Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
Pablo D. Quinones ◽  
Lawrence S. Mok
Keyword(s):  
Heat Sink ◽  
Cooling System ◽  
Heat Pipes ◽  
High Conductivity ◽  
Heat Sinks ◽  
Copper Block ◽  
Cooling Device ◽  
Element Analysis ◽  
Spreading Resistance ◽  
Semiconductor Chip

A cooling device using stacked centrifugal fans and circular heat sinks was designed for cooling a semiconductor chip with a heat flux near 125 W/cm2. In this device, heat is conducted from the chip to a copper heat distribution block and then distributed to multiple heat sinks via four heat pipes. The copper block with embedded heat pipes or evaporator block was optimized using finite element analysis, and several cases were validated with experimental data. The experiments showed great benefits by having a second fan/heat sink in the device. The copper block by itself was found to contribute more than half of the overall thermal resistance of the cooling device. The thermal spreading resistance of the block can be reduced by about 70% if a piece of high-conductivity material, such as a diamond-copper composite, is inserted into its base. The thermal spreading resistance is generally lower when the thickness of the high-conductivity base piece increases. However, the analysis shows that the benefit of using a high-conductivity base tapers off as the thickness of the base piece nears the diameter of the heat pipes (δ∗=1) and weakly worsens after (δ∗>1). The base will also not have a benefit when the size of the chip approaches that of the copper block (A∗=1).

A Compact Integrated Thermosyphon Heat Sink for Power Electronics Cooling

2019 ◽  
Author(s):  
Ahmed Elkholy ◽  
Roger Kempers
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Flow Boiling ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Heat Sinks ◽  
Working Fluid ◽  
Convection Heat ◽  
Two Phase ◽  
Spreading Resistance

Abstract The trend in miniaturization of power electronic components requires the development of new robust and passive cooling methods to meet increased heat flux demands. Conventional heat sinks encounter inherent shortcomings due to heat spreading resistance of the heat sink baseplate particularly in natural convection heat sinks used to cool small localized heat sources. Heat pipes embedded within the base of heat sinks can be used to improve spreading performance but are limited by the ability to conduct heat into and out of the heat pipes. In the current study, a small, naturally aspirated two-phase thermosyphon heat sink was developed and characterized experimentally. The proposed architecture integrates all thermosyphon components into one compact device, where the evaporator, riser and the downcomer are incorporated at the heat sink base. The downcomer also serves as the condenser within the base of a vertical finned natural convection heat sink. The side-heated evaporator consists of an array mini-channels configuration which can operate in either pool boiling or flow boiling configuration, which allows the thermosyphon heat sink to operate in either reflux mode or looped mode, respectively. Experiments were carried out using HFE 7000 as the working fluid. The effect of the of input power on the thermal performance is examined for both modes for powers ranging from 10 to 80 W. Results demonstrate that this approach significantly reduces the spreading resistance resulting in a net improvement which can be traded-off for a decrease the overall size or weight of the heat sink.

Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cooling Systems ◽  
Content Type ◽  
Peltier Module ◽  
Peltier Modules ◽  
Forced Air

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

Study on the Factors Influencing Spreading Resistance of Heat Sinks

2011 ◽  
Vol 301-303 ◽  
pp. 165-169
Author(s):  
Da Yong Gao ◽  
Jian Xin Zhang ◽  
Ping Juan Niu
Keyword(s):  
Heat Source ◽  
Heat Sink ◽  
Electronic Devices ◽  
Great Influence ◽  
Base Plate ◽  
Critical Value ◽  
Area Ratio ◽  
Heat Sinks ◽  
Spreading Resistance ◽  
Factors Influencing

The spreading resistance is a very important parameter in the applications of heat sink. The design of electronic devices will fail without considering the influence of the spreading resistance. In this paper, a simple thermal model was simulated by Computational Fluid Dynamics software. Some factors, which have great influence on the spreading resistance, have been analyzed. The spreading resistance decreases significantly with the increasing of the area ratio between the heat source and the base-plate. While the ratio being 1, the spreading resistance reaches the mix value. The greater the thermal conductivity of heat sink, the lower the spreading resistance. With the increasing of the thickness of base-plate, the spreading resistance reduces. However, if the thickness exceeds the critical value, the spreading resistance will increase. And the spreading resistance reaches the mix value while the centers of heat source and the base-plate are overlapped.

scholarly journals Experimental investigations on Thermal Performance of Copper with Aluminium Based Finned Heat sinks for Electronics Cooling System

2016 ◽  
Vol 12 (12) ◽  
pp. 4582-4587
Author(s):  
Arulmurugan Loganathan ◽  
Ilangkumaran Mani
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Cooling System ◽  
Research Work ◽  
Electronics Cooling ◽  
Heat Sinks ◽  
Major Constituent ◽  
Experimental Investigations ◽  
Pure Aluminium ◽  
Fixed Temperature

