Future Direction and Challenges for Microelectronics Packaging Materials

2005 ◽  
Author(s):  
Vijay Wakharkar ◽  
J. C. Matayabas
Keyword(s):  
High Speed ◽  
Power Delivery ◽  
Thermal Dissipation ◽  
Advanced Materials ◽  
Packaging Materials ◽  
High Demand ◽  
Microelectronics Packaging ◽  
Advanced Packaging ◽  
New Methodologies ◽  
Future Direction

The continual increasing performance of microelectronics products places a high demand on packaging technologies. This presentation will discuss the current environment, challenges, and technologies being pursued. Package technology migrations for microprocessors and communication products are described. Material needs for high thermal dissipation, high-speed signaling, and high-density interconnects are discussed. Microprocessor scaling for increased performance and reduced cost places significant challenges on power delivery and power removal due to reducing dimensions, operating voltages, and increasing power. Meeting these challenges indicates a need for advanced packaging solutions using advanced materials. New methodologies, metrologies, and materials/process technologies to address these challenges are also highlighted.

Coreless Substrate Design, Assembly and Reliability for High Speed Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001486-001513
Author(s):  
Jon Aday ◽  
Nozad Karim ◽  
Mike Devita ◽  
Steven Lee
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Core Layer ◽  
Power Delivery ◽  
Advanced Materials ◽  
Band Width ◽  
Electrical Performance ◽  
Next Generation ◽  
Reliability Data ◽  
The Core

There are 2 primary drivers for advanced substrate technologies to support the next generation of products. One driver is silicon designs which are shifting to 20–40 GBit applications. The band width of these products are requiring advanced materials, and designs which use much thinner cores making routing and manufacturing of these packages easier. The second driver is the move more advanced silicon nodes which also drives the importance for much better power delivery. Coreless substrates enable both of these applications by eliminating the core layer which enables much finner via pitchs to route signals and power/gnd planes. The thinness also reduces the bandwidth used up by the substrate which also enables better electrical performance. This paper will focus on the electrical drivers including simulation to support the structure, flip chip assembly of the package as well as the reliability data associated with the assembly.

scholarly journals Lignin-Containing Coatings for Packaging Materials—Pilot Trials

Polymers ◽  
2021 ◽  
Vol 13 (10) ◽  
pp. 1595
Author(s):  
Asif Javed ◽  
Peter Rättö ◽  
Lars Järnström ◽  
Henrik Ullsten
Keyword(s):  
High Speed ◽  
Water Solubility ◽  
Transmission Rate ◽  
Kraft Lignin ◽  
Packaging Materials ◽  
Water Contact ◽  
Pilot Trials ◽  
Significant Difference ◽  
Ph Level ◽  
Ammonium Zirconium Carbonate

One severe weakness of most biopolymers, in terms of their use as packaging materials, is their relatively high solubility in water. The addition of kraft lignin to starch coating formulations has been shown to reduce the water solubility of starch in dry coatings. However, lignin may also migrate into aqueous solutions. For this paper, kraft lignin isolated using the LignoBoost process was used in order to examine the effect of pH level on the solubility of lignin with and without ammonium zirconium carbonate (AZC). Machine-glazed (MG) paper was coated in a pilot coating machine, with the moving substrate at high speed, and laboratory-coated samples were used as a reference when measuring defects (number of pinholes). Kraft lignin became soluble in water at lower pH levels when starch was added to the solution, due to the interactions between starch and lignin. This made it possible to lower the pH of the coating solutions, resulting in increased water stability of the dry samples; that is, the migration of lignin to the model liquids decreased when the pH of the coating solutions was reduced. No significant difference was observed in the water vapor transmission rate (WVTR) between high and low pH for the pilot-coated samples. The addition of AZC to the formulation reduced the migration of lignin from the coatings to the model liquids and led to an increase in the water contact angle, but also increased the number of pinholes in the pilot-coated samples.

scholarly journals Investigating the Trackability of Silicon Microprobes in High-Speed Surface Measurements

Sensors ◽  
2021 ◽  
Vol 21 (5) ◽  
pp. 1557
Author(s):  
Min Xu ◽  
Zhi Li ◽  
Michael Fahrbach ◽  
Erwin Peiner ◽  
Uwe Brand
Keyword(s):  
Dynamic Model ◽  
High Speed ◽  
High Signal ◽  
Resonant Response ◽  
High Demand ◽  
Surface Measurements ◽  
Tactile Roughness ◽  
Low Mass ◽  
Roughness Measurements

