Optimization of Si/SiGe Microrefrigerators for Hybrid Solid-State/Liquid Cooling

2007 ◽  
Author(s):  
Y. Ezzahri ◽  
R. Singh ◽  
J. Christofferson ◽  
Z. Bian ◽  
A. Shakouri
Keyword(s):  
Solid State ◽  
Heat Generation ◽  
Hot Spots ◽  
Operating Regime ◽  
Heat Diffusion ◽  
Liquid Cooling ◽  
Heat Diffusion Equation ◽  
Additional Degree ◽  
Cold Junction ◽  
Biological Microchip

Monolithic Solid-state microrefrigerators have attracted a lot of attention during the last ten years since they have the potential to solve some of the problems related to localized heat generation and temperature stabilization in optoelectronic, microelectronics or even biological microchip applications. Combination of the solid-state cooling with other conventional techniques like liquid cooling, offers an additional degree of freedom to control both the overall temperature of the chip and to remove hot spots. We present a new approach based on Thermal Quadrupoles Method to model the behavior of a single stage Si/SiGe microrefrigerator in the DC operating regime. The sensitivity and precision of this method come from its analytical expressions, which are based on the solution of Fourier’s heat diffusion equation in the Laplace domain. The microrefrigerator top surface temperature is calculated by taking into account all possible mechanisms of heat generation and conduction within the entire device. The 3D heat and current spreading in the substrate is taken into account. The parasitic heat leakage to the cold junction due to heat generation and heat conduction within the metal lead is also considered. The theoretical results are then compared with experimental ones for several microrefrigerator sizes. A good agreement is found between them. Based on the simulations, the structure of the microrefrigerator is optimized for lowering the overall chip temperature and removing high power density hot spots in several applications in conjunction with liquid cooling techniques.

Solid-State Microrefrigeration in Conjunction With Liquid Cooling

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Younes Ezzahri ◽  
Ali Shakouri
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Fluid Flow ◽  
Solid State ◽  
Transfer Coefficient ◽  
Power Density ◽  
Liquid Flow ◽  
Hot Spots ◽  
Thermal Design ◽  
Liquid Cooling

Thermal design requirements are mostly driven by the peak temperatures. Reducing or eliminating hot spots could alleviate the design requirement for the whole package. Combination of solid-state and liquid cooling will allow removal of both hot spots and background heating. In this paper, we analyze the performance of thin film Bi2Te3 microcooler and the 3D SiGe-based microrefrigerator, and optimize the maximum cooling and cooling power density in the presence of a liquid flow. Liquid flow and heat transfer coefficient will change the background temperature of the chip but they also affect the performance of the solid-state coolers used to remove hot spots. Both Peltier cooling at interfaces and Joule heating inside the device could be affected by the fluid flow. We analyze conventional Peltier coolers as well as 3D coolers. We study the impact of various parameters such as thermoelectric leg thickness, thermal interface resistances, and geometry factor on the overall system performance. We find that the cooling of a conventional Peltier cooler is significantly reduced in the presence of fluid flow. On the other hand, 3D SiGe cooler can be effective to remove high power density hot spots up to 500 W/cm2. 3D microrefrigerators can have a significant impact if the thermoelectric figure-of-merit, ZT, could reach 0.5 for a material grown on silicon substrate. It is interesting to note that there is an optimum microrefrigerator active region thickness that gives the maximum localized cooling. For liquid heat transfer coefficient between 5000 and 20,000 W m−2 K−1, the optimum is found to be between 10 μm and 20 μm.

Correlation of Electronic and Thermal Properties of Short Channel nMOSFETS

1999 ◽  
Author(s):  
M. Palaniappan ◽  
V. Ng ◽  
R. Heiderhoff ◽  
J.C.H. Phang ◽  
G.B.M. Fiege ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Temperature Distribution ◽  
Heat Generation ◽  
Hot Spots ◽  
Light Emission ◽  
Photon Emission ◽  
Thermal Image ◽  
Short Channel ◽  
Physical Phenomena ◽  
Backside Illuminated

Abstract Light emission and heat generation of Si devices have become important in understanding physical phenomena in device degradation and breakdown mechanisms. This paper correlates the photon emission with the temperature distribution of a short channel nMOSFET. Investigations have been carried out to localize and characterize the hot spots using a spectroscopic photon emission microscope and a scanning thermal microscope. Frontside investigations have been carried out and are compared and discussed with backside investigations. A method has been developed to register the backside thermal image with the backside illuminated image.