An Experimental investigation on the thermal performance of copper with aluminium based finned heat sinks for electronics cooling system was studied. The heat sinks have different material proportions containing major constituent of aluminium and minor constituent of copper. Considered with straight finned heat sink for the experiments for its easiness in fabrication and efficient heat transfer properties. The observational results for aluminium with copper alloy are compared with pure aluminium heat sink.  Heat sink geometry, fin pitch and its height were taken from the commercially available heat sinks. In this research work best heat sink geometry is chosen and cooked up with different volume of copper added with aluminium. Selected four different spots of heat sinks and the temperature raising characteristics were measured for natural convection. also the temperature is raised to a fixed temperature and the temperature lowering characteristics were measured in forced convection as the air circulation takes more heat to keep the heat sink temperature within the desired level.

Thermofluid Design of Energy Efficient and Compact Heat Sinks

2003 ◽  
Author(s):  
Kazuaki Yazawa ◽  
Gary L. Solbrekken ◽  
Avram Bar-Cohen
Keyword(s):  
Heat Sink ◽  
Energy Efficient ◽  
Cooling System ◽  
Heat Sinks ◽  
Air Cooling ◽  
Notebook Computers ◽  
Air Cooling System ◽  
Parametric Studies ◽  
Design Optimum

A compact, energy efficient heat sink design methodology is presented for shrouded, parallel plate fins in laminar flow. The analytic model accounts for the sensible temperature rise of the air flowing between fins, convective heat transfer to the flowing stream, and conduction in the fins. To evaluate the efficiency of the air cooling system, consideration is also given to the determination of the fan pumping power. This paper focuses on the optimization of the heat sink-fan combination for energy efficiency, subject to volumetric constraints. The design optimum is found by matching the most efficient operating point of the fan with the corresponding optimum fin geometry. A series of parametric studies was completed to identify the sensitivity of the cooling solution to parametric variations. This numerically validated model has been used to visualize the parametric impact of dealing with “real world” manufacturing limitation in the development of thermal packaging solutions for notebook computers and other electronic products.

Cooling Performances of Perforated-Finned Heat Sinks

2016 ◽  
Author(s):  
Mohammad Reza Shaeri ◽  
Bradley Richard ◽  
Richard Bonner
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Cooling System ◽  
Thermal Characteristics ◽  
Heat Sinks ◽  
Pumping Power ◽  
Maximum Heat ◽  
Maximum Heat Transfer

Cooling performances of perforated-finned heat sinks (PFHS) are investigated in the laminar forced convection heat transfer mode, through detailed experiments. Perforations like windows with square cross sections are placed on the lateral surfaces of the fins. Cooling performances are evaluated due to changes in both porosities and perforation sizes. Thermal characteristics are reported based on pumping power, in order to provide more practical insight about performances of PFHSs in real applications. It is found that at a constant perforation size, there is an optimum porosity that results in the largest heat transfer coefficient. For a fixed porosity, increasing the number of perforations (reducing the perforation size) results in an enhancement of heat transfer rate due to repeated interruption of the thermal boundary layer. The opposite trend is observed for PFHSs with larger perforation sizes. This indicates that there is an optimum perforation size and distance between perforations in order to achieve the maximum heat transfer coefficients at a constant porosity. Also, a PFHS results in a smaller temperature non-uniformity across the heat sink base, as well as a more rapid reduction in temperature non-uniformity on the heat sink base by increasing pumping power. In addition, the advantage of a PFHS to reduce the overall weight of the cooling system is incorporated into thermal characteristics of the heat sinks, and demonstrated by the mass specific heat transfer coefficient.

The Application of Heat Pipe Heat Sink for High Power LED Lamps

2014 ◽  
Vol 602-605 ◽  
pp. 2713-2716 ◽  
Author(s):  
Xin Rui Ding ◽  
Yu Ji Li ◽  
Zong Tao Li ◽  
Yong Tang ◽  
Bin Hai Yu ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Practical Significance ◽  
Heat Accumulation ◽  
Element Analysis ◽  
High Power Led

LED has been regarded as the next generation lighting source. As for high power LED lamps, heat accumulation will cause a series of problems. Therefore, thermal management is very important for designing a high power LED lamp. Three types of heat sinks are designed by using the finite element analysis (FEA) method for an 180W high power LED lamp. Then the optimized heat sinks are developed and experiments are performed to demonstrate the simulated results. At the same time, the thermal performances with different working angles are investigated experimentally. The heat sink with heat pipe has a better heat dissipation performance than the conventional heat sink under the same input power. The working angles of the lamps greatly influence the thermal performance of each heat sink. For the same heat sink, the temperature varies with different install directions and working angles. Finally, the heat sink with the best thermal performance is recommended. The results have practical significance in designing high power LED lamps.

