pure Bi. By creating high volume fraction of precipitates in a die-attach joint microstructure, it was feasible to further increase thermal conductivity of this joint to 24 W/m·K, which is three times higher than that of pure Bi (8 W/m·K). Bi-15Sb-10Cu alloy has so far shown the most promising performance as a die-attach material for high temperature applications (operated over 200°C). Hence, this alloy was further studied to evaluate its potential for plastic deformation. Bi-15Sb-10Cu alloy has shown limited plastic deformation in room temperature tensile testing, in which premature fracture occurred via the cracks propagated on the (111) cleavage planes of rhombohedral crystal structure of the Bi(Sb) matrix. The same alloy has, however, shown up to 7% plastic strain under tension when tested at 175°C. The cleavage planes, which became oriented at smaller angles to the tensile stress, contributed to improved plasticity in the high temperature test.

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