Mapping Thickness Dependent Thermal Conductivity of GaN

2016 ◽  
Vol 138 (2) ◽  
Author(s):  
Elbara Ziade ◽  
Jia Yang ◽  
Gordie Brummer ◽  
Denis Nothern ◽  
Theodore Moustaks ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Pump Beam ◽  
Continuous Wave ◽  
High Electron Mobility Transistors ◽  
Heat Diffusion ◽  
Phase Lag ◽  
High Electron ◽  
Heat Diffusion Equation ◽  
Phase Images ◽  
Gan Film

Frequency domain thermoreflectance (FDTR) is used to create quantitative maps of thermal conductivity and thickness for a thinning gallium nitride (GaN) film on silicon carbide (SiC). GaN was grown by molecular beam epitaxy on a 4H-SiC substrate with a gradient in the film thickness found near the edge of the chip. The sample was then coated with a 5 nm nickel adhesion layer and a 85 nm gold transducer layer for the FDTR measurement. A piezo stage raster scans the sample to create phase images at different frequencies. For each pixel, a periodically modulated continuous-wave laser (the red pump beam) is focused to a Gaussian spot, less than 2 um in diameter, to locally heat the sample, while a second beam (the green probe beam) monitors the surface temperature through a proportional change in the reflectivity of gold. The pump beam is modulated simultaneously at six frequencies and the thermal conductivity and thickness of the GaN film are extracted by minimizing the error between the measured probe phase lag at each frequency and an analytical solution to the heat diffusion equation in a multilayer stack of materials. A scanning electron microscope image verifies the thinning GaN. We mark the imaged area with a red box. A schematic of the GaN sample in our measurement system is shown in the top right corner, along with the two fitting properties highlighted with a red box. We show the six phase images and the two obtained property maps: thickness and thermal conductivity of the GaN. Our results indicate a thickness dependent thermal conductivity of GaN, which has implications of thermal management in GaN-based high electron mobility transistors.

Fast Fluid Thermodynamics Simulation by Solving Heat Diffusion Equation

2021 ◽  
Vol 11 (04) ◽  
pp. 1-11
Author(s):  
Wanwan Li
Keyword(s):  
Diffusion Equation ◽  
Real Time ◽  
Stokes Equations ◽  
Fluid Simulation ◽  
Heat Diffusion ◽  
Navier Stokes ◽  
Navier Stokes Equations ◽  
Heat Diffusion Equation ◽  
Acceleration Techniques ◽  
Speed Up

In mechanical engineering educations, simulating fluid thermodynamics is rather helpful for students to understand the fluid’s natural behaviors. However, rendering both high-quality and realtime simulations for fluid dynamics are rather challenging tasks due to their intensive computations. So, in order to speed up the simulations, we have taken advantage of GPU acceleration techniques to simulate interactive fluid thermodynamics in real-time. In this paper, we present an elegant, basic, but practical OpenGL/SL framework for fluid simulation with a heat map rendering. By solving Navier-Stokes equations coupled with the heat diffusion equation, we validate our framework through some real-case studies of the smoke-like fluid rendering such as their interactions with moving obstacles and their heat diffusion effects. As shown in Fig. 1, a group of experimental results demonstrates that our GPU-accelerated solver of Navier-Stokes equations with heat transfer could give the observers impressive real-time and realistic rendering results.

Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement

2013 ◽  
Author(s):  
Enes Tamdogan ◽  
Mehmet Arik ◽  
M. Baris Dogruoz
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Light Extraction ◽  
Junction Temperature ◽  
System Level ◽  
Design Parameters ◽  
Liquid Cooling ◽  
Wide Range

With the recent advances in wide band gap device technology, solid-state lighting (SSL) has become favorable for many lighting applications due to energy savings, long life, green nature for environment, and exceptional color performance. Light emitting diodes (LED) as SSL devices have recently offered unique advantages for a wide range of commercial and residential applications. However, LED operation is strictly limited by temperature as its preferred chip junction temperature is below 100 °C. This is very similar to advanced electronics components with continuously increasing heat fluxes due to the expanding microprocessor power dissipation coupled with reduction in feature sizes. While in some of the applications standard cooling techniques cannot achieve an effective cooling performance due to physical limitations or poor heat transfer capabilities, development of novel cooling techniques is necessary. The emergence of LED hot spots has also turned attention to the cooling with dielectric liquids intimately in contact with the heat and photon dissipating surfaces, where elevated LED temperatures will adversely affect light extraction and reliability. In the interest of highly effective heat removal from LEDs with direct liquid cooling, the current paper starts with explaining the increasing thermal problems in electronics and also in lighting technologies followed by a brief overview of the state of the art for liquid cooling technologies. Then, attention will be turned into thermal consideration of approximately a 60W replacement LED light engine. A conjugate CFD model is deployed to determine local hot spots and to optimize the thermal resistance by varying multiple design parameters, boundary conditions, and the type of fluid. Detailed system level simulations also point out possible abatement techniques for local hot spots while keeping light extraction at maximum.

