Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturing

2013 ◽  
Vol 2013 (1) ◽  
pp. 000001-000006
Author(s):  
F. Roozeboom ◽  
M. Smets ◽  
B. Kniknie ◽  
M. Hoppenbrouwers ◽  
G. Dingemans ◽  
...  
Keyword(s):  
High Speed ◽  
Room Temperature ◽  
Microelectromechanical Systems ◽  
Low Cost ◽  
Industrial Process ◽  
Atomic Layer ◽  
Single Step ◽  
Thermal Mode ◽  
Different Types ◽  
Sidewall Passivation

The current industrial process of choice for Deep Reactive Ion Etching (DRIE) of 3D features, e.g. Through-Silicon Vias (TSVs), Microelectromechanical Systems (MEMS), etc., is the Bosch process, which uses alternative SF6 etch cycles and C4F8-based sidewall passivation cycles in a time-sequenced mode. An alternative, potentially faster and more accurate process is to have wafers pass under spatially-divided reaction zones, which are individually separated by so-called N2-gas bearings ‘curtains’ of heights down to 10–20 μm. In addition, the feature sidewalls can be protected by replacing the C4F8-based sidewall passivation cycles by cycles forming chemisorbed and highly uniform passivation layers of Al2O3 or SiO2 deposited by Atomic Layer Deposition (ALD), also in a spatially-divided mode. ALD is performed either in thermal mode, or plasma-assisted mode in order to achieve near room-temperature processing. For metal filling of 3D-etched TSVs, or for deposition of 2D metal conductor lines one can use Laser-Induced Forward Transfer (LIFT) of metals. LIFT is a maskless, ‘solvent’-free deposition method, utilizing different types of pulsed lasers to deposit thin material (e.g. Cu, Au, Al, Cr) layers with μm-range resolution from a transparent carrier (ribbon) onto a close-by acceptor substrate. It is a dry, single-step, room temperature process in air, suitable for different types of interconnect fabrication, e.g. TSV filling and redistribution layers (RDL), without the use of wet chemistry.

Application of SU-8 photoresist as a multi-functional structural dielectric layer in FOWLP

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-19
Author(s):  
Raquel Pinto ◽  
André Cardoso ◽  
Sara Ribeiro ◽  
Carlos Brandão ◽  
João Gaspar ◽  
...  
Keyword(s):  
Structural Material ◽  
High Performance ◽  
Microelectromechanical Systems ◽  
Low Cost ◽  
Process Conditions ◽  
Processing Temperature ◽  
Wafer Level ◽  
Fast Growing ◽  
Wide Range ◽  
Different Types

Microelectromechanical Systems (MEMS) are a fast growing technology for sensor and actuator miniaturization finding more and more commercial opportunities by having an important role in the field of Internet of Things (IoT). On the same note, Fan-out Wafer Level Packaging (FOWLP), namely WLFO technology of NANIUM, which is based on Infineon/ Intel eWLB technology, is also finding further applications, not only due to its high performance, low cost, high flexibility, but also due to its versatility to allow the integration of different types of components in the same small form-factor package. Despite its great potential it is still off limits to the more sensitive components as micro-mechanical devices and some type of sensors, which are vulnerable to temperature and pressure. In the interest of increasing FOWLP versatility and enabling the integration of MEMS, new methods of assembling and processing are continuously searched for. Dielectrics currently used for redistribution layer construction need to be cured at temperatures above 200°C, making it one of the major boundary for low temperature processing. In addition, in order to accomplish a wide range of dielectric thicknesses in the same package it is often necessary to stack very different types of dielectrics with impact on bill of materials complexity and cost. In this work, done in cooperation with the International Iberian Nanotechnology Laboratory (INL), we describe the implementation of commercially available SU-8 photoresist as a structural material in FOWLP, allowing lower processing temperature and reduced internal package stress, thus enabling the integration of components such as MEMS/MOEMS, magneto-resistive devices and micro-batteries. While SU-8 photoresist was first designed for the microelectronics industry, it is currently highly used in the fabrication of microfluidics as well as microelectromechanical systems (MEMS) and BIO-MEMS due to its high biocompatibility and wide range of available thicknesses in the same product family. Its good thermal and chemical resistance and also mechanical and rheological properties, make it suitable to be used as a structural material, and moreover it cures at 150°C, which is key for the applications targeted. Unprecedentedly, SU-8 photoresist is tested in this work as a structural dielectric for the redistribution layers on 300mm fan-out wafers. Main concerns during the evaluation of the new WLFO dielectric focused on processability quality; adhesion to multi-material substrate and metals (copper, aluminium, gold, ¦); between layers of very different thicknesses; and overall reliability. During preliminary runs, processability on 300 mm fan-out wafers was evaluated by testing different coating and soft bake conditions, exposure settings, post-exposure parameters, up to developing setup. The outputs are not only on process conditions and results but also on WLFO design rules. For the first time, a set of conditions has been defined that allows processing SU-8 on WLFO, with thickness values ranging from 1 um to 150 um. The introduction of SU-8 in WLFO is a breakthrough in this fast-growing advanced packaging technology platform as it opens vast opportunities for sensor integration in WLP technology.