High-speed tactile roughness measurements set high demand on the trackability of the stylus probe. Because of the features of low mass, low probing force, and high signal linearity, the piezoresistive silicon microprobe is a hopeful candidate for high-speed roughness measurements. This paper investigates the trackability of these microprobes through building a theoretical dynamic model, measuring their resonant response, and performing tip-flight experiments on surfaces with sharp variations. Two microprobes are investigated and compared: one with an integrated silicon tip and one with a diamond tip glued to the end of the cantilever. The result indicates that the microprobe with the silicon tip has high trackability for measurements up to traverse speeds of 10 mm/s, while the resonant response of the microprobe with diamond tip needs to be improved for the application in high-speed topography measurements.

scholarly journals Experimental and Numerical Analysis of High-Speed Internally Cooled Milling

CONVERTER ◽  
2021 ◽  
pp. 748-756
Author(s):  
Ningxia Yin Et al.
Keyword(s):  
High Speed ◽  
End Milling ◽  
Double Helix ◽  
Channel Structure ◽  
Dynamics Simulation ◽  
Thermal Dissipation ◽  
Machined Surface ◽  
Milling Tool ◽  
Internally Cooled ◽  
Cooling Technology

Advanced cooling technology is a crucial measure of thermal dissipation for high-speed end-milling. In order to get an appropriate cooling technology and decrease the negative effects of traditional wet cutting, internally cooled cutting has been paid more and more attention. Because of interrupted cutting and uneven force, there was few application and investigation on internally cooled end-milling. In the paper, the effect of the end-milling tool with different internally cooled channel structure has been researched by experiment and theoretical analysis. The experimental results indicate that the end-milling tool with double helix channels carried out best machined surface quality. And the experiment result was also been analyzed and explained by computational fluid dynamics simulation, which provides a basis for the applying of the high-speed internally cooled end-milling tool.

Influence of geometric parameters and operating conditions on the thermohydrodynamic behaviour of plain journal bearings

2000 ◽  
Vol 214 (5) ◽  
pp. 445-457 ◽  
Author(s):  
I Pierre ◽  
M Fillon
Keyword(s):  
High Speed ◽  
Journal Bearing ◽  
Three Dimensional ◽  
Journal Bearings ◽  
Operating Conditions ◽  
Thermal Dissipation ◽  
Radial Clearance ◽  
Geometric Factors ◽  
Essential Components ◽  
Mass Flowrate

Hydrodynamic journal bearings are essential components of high-speed machinery. In severe operating conditions, the thermal dissipation is not a negligible phenomenon. Therefore, a three-dimensional thermohydrodynamic (THD) analysis has been developed that includes lubricant rupture and re-formation phenomena by conserving the mass flowrate. Then, the predictions obtained with the proposed numerical model are validated by comparison with the measurements reported in the literature. The effects of various geometric factors (length, diameter and radial clearance) and operating conditions (rotational speed, applied load and lubricant) on the journal bearing behaviour are analysed and discussed in order to inform bearing designers. Thus, it can be predicted that the bearing performance obtained highly depends on operating conditions and geometric configuration.

The Research of Spraying SiC/Cu Electronic Packaging Composites

2011 ◽  
Vol 284-286 ◽  
pp. 620-623
Author(s):  
Ming Hu ◽  
Jing Gao ◽  
Yun Long Zhang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Process Parameters ◽  
Electronic Packaging ◽  
High Speed ◽  
Volume Fraction ◽  
Flame Spraying ◽  
Packaging Materials ◽  
Excellent Performance ◽  
Chemical Plating

The SiC/Cu electronic packaging composites with excellent performance were successfully prepared by the chemical plating copper on the surface of SiC powders and high-speed flame spraying technology. The results showed that the homogeneous dense coated layers can be obtained on the surface of SiC powder by optimizing process parameters. The volume fraction of SiC powders in the composites could significantly increase and figure was beyond 55vol% after spraying Copper. The SiC and Cu were the main phases in the spraying SiC/Cu electronic packaging composite, at the same time Cu2O can be tested as the trace phase. The interface combination properties of SiC/Cu in the hot-pressed samples can obviously improve. The thermal expansion coefficient and thermal conductivity of SiC/Cu electronic packaging composite basic can satisfy the requirements for electronic packaging materials.

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