scholarly journals Substrate Design Augmentation for Die Placement Reference at Die Attach Process

2021 ◽  
pp. 34-37
Author(s):  
Rennier Rodriguez ◽  
Jr. Edwin Graycochea ◽  
Frederick Ray Gomez
Keyword(s):  
Ball Grid Array ◽  
Die Attach ◽  
Bga Package ◽  
The Cross ◽  
Design Augmentation ◽  
Critical Aspects

Die placement reference in die attach process is one of the critical aspects in measuring the actual die placement especially for the device that has a required measurement. This paper focused on the re-design on the layout of the substrate ball grid array (BGA) package with cross fiducials at the singulation lane which are located at the corner portions of the device. The cross fiducial would serve as a reference when measuring the actual placement of the Silicon die in the package. With this improvement, the technicians and operators could now easily identify the reference based on the mount and bonding diagram requirement.

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

2000 ◽  
Vol 123 (1) ◽  
pp. 88-94 ◽  
Author(s):  
Takashi Aihara ◽  
Shingo Ito ◽  
Hideaki Sasajima ◽  
Ken Oota
Keyword(s):  
Ball Grid Array ◽  
The Other ◽  
Molding Compounds ◽  
Other Hand ◽  
Die Attach ◽  
Bga Packages ◽  
Fine Pitch ◽  
The World ◽  
Bga Package ◽  
Materials Used

The market for BGA packages is expanding all over the world, owing to the ease of its mounting onto the PC boards. On the other hand, BGA packages possess certain shortcomings compared to QFPs. Anti-solder crack performance on Fine Pitch BGA (=FPBGA) and warpage on Mold Array Package-BGA(=MAP-BGA) are significant disadvantages. To improve the performance of BGA packages, we studied various combinations of materials used for BGA package including molding compounds, die attach pastes, and substrates.

scholarly journals Die Crack Resolution through Pick-up Process Optimization for BGA Package

2021 ◽  
pp. 32-36
Author(s):  
R. Rodriguez ◽  
E. Graycochea Jr. ◽  
F. R. Gomez ◽  
E. Manalo
Keyword(s):  
Process Optimization ◽  
Process Improvement ◽  
Parameter Optimization ◽  
New Technologies ◽  
Semiconductor Industry ◽  
Ball Grid Array ◽  
Main Root ◽  
Root Cause ◽  
Die Attach ◽  
Bga Package

With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address the quantity of rejection of die crack during die picking at the die attach process station. High pick force and high needle top height found out during the pick-up process is the main root cause of die crack. Parameter optimization particularly for die picking with the combination of pick force and needle top height parameter was done to eliminate this type of issue after the die attaches process. With the die attach process improvement, a reduction of 100 percent of die crack occurrence was successfully achieved. For future works, the improvement and learnings could be used for devices with similar constraints.

Shear Speed Analysis on Sn-3.9Ag-0.6Cu Solder

2013 ◽  
Vol 404 ◽  
pp. 72-76
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Fairul Afzal Ahmad Fuad ◽  
Phaklen Ehkan ◽  
Ong Tee Say ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Shear Force ◽  
Dynamic Stress ◽  
Ball Grid Array ◽  
Ansys Software ◽  
Bga Package ◽  
Load Effects ◽  
Shear Speed ◽  
Free Material

Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nanosize. The reliability of BGA in IC becomes a concern as the size of IC reduces. Hence, this leads to the study of stress on the BGA. This paper discussed the load effects of varying shear speed analysis on the BGA. A Pb-free material, Sn-3.9Ag-0.6Cu solder was applied in the simulation. Shear height value is fixed while the shear speed is varied to investigate the dynamic stress on a BGA package using Ansys software. The results from the graph plotted showed that higher shear speed results to higher shear force.

An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging

2010 ◽  
Vol 97-101 ◽  
pp. 23-27 ◽  
Author(s):  
Zainudin Kornain ◽  
Azman Jalar ◽  
Rozaidi Rashid ◽  
Shahrum Abdullah
Keyword(s):  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Ball Grid Array ◽  
Statistic Analysis ◽  
Curing Process ◽  
Ceramic Ball ◽  
Die Attach ◽  
Ball Grid Array Package ◽  
Flip Chip Packaging ◽  
The Impact

Underfilling is the preferred process to reduce the impact of the thermal stress that results from the mismatch in the coefficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. Voids formation in underfill is considered as failure in flip chip manufacturing process. Voids formation possibly caused by several factors such as poor soldering and flux residue during die attach process, voids entrapment due moisture contamination, dispense pattern process and setting up the curing process. This paper presents the optimization of two steps curing profile in order to reduce voids formation in underfill for Hi-CTE Flip Chip Ceramic Ball Grid Array Package (FC-CBGA). A C-Mode Scanning Aqoustic Microscopy (C-SAM) was used to scan the total count of voids after curing process. Statistic analysis was conducted to analyze the suitable curing profile in order to minimize or eliminate the voids formation. It was shown that the two steps curing profile provided solution for void elimination.

scholarly journals Pick and Place Process Optimization for Thin Semiconductor Packages

2019 ◽  
pp. 1-9
Author(s):  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez
Keyword(s):  
Process Optimization ◽  
Ball Grid Array ◽  
Innovative Approach ◽  
Die Attach ◽  
Bga Packages ◽  
Pick And Place ◽  
Thin Semiconductor ◽  
Early Production ◽  
Semiconductor Packages ◽  
Related Process

Nowadays, electronic manufacturers trend are to become thinner and thinner especially those electronic gadgets that is very handy and convenient on our daily necessity. Challenge with the leading manufacturers is the production and development of less size gadget yet with richness of available application and uses that we can work on with what can please its consumer for their convenience and satisfaction. As with the semiconductor company, correlation between becoming thinner versus manufacturing capability become significantly opposite, as the package become thinner the more complex its related process can be. This study covers innovative approach in die attach station on critical handling of thin die packages. Lessons and learning were documented from Ball Grid Array (BGA) packages as first to be evaluated with thin package requirements.  Also discussed herewith are documented defects and related issues during trials and die attach builds that has been a show stopper on its early production.