A Control Method Research of Parallel Mechanisms

2012 ◽  
Vol 619 ◽  
pp. 51-55
Author(s):  
Heng Chen ◽  
Yan Bing Ni
Keyword(s):  
Control System ◽  
High Speed ◽  
Control Method ◽  
Low Cost ◽  
Parallel Robot ◽  
Joint Space ◽  
Linear Mapping ◽  
Single Step ◽  
Parallel Mechanisms ◽  
Motion Controller

This paper deals with a control method research and trajectory planning of parallel mechanisms. Control system scheme which is based on PC and motion controller has high openness, high degree of modularization and support for non-linear mapping relationship between operating space and joint space of parallel mechanisms with high flexibility and low cost. PC and NI motion controller and LabVIEW constituted hardware core and software platform of control system, respectively. Hardware technology of control system contained hardware selection, control circuit design and interface technology; software technology of control system developed application programs layer, core control layer and drive functions layer to realize core control functions of finding home, single-step or continuous movement and micro adjustment, which was based on hardware principle. Trajectory has been planned for a typical high speed parallel robot.

scholarly journals HAT-field: a very cheap, robust and quantitative point-of-care serological test for Covid-19.

2022 ◽  
Author(s):  
Etienne Joly ◽  
Agnes Maurel Ribes
Keyword(s):  
Room Temperature ◽  
Serological Test ◽  
Point Of Care ◽  
Low Cost ◽  
Single Step ◽  
Test Protocol ◽  
Laboratory Equipment ◽  
Human Red Blood Cells ◽  
The Stability ◽  
Disposable Equipment

We have recently described a very simple and cheap serological test called HAT to detect antibodies directed against the RBD of the SARS-Cov-2 virus. HAT is based on hemagglutination, triggered by a single reagent (IH4-RBD) comprised of the viral RBD domain fused to a nanobody specific for glycophorin, which is expressed at very high levels at the surface of human red blood cells (RBCs). One of the main initial goals of this study was to devise a test protocol that would be sensitive and reliable, yet require no specialized laboratory equipment such as adjustable pipets, so that it could be performed in the most remote corners of the world by people with minimal levels of training. Because antibody levels against the viral RBD have been found to correlate closely with sero-neutralisation titers, and thus with protection against reinfection, it has become obvious during the course of this study that making this test reliably quantitative would be a further significant advantage. We have found that, in PBN, a buffer which contains BSA and sodium azide, IH4-RBD is stable for over 6 months at room temperature, and that PBN also improves HAT performance compared to using straight PBS. We also show that performing HAT at either 4°C, room temperature or 37°C has minimal influence on the results, and that quantitative evaluation of the levels of antibodies directed against the SARS-CoV-2 RBD can be achieved in a single step using titration of the IH4-RBD reagent. The HAT-field protocol described here requires only very simple disposable equipment and a few microliters of whole blood, such as can be obtained by finger prick. Because it is based on a single soluble reagent, the test can be adapted very simply and rapidly to detect antibodies against variants of the SARS-CoV-2, or conceivably against different pathogens. HAT-field appears well suited to provide quantitative assessments of the serological protection of populations as well as individuals, and given its very low cost, the stability of the IH4-RBD reagent in the adapted buffer, and the simplicity of the procedure, could be deployed pretty much anywhere, including in the poorest countries and the most remote corners of the globe.

A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive

2011 ◽  
Vol 2011 (1) ◽  
pp. 000509-000515 ◽  
Author(s):  
Mary Liu ◽  
Wusheng Yin
Keyword(s):  
Solder Joint ◽  
High Speed ◽  
Room Temperature ◽  
Low Cost ◽  
White Paper ◽  
Solder Paste ◽  
Fine Pitch ◽  
Increasing Demand ◽  
The Right ◽  
Device Miniaturization

With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process. After being used in the customer field for a few years, the implementation of SMT266 has been approved improving the process yield, eliminating voids and cracks in solder joint, eliminating head-in-pillow issue for large component during lead free reflow process. The results from thermal cycling test indicated that the first failure cycles using SMT266 is high up to 6000 cycles, at least 4000 – 5000 cycles higher than other processes. The pull strength is 1.5 times higher than using solder paste plus underfilling process. All reliability data implied encapsulating each individual solder joint is the right direction to move toward. The enforcement mechanism will be discussed in our paper.

