Unified Model of Shot Noise in the Tunneling Current in Sub-10 nm MOSFETs

A single unified analytical model is presented to predict the shot noise for both the source-to-drain (SD) and the gate tunneling current in sub-10 nm MOSFETs with ultrathin oxide. Based on the Landauer formula, the model is constructed from the sequential tunneling flows associated with number fluctuations. This approach provides the analytical formulation of the shot noise as a function of the applied voltages. The model performs well in predicting the Fano factor for shot noise in the SD and gate tunneling currents.

Study on Single Event Effect Simulation in T-Shaped Gate Tunneling Field-Effect Transistors

Tunneling field-effect transistors (TFETS) can reduce the subthreshold swing (SS) to below 60 mV/decade due to their conduction mechanism with band-to-band tunneling (BTBT), thereby reducing power consumption. T-shaped gate tunneling field-effect transistors (TGTFET) adapt double source and T-shaped gates to enhance the on-state current and to generate the tunneling probability. In this paper, TGTFET subjected to heavy-ion irradiation is studied by technology computer-aided design (TCAD) simulation for the first time. The results show that as the drain bias and linear energy transfer (LET) increase, the transient current and collected charge also increase. When LET = 100 MeV·cm2/mg and Vd = 0.5 V, the transient current of TGTFET is as high as 10.63 mA, which is much larger than the on-state current. This means that TGTFET is more sensitive to single-event effect (SEE) than FDSOI. By simulating a heavy-ion strike on different locations in TGTFET, the tunneling junction is the most sensitive region of SEE. This provides guidance for future research on the antiradiation application of TFET-based devices.