Computer simulation of target link explosion in laser programmable redundancy for silicon memory

1986 ◽  
Vol 1 (2) ◽  
pp. 368-381 ◽  
Author(s):  
L.M. Scarfone ◽  
J.D. Chlipala
Keyword(s):  
Thermal Evolution ◽  
Three Dimensional ◽  
Heat Diffusion ◽  
Dielectric Films ◽  
Threshold Temperature ◽  
Heat Diffusion Equation ◽  
Heating Effects ◽  
Transparent Dielectric ◽  
Difference Form ◽  
Pulse Energies

Pulses of Q-switched Nd-YAG radiation have been used to remove polysilicon target links during the implementation of laser programmable redundancy in the fabrication of silicon memory. The link is encapsulated by transparent dielectric films that give rise to important optical interference effects modifying the laser flux absorbed by the link and the silicon substrate. Estimates of these effects are made on the basis of classical plane-wave procedures. Thermal evolution of the composite structure is described in terms of a finite-difference form of the three-dimensional heat diffusion equation with a heat generation rate having a Gaussian spatial distribution of intensity and temporal shapes characteristic of commercial lasers. Temperature-dependent thermal diffusivity and melting of the polysilicon link are included in the computer modeling. The calculations account for the discontinuous change in the link absorption coefficient at the transition temperature. A threshold temperature and corresponding pressure, sufficiently high to rupture the dielectric above the link and initiate the removal process, are estimated by treating the molten link as a hard-sphere fluid. Numerical results are presented in the form of three-dimensional temperature distributions for 1.06 and 0.53 μm radiation with pulse energies 3.5 and 0.15μJ, respectively. Similarities and differences between heating effects produced by long (190 ns FWHM/740 ns duration) and short (35 ns FWHM/220 ns duration) pulses are pointed out.

scholarly journals Heat-balance integral to fractional (half-time) heat diffusion sub-model

2010 ◽  
Vol 14 (2) ◽  
pp. 291-316 ◽  
Author(s):  
Jordan Hristov
Keyword(s):  
Diffusion Equation ◽  
Heat Balance ◽  
Integral Method ◽  
Time Derivative ◽  
Heat Diffusion ◽  
Half Time ◽  
Heat Diffusion Equation ◽  
Parabolic Profile ◽  
Heat Balance Integral Method ◽  
The Heat Balance

The fractional (half-time) sub-model of the heat diffusion equation, known as Dirac-like evolution diffusion equation has been solved by the heat-balance integral method and a parabolic profile with unspecified exponent. The fractional heat-balance integral method has been tested with two classic examples: fixed temperature and fixed flux at the boundary. The heat-balance technique allows easily the convolution integral of the fractional half-time derivative to be solved as a convolution of the time-independent approximating function. The fractional sub-model provides an artificial boundary condition at the boundary that closes the set of the equations required to express all parameters of the approximating profile as function of the thermal layer depth. This allows the exponent of the parabolic profile to be defined by a straightforward manner. The elegant solution performed by the fractional heat-balance integral method has been analyzed and the main efforts have been oriented towards the evaluation of fractional (half-time) derivatives by use of approximate profile across the penetration layer.

scholarly journals SOLID-STATE MICROWAVE PROCESSOR FOR FOOD TREATMENT

2019 ◽  
Author(s):  
Marco Fiore ◽  
Nicola Di Modugno ◽  
Francesco Pellegrini ◽  
Mariagrazia Roselli
Keyword(s):  
Solid State ◽  
Food Processing ◽  
Hot Spots ◽  
Industrial Applications ◽  
Radiation Patterns ◽  
Modular Architecture ◽  
Food Treatment ◽  
Distributed Software ◽  
First Results ◽  
Uneven Heating

Uneven heating and hot spots, irregular matching conditions and deterioration of organoleptic qualities are typical drawbacks of magnetron-based food processing with microwave radiation. The proposed “Kopernicook” modular architecture, based on multiple solid-state generators governed by a distributed software platform, allows highly accurate parametric control, full customization of radiation patterns and dynamic self-regulating workflows. The first results, validated with industrial applications, show great flexibility of operation, optimal energy consumption and different ideas for future developments in terms of radiation patterns and feedback-triggered algorithms aimed at maximally efficient processes.

scholarly journals Computational and Mathematical Model with Phase Change and Metal Addition Applied to GMAW

2017 ◽  
Vol 2017 ◽  
pp. 1-8 ◽  
Author(s):  
Alfredo dos Santos Maia Neto ◽  
Marcelo Gonçalves de Souza ◽  
Edson Alves Figueira Júnior ◽  
Valério Luiz Borges ◽  
Solidônio Rodrigues de Carvalho
Keyword(s):  
Mathematical Model ◽  
Phase Change ◽  
Thermal Model ◽  
Complex Geometry ◽  
Golden Section ◽  
Simulated Data ◽  
Heat Diffusion ◽  
Data Logger ◽  
Heat Diffusion Equation ◽  
Metal Addition

This work presents a 3D computational/mathematical model to solve the heat diffusion equation with phase change, considering metal addition, complex geometry, and thermal properties varying with temperature. The finite volume method was used and the computational code was implemented in C++, using a Borland compiler. Experimental tests considering workpieces of stainless steel AISI 304 were carried out for validation of the thermal model. Inverse techniques based on Golden Section method were used to estimate the heat transfer rate to the workpieces. Experimental temperatures were measured using thermocouples type J—in a total of 07 (seven)—all connected to the welded workpiece and the Agilent 34970A data logger. The workpieces were chamfered in a 45° V-groove in which liquid metal was added on only one weld pass. An innovation presented in this work when compared to other works in scientific literature was the geometry of the weld pool. The good relation between experimental and simulated data confirmed the quality and robustness of the thermal model proposed in this work.

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