scholarly journals Performance of a simple remote video-based eye tracker with GPU acceleration

2016 ◽  
Vol 9 (4) ◽  
Author(s):  
Jean-Pierre Du Plessis ◽  
Pieter Blignaut
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Sampling Frequency ◽  
Head Movements ◽  
Processing Unit ◽  
Feature Points ◽  
Eye Tracker ◽  
Average Accuracy ◽  
Different Types ◽  
Graphical Processing

Eye tracking is a well-established tool that is often utilised in research. There are currently many different types of eye trackers available, but they are either expensive, or provide a relatively low sampling frequency. The eye tracker presented in this paper was developed in an effort to address the lack of low-cost high-speed eye trackers. It utilises the Graphical Processing Unit (GPU) in an attempt to parallelise aspects of the process to localize feature points in eye images to attain higher sampling frequencies. Moreover, the proposed implementation allows for the system to be used on a variety of different GPUs. The developed solution is capable of sampling at frequencies of 200 Hz and higher, while allowing for head movements within an area of 10×6×10 cm and an average accuracy of one degree of visual angle. The entire system can be built for less than 700 euros, and will run on a mid-range laptop.

scholarly journals A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging

Micromachines ◽  
2019 ◽  
Vol 10 (6) ◽  
pp. 351 ◽  
Author(s):  
Meng ◽  
Cheng ◽  
Yang ◽  
Sun ◽  
Luo
Keyword(s):  
Room Temperature ◽  
Microelectromechanical Systems ◽  
Silver Nanowires ◽  
Low Cost ◽  
Mems Devices ◽  
Filling Process ◽  
Conductive Adhesives ◽  
Mems Packaging ◽  
Wide Range ◽  
High Efficient

The through-silicon-vias (TSVs) process is a vital technology in microelectromechanical systems (MEMS) packaging. The current via filling technique based on copper electroplating has many shortcomings, such as involving multi-step processes, requiring sophisticated equipment, low through-put and probably damaging the MEMS devices susceptible to mechanical polishing. Herein, a room temperature treatable, high-efficient and low-cost seedless TSV process was developed with a one-step filling process by using novel electrically conductive adhesives (ECAs) filled with silver nanowires. The as-prepared ECAs could be fully cured at room temperature and exhibited excellent conductivity due to combining the benefits of both polymethyl methacrylate (PMMA) and silver nanowires. Complete filling of TSVs with the as-prepared 30 wt% silver nanowires ECAs was realized, and the resistivity of a fully filled TSV was as low as 10−3 Ω·cm. Furthermore, the application of such novel TSV filling process could also be extended to a wide range of different substrates, showing great potential in MEMS packaging, flexible microsystems and many other applications.

Design and Implementation of a Linear IC Based Low Cost Digital Tachometer for Laboratory and Industrial Application

2011 ◽  
Vol 201-203 ◽  
pp. 1368-1372
Author(s):  
Shah Muhammad Ferdous ◽  
Mohammad Rokonuzzaman ◽  
Enaiyat Ghani Ovy ◽  
Md. Ashraful Hoque
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Industrial Process ◽  
Vital Role ◽  
Velocity Estimation ◽  
Process Use ◽  
Shaft Encoder ◽  
Digital Tachometer ◽  
The Cost ◽  
Fixed Period

Any adjustable speed drives uses an incremental shaft encoder or a sensor and an electronic circuit for rpm as well as velocity estimation. The usual method of counting pulses generated by encoder or sensor in a fixed period of time produces a high precision velocity or rpm estimation in the high speed range. Tachometer plays a vital role in measurement of rpm of any rotating device and it is essential for any control system especially in servomechanism. Most of the controllers employed in the industry to control industrial process use a tachometer which gives the provision of feedback in a control circuit. The purpose of the project was to develop a digital tachometer using low cost linear digital ICs those are readily available in the markets of Bangladesh. This tachometer can be easily used for both industrial and laboratory purposes where it should be able to measure rpm and provide a voltage proportional to the speed of the shaft of the rotating device. At the same time efforts have been taken to reduce the cost of the tachometer as much as possible.