Emerging Flux Challenges for BGA Packages

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001359-001390
Author(s):  
Maria Durham ◽  
Andy Mackie ◽  
Jason Chou
Keyword(s):  
Solder Joint ◽  
Failure Modes ◽  
Value Added ◽  
Ball Grid Array ◽  
Deposition Process ◽  
Testing Methods ◽  
Bga Packages ◽  
Bga Package ◽  
One Step ◽  
Process Cost

The formation of a Ball Grid Array (BGA) solder joint is critical for a BGA package where typically a flux deposition process is used. Reflowing solder spheres to solderable pads on the bottom of substrates in standard BGA, FCBGA, CSP, and similar packages is considered to be a trivial step: a specialized BGA flux is usually pin-transferred onto the pads, followed by balldrop onto the substrate. However, with the increasing complexity and number of assembly processes taken prior to this final step, the formation of a reliable final joint is far from certain. In order to eliminate variability, many OSATs and ODMs use the so-called “two step” (double fluxing) approach, which is comprised of the non-value-added extra processes of prefluxing, reflowing, cleaning, and drying substrates immediately prior to the final flux-based ball-attach process. This paper details the sequence of processes seen in typical FCBGA assembly, and examines the effects of each set of prior processes on the solderability of the final pad. The introduction of a “one-step” pin-transfer ball-attach flux is shown to be a means of reducing both process cost and time, and also reducing the risk of increased warpage in the finished package. The paper also investigates the solderable surface and metallurgy of the substrate pad. The variety of new and emerging failure modes for the BGA process as well as the different testing methods for the materials will also be discussed.

Thermally and Electrically Enhanced Wirebond BGA

2013 ◽  
Vol 2013 (1) ◽  
pp. 000478-000483
Author(s):  
Burton Carpenter ◽  
Boon Yew Low ◽  
Leo M. Higgins ◽  
Sriram Neelakantan ◽  
Robert Wenzel ◽  
...  
Keyword(s):  
Flip Chip ◽  
Hold Time ◽  
Thermal Interface Material ◽  
Thermal Dissipation ◽  
Electrical Performance ◽  
Package Design ◽  
Die Attach ◽  
Bga Package ◽  
End Use ◽  
Set Up

Next-generation processors continue to demand more thermal and electrical performance from the package. Frequently, devices are designed into Flip Chip (FC) packages where the previous generations were in Wire Bond (WB) because FC typically provides superior thermal dissipation and lower package electrical parasitics than WB packages. However, FC packages usually have higher costs for mid-range IO (500–800). An Enhanced WB BGA package has been designed with improved thermal and electrical performance compared to the industry standard TEPBGA-2 (Thermally Enhanced PBGA type 2). The 500μm barrier of mold compound between the die and heatspreader in the TEPBGA-2 is a major impediment to heat flow out of the package. By contrast, the Enhanced WB package uses post-mold attachment of a heat spreader that is adhesively bonded to the mold cap and thermally coupled to the die using a 40μm TIM (thermal interface material). Improvements to substrate design rules and the die attach process that enabled the Enhanced WB design to shorten bond wires by 40% and improved electrical performance. Package thermal resistance, Theta-Ja, was verified by simulation and measurement to be 3C°/W lower than TEPBGA-2, that dissipates up to 15W in some end-use applications, approximately 2× the performance of TEPBGA-2. DDR set-up and hold time showed 30ps improvement by both simulation and measurement. This paper will present the package design, thermal and electrical simulation and measurement results.

Thermal analysis and optimization for a ball grid array package

2005 ◽  
Vol 219 (4) ◽  
pp. 381-393 ◽  
Author(s):  
C-I Ho ◽  
T-C Hung ◽  
C-I Hung
Keyword(s):  
Thermal Resistance ◽  
Heat Dissipation ◽  
Ball Grid Array ◽  
Optimization Method ◽  
Heat Transfer Analysis ◽  
Bga Packages ◽  
Solder Balls ◽  
Bga Package ◽  
Computational Fluid Dynamics Cfd ◽  
Artificial Neural Network Ann

In this study, a computational fluid dynamics (CFD) approach is employed for heat transfer analysis of a ball grid array (BGA) package that is widely used in the modern electronics industry. Owing to the complicated geometric configuration of the BGA package, the submodel approach is used to investigate in detail the temperature distributions of thermal vias and solder balls. The effective thermal resistance of a BGA package has been successfully obtained from numerical simulations. An artificial neural network (ANN) is trained to establish the relationship between the geometry input and the thermal resistance output. The well-trained network is then coupled with the complex optimization method to search for the optimum design of the BGA package to achieve the lowest thermal resistance. The results of this study provide the electronic packaging industry with a reliable and rapid method for heat dissipation design of BGA packages.

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