Robust Thermal Management for Embedded CPU and GPUs in Displays

2011 ◽  
Author(s):  
Sung Ki Kim ◽  
Woo Young Kan ◽  
Sang Hak Kim ◽  
Vincent Tan ◽  
Gamal Refai-Ahmed ◽  
...  
Keyword(s):  
Thermal Management ◽  
Heat Dissipation ◽  
Form Factors ◽  
Thermal Design ◽  
Flat Panel Display ◽  
Large Format ◽  
Digital Signage ◽  
Operation Conditions ◽  
Signage System ◽  
Embedded Computing System

Digital signage systems are large format displays that are typically installed in public areas for advertisement and informative publications. This emerging technology is considered as a major category in the large format display market. In general, a digital signage system consists of a flat panel display consisting of high brightness screen and operation circuits. Also, special features of high performance embedded computing system exist in very small form factors. Such products, however, are accompanied with high heat dissipation of the internal components and are usually exposed to very harsh environments for more frequent exposure to customers. Also the installation schemes of the products vary for different objectives, and a robust thermal design is required to guarantee the system reliability considering corner scenarios within the design space. The objective of the present study is to investigate the effect of installation environment on the thermal performance of a display assembly resembling a digital signage system. Design criteria for a proper thermal management scheme are proposed. The thermal characteristics of a digital signage system are presented in various operation conditions and each thermal design parameter is discussed thoroughly to ensure the reliability requirements of the digital signage system are met.

Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars

2003 ◽  
Author(s):  
James S. Wilson
Keyword(s):  
Thermal Management ◽  
Temperature Difference ◽  
Integrated Circuit ◽  
Heat Dissipation ◽  
Phased Array ◽  
Waste Heat ◽  
Heat Removal ◽  
Thermal Design ◽  
Rf Power ◽  
Phased Array Radar

Advances in RF power generation capability at the device level will soon force a change in phased array radar thermal management. The efficiency in converting electrical power into transmitted power is not increasing as rapidly which means that higher RF power generating devices also dissipate more heat. Removing this waste heat creates several thermal challenges including the topic of this paper, namely thermal issues at the die and package level. A comparison of the temperature differences between the junction and ambient shows that even at present heat dissipation levels, the temperature difference at the integrated circuit level is already a significant fraction of the total rise. Further increases in the device level heat dissipation will increase the temperature difference at the integrated circuit level to nearly unmanageable levels unless device-level design changes are made. Maintaining acceptable junction temperature levels will require lower device mounting surface temperatures or some thermally better method of die attachment and heat removal. Dividing the thermal management of a phased array radar into two portions (integrated circuit level and everything else) reveals that while thermal improvements at the system and packaging level are useful for near-future radar designs, thermal design and management at the device and package levels are crucial.

Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment

2009 ◽  
Author(s):  
Lang Yuan ◽  
Jignesh Patel
Keyword(s):  
Thermal Management ◽  
Heat Dissipation ◽  
Acoustic Noise ◽  
Field Tests ◽  
Thermal Design ◽  
System Level ◽  
Next Generation ◽  
Air Filter ◽  
Planning Stage ◽  
The Impact

The thermal management of next-generation telecommunications equipment is becoming more challenging than ever before, thanks to the elevated ambient temperature requirements (up to 65°C) from network carriers, and the thermal limitation of critical components such as optical transceivers (with a max. rating of 85°C). With thousands of watts of heat dissipation from a single shelf, a systematic methodology has to be developed at the planning stage so that every possible means to streamline the thermal management can be integrated into the system-level design. This paper uses a next-generation fiber-optic telecom product as an example to demonstrate the impact of some major mechanical/electrical parameters (such as fan curve, acoustic noise, air filter, copper content of PCB and baffles, etc.) on the thermal performance of the system. Each factor is quantitatively analyzed based on field tests, and good design practices are suggested.

scholarly journals Study on the Convective Heat Transfer and Fluid Flow of Mini-Channel with High Aspect Ratio of Neutron Production Target

Energies ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 4020
Author(s):  
Peng Sun ◽  
Yiping Lu ◽  
Jianfei Tong ◽  
Youlian Lu ◽  
Tianjiao Liang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Aspect Ratio ◽  
Optimization Design ◽  
Heat Dissipation ◽  
Neutron Production ◽  
Thermal Design ◽  
Maximum Deviation ◽  
Test Channel ◽  
Production Target

In order to provide a theoretical basis for the thermal design of the neutron production target, flow and heat transfer characteristics are studied by using numerical simulations and experiments. A rectangular mini-channel experimental model consistent with the geometric shape of the heat dissipation structure of neutron production target was established, in which the aspect ratio and gap thickness of the test channel were 53.8:1 and 1.3 mm, respectively. The experimental results indicate that the critical Re of the mini-channel is between 3500 and 4000, and when Re reaches 21,000, Nu can reach 160. The simulation results are in good agreement with the experimental data, and the numerical simulation method can be used for the variable structure optimization design of the target in the later stage. The relationship between the flow pressure drop of the target mini-channel and the aspect ratio and Re is obtained by numerical simulation. The maximum deviation between the correlation and the experimental value is 6%.

scholarly journals Thermal Analysis of Cold Plate with Different Configurations for Thermal Management of a Lithium-Ion Battery