DMCMN: In Depth Characterization and Control of AFM Cantilevers With Integrated Sensing and Actuation

2009 ◽  
Vol 131 (6) ◽  
Author(s):  
Georg E. Fantner ◽  
Daniel J. Burns ◽  
Angela M. Belcher ◽  
Ivo W. Rangelow ◽  
Kamal Youcef-Toumi
Keyword(s):  
Atomic Force Microscopy ◽  
High Speed ◽  
Microelectromechanical Systems ◽  
Industrial Process ◽  
Clinical Diagnostics ◽  
Mems Devices ◽  
High Speed Imaging ◽  
Force Microscopy ◽  
Atomic Force ◽  
And Control

New developments in MEMS (microelectromechanical systems) fabrication allowed the development of new types of atomic force microscopy (AFM) sensor with integrated readout circuit and actuator built in on the cantilever. Such a fully instrumented cantilever allows a much more direct measurement and actuation of the cantilever motion and interaction with the sample. This technology is expected to not only allow for high speed imaging but also the miniaturization of AFMs. Based on the complexity of these integrated MEMS devices, a thorough understanding of their behavior and a specialized controls approach is needed to make the most use out of this new technology. In this paper we investigate the intrinsic properties of such MEMS cantilevers and develop a combined approach for sensing and control, optimized for high speed detection and actuation. Further developments based on the results presented in this paper will help to expand the use of atomic force microscopy to a broad range of everyday applications in industrial process control and clinical diagnostics.

TEM study of phosphorus-implanted pseudomorphic Si0.88Ge0.12 on Si(100)

1995 ◽  
Vol 53 ◽  
pp. 468-469
Author(s):  
N. David Theodore ◽  
Donald Y.C Lie ◽  
J. H. Song ◽  
Peter Crozier
Keyword(s):  
Integrated Circuits ◽  
Heterojunction Bipolar Transistors ◽  
Integrated Circuit ◽  
High Speed ◽  
Room Temperature ◽  
Strain Relaxation ◽  
Bipolar Transistors ◽  
Sige Hbt ◽  
Integrated Circuit Manufacturing ◽  
Microstructural Behavior

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. The material offers adjustable bandgaps, improved carrier mobilities over Si homostructures, and compatibility with Si-based integrated-circuit manufacturing. SiGe HBT performance can be improved by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however is that implantation can enhance strain-relaxation of SiGe/Si.Furthermore, once misfit or threading dislocations result, the defects can give rise to recombination-generation in depletion regions of semiconductor devices. It is of relevance therefore to study the damage and anneal behavior of implanted SiGe layers. The present study investigates the microstructural behavior of phosphorus implanted pseudomorphic metastable Si0.88Ge0.12 films on silicon, exposed to various anneals.Metastable pseudomorphic Si0.88Ge0.12 films were grown ~265 nm thick on a silicon wafer by molecular-beam epitaxy. Pieces of this wafer were then implanted at room temperature with 100 keV phosphorus ions to a dose of 1.5×1015 cm-2.

Development and production experience of the multilayer curtain-coated linerboard of Ji’an PM No. 3,

TAPPI Journal ◽  
2014 ◽  
Vol 13 (2) ◽  
pp. 17-25
Author(s):  
JUNMING SHU ◽  
ARTHAS YANG ◽  
PEKKA SALMINEN ◽  
HENRI VAITTINEN
Keyword(s):  
Titanium Dioxide ◽  
High Speed ◽  
Food Packaging ◽  
Production Efficiency ◽  
Positive Impact ◽  
Low Cost ◽  
Board Structure ◽  
Flexographic Printing ◽  
Curtain Coating ◽  
Coating Formulations

The Ji’an PM No. 3 is the first linerboard machine in China to use multilayer curtain coating technology. Since successful startup at the end of 2011, further development has been carried out to optimize running conditions, coating formulations, and the base paper to provide a product with satisfactory quality and lower cost to manufacture. The key challenges include designing the base board structure for the desired mechanical strength, designing the surface properties for subsequent coating operations, optimizing the high-speed running of the curtain coater to enhance production efficiency, minimizing the amount of titanium dioxide in the coating color, and balancing the coated board properties to make them suitable for both offset and flexographic printing. The pilot and mill scale results show that curtain coating has a major positive impact on brightness, while smoothness is improved mainly by the blade coating and calendering conditions. Optimization of base board properties and the blade + curtain + blade concept has resulted in the successful use of 100% recycled fiber to produce base board. The optical, mechanical, and printability properties of the final coated board meet market requirements for both offset and flexographic printing. Machine runnability is excellent at the current speed of 1000 m/min, and titanium dioxide has been eliminated in the coating formulations without affecting the coating coverage. A significant improvement in the total cost of coated white liner production has been achieved, compared to the conventional concept of using virgin fiber in the top ply. Future development will focus on combining low cost with further quality improvements to make linerboard suitable for a wider range of end-use applications, including frozen-food packaging and folding boxboard.

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