scholarly journals Effect Of Position and Design Parameters of a Fan-Cooled Cold Side Heat Sink of a Thermoelectric Cooling-Module on The Performance of a Hybrid Refrigerator

2021 ◽  
Vol 85 (2) ◽  
pp. 66-79
Author(s):  
Yasser Abdulrazak Alghanima ◽  
Osama Mesalhy ◽  
Ahmed Farouk Abdel Gawad
Keyword(s):  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Design Parameters ◽  
Vapor Compression ◽  
Thermoelectric Cooling ◽  
Cold Side ◽  
Peltier Module ◽  
Cooling Module ◽  
Good Agreement

This paper presents a CFD and experimental study of the thermal behavior of the thermoelectric-compartment in a hybrid household-refrigerator that combines thermoelectric and vapor-compression technologies. The hybrid refrigerator has three compartments. One of them is driven by a thermoelectric cooling system, which was made of one Peltier module and two fan-cooled heat sinks mounted on the hot and cold sides. The simulation results were compared with experimental measurements and showed a good agreement. The performance of the thermoelectric refrigerator was tested with changing the pushing direction. Two pushing directions for the fan were examined. In the first one (direction-I), the fan was fixed such that it sucked the air beside the cold heat sink. While in the second direction (direction-II), the fan was assumed to be flipped to push the air over the cold-side heat sink. The results showed that the second fan direction (direction-II) is more effective for heat transfer mechanism between the cold-side heat sink and the inside air of the thermoelectric-compartment.

Design and Optimization of Thermoelectric Cooling System Under Natural Convection Condition

2018 ◽  
Vol 10 (5) ◽  
Author(s):  
Xiaoyuan Ying ◽  
Fangming Ye ◽  
Ruitao Liu ◽  
Hua Bao
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Cooling System ◽  
Design Method ◽  
High Reliability ◽  
Experimental Tests ◽  
Heat Sinks ◽  
Thermoelectric Cooling ◽  
Cooling Performance ◽  
Design And Optimization

A design method for the thermoelectric cooling system is improved in this work based on a graphical approach. It is used to select an appropriate thermoelectric cooler (TEC) and determine the value of optimum input current. Theoretical analysis has been conducted to investigate the cooling performance of the system using the design method. Numerical simulation and experimental tests for the entire cooling system validate the calculation result, which indicates the high reliability of the theoretical design method. The temperature dependence of the heat sink resistance and the contact resistance are the major reasons for the small discrepancy. Research is then conducted based on the design method to investigate how a thermoelectric cooling system under natural convection performs, where the optimization of heat sinks at hot side of TEC is done by using the generalized correlations in the previous studies. Comparison is made between the thermoelectric cooling system and the bare-heat-sink system under natural convection. Results show that the thermal resistance of the heat sink attached to TEC is critical to the cooling performance of the whole system. Besides, TEC under natural convection can perform better than the passive cooling if the heat load is not very high (qc″≤20,000 W/m2). The design process and results can provide a useful guidance for other thermal engineers.

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

2015 ◽  
Author(s):  
Kazuma Obata ◽  
Takashi Fukue ◽  
Koichi Hirose ◽  
Mamoru Kikuchi ◽  
Yasuhiko Ueda ◽  
...  
Keyword(s):  
Electric Vehicles ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Vortex Generator ◽  
Heat Sinks ◽  
Vortex Generators ◽  
Water Cooling ◽  
Power Devices ◽  
Cooling Device ◽  
Flow Passage

This study describes a possibility of an improvement of water cooling devices for high-power electronic devices such as inverters for electric vehicles by using a combination of micro heat sinks and miniature vortex generators. Power devices such as IGBT (Insulated Gate Bipolar Transistor) are widely used for controlling an operation of electronic vehicles and hybrid vehicles. Due to the improvement of the performance of the power devices, the heat dissipation density from these devices becomes higher. The water cooling is the commonest method for dissipating heat from the inverter of the electronic vehicles. Therefore the improvement of the water cooling technology is significantly needed in order to manage the increase of the heat dissipation density. We are now trying to develop a high-performance water cooling device for dissipating the high heat flux from the inverters in the electric vehicles by using a combination of a fine miniature heat sink and a miniature vortex generator. The combination of the miniature heat sink and the vortex generator may increase heat transfer performance of the heat exchanger while inhibiting an increase of pressure drop by generating a swirling turbulent flow in a clearance between the heat sink fins. In this study, the water cooling performance in the narrow flow passage, which simulates the flow passage in the water cooling device, with the miniature heat sink and the miniature vortex generators was investigated by using 3-dimentional CFD analysis. From the analysis, we conclude that the combination of the miniature heat sink and the vortex generator was effective for the heat transfer enhancement in the narrow flow passage of the water cooling device while inhibiting the generation of the pressure drop when we can use the combination with the appropriate manner.

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