Batteries ◽  
2020 ◽  
Vol 6 (1) ◽  
pp. 17
Author(s):  
Seyed Saeed Madani ◽  
Erik Schaltz ◽  
Søren Knudsen Kær
Keyword(s):  
Thermal Analysis ◽  
Temperature Distribution ◽  
Lithium Ion Battery ◽  
Thermal Management ◽  
Electric Vehicles ◽  
Heat Dissipation ◽  
Lithium Ion ◽  
Cold Plate ◽  
Liquid Cooling ◽  
Cooling Design

Thermal analysis and thermal management of lithium-ion batteries for utilization in electric vehicles is vital. In order to investigate the thermal behavior of a lithium-ion battery, a liquid cooling design is demonstrated in this research. The influence of cooling direction and conduit distribution on the thermal performance of the lithium-ion battery is analyzed. The outcomes exhibit that the appropriate flow rate for heat dissipation is dependent on different configurations for cold plate. The acceptable heat dissipation condition could be acquired by adding more cooling conduits. Moreover, it was distinguished that satisfactory cooling direction could efficiently enhance the homogeneity of temperature distribution of the lithium-ion battery.

scholarly journals Experimental and numerical investigation of heat dissipation from an electronic component in a closed enclosure

2018 ◽  
Vol 144 ◽  
pp. 04010
Author(s):  
Bobin Saji George ◽  
M. Ajmal ◽  
S. R. Deepu ◽  
M. Aswin ◽  
D. Ribin ◽  
...  
Keyword(s):  
Power Dissipation ◽  
Heat Dissipation ◽  
Numerical Study ◽  
Electronic Component ◽  
Thermal Design ◽  
Electronic Systems ◽  
Computational Domain ◽  
Computational Tool ◽  
Cycle Times ◽  
Design Cycle

Intensifying electronic component power dissipation levels, shortening product design cycle times, and greater than before requirement for more compact and reliable electronic systems with greater functionality, has heightened the need for thermal design tools that enable accurate solutions to be generated and quickly assessed. The present numerical study aims at developing a computational tool in OpenFOAM that can predict the heat dissipation rate and temperature profile of any electronic component in operation. A suitable computational domain with defined aspect ratio is chosen. For analyzing, “buoyant Boussinesq Simple Foam“ solver available with OpenFOAM is used. It was modified for adapting to the investigation with specified initial and boundary conditions. The experimental setup was made with the dimensions taken up for numerical study. Thermocouples were calibrated and placed in specified locations. For different heat input, the temperatures are noted down at steady state and compared with results from the numerical study.

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using 3D Metal Printing and Metal Injection Molding Technologies

2021 ◽  
Author(s):  
Jimmy Chuang ◽  
Jin Yang ◽  
David Shia ◽  
Y L Li
Keyword(s):  
Injection Molding ◽  
High Performance ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Metal Injection Molding ◽  
Electronic Packages ◽  
Two Phase ◽  
Immersion Cooling ◽  
Metal Printing ◽  
3D Metal Printing

Abstract In order to meet increasing performance demand from high-performance computing (HPC) and edge computing, thermal design power (TDP) of CPU and GPU needs to increase. This creates thermal challenge to corresponding electronic packages with respect to heat dissipation. In order to address this challenge, two-phase immersion cooling is gaining attention as its primary mode of heat of removal is via liquid-to-vapor phase change, which can occur at relatively low and constant temperatures. In this paper, integrated heat spreader (IHS) with boiling enhancement features is proposed. 3D metal printing and metal injection molding (MIM) are the two approaches used to manufacture the new IHS. The resultant IHS with enhancement features are used to build test vehicles (TV) by following standard electronic package assembly process. Experimental results demonstrated that boiling enhanced TVs improved two-phase immersion cooling capability by over 50% as compared to baseline TV without boiling enhanced features.

Design of Optimum Plate-Fin Natural Convective Heat Sinks

2003 ◽  
Vol 125 (2) ◽  
pp. 208-216 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Madhusudan Iyengar ◽  
Allan D. Kraus
Keyword(s):  
Nusselt Number ◽  
Specific Heat ◽  
Rectangular Plate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Heat Sinks ◽  
And Performance ◽  
Nusselt Number Correlation ◽  
The Impact

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

scholarly journals Aero-Thermal Design and Testing of Advanced Turbine Blades

1997 ◽  
Author(s):  
M. Haendler ◽  
D. Raake ◽  
M. Scheurlen
Keyword(s):  
Gas Turbines ◽  
Full Range ◽  
Turbine Blades ◽  
Design Procedure ◽  
Thermal Design ◽  
Test Facility ◽  
Optical Pyrometer ◽  
Electrical Systems ◽  
Operation Conditions ◽  
Improved Performance

Based on the experience gained with more than 80 machines operating worldwide in 50 and 60 Hz electrical systems respectively, Siemens has developed a new generation of advanced gas turbines which yield substantially improved performance at a higher output level. This “3A-Series” comprises three gas turbine models ranging from 70 MW to 240 MW for 50 Hz and 60 Hz power generation applications. The first of the new advanced gas turbines with 170 MW and 3600 rpm was tested in the Berlin factory test facility under the full range of operation conditions. It was equipped with various measurement systems to monitor pressures, gas and metal temperatures, clearances, strains, vibrations and exhaust emissions. This paper presents the aero-thermal design procedure of the highly thermal loaded film cooled first stage blading. The predictions are compared with the extensive optical pyrometer measurements taken at the Siemens test facility on the V84.3A machine under full load conditions. The pyrometer was inserted at several locations in the turbine and radially moved giving a complete surface temperature information of the first stage vanes and blades.

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