LAYER ASSIGNMENT FOR HIGH-SPEED MCM PACKAGING
1995 ◽
Vol 06
(03)
◽
pp. 477-495
Keyword(s):
In this paper, we present a layer assignment method under high-performance multi-chip module environments. In contrast with treating global routing and layer assignment separately, our method assigns nets to layers while considering preferable global routing topologies simultaneously. We take transmission line effects into account to avoid noise in high-speed electronics packages besides the conventional optimization goal such as routability or performance. The problem is formulated as a quadratic Boolean programming problem and an algorithm is presented to solve the problem after linearization. The proposed method is applied to a set of benchmark circuits to demonstrate the effectiveness.
1977 ◽
Vol 35
◽
pp. 68-69
Keyword(s):
1989 ◽
Vol 47
◽
pp. 56-57
1993 ◽
Vol 51
◽
pp. 768-769
2017 ◽
Vol 19
(4)
◽
pp. 319-326
◽
Keyword(s):