A wideband receiver front-end with low noise and high linearity by exploiting reconfigurable dual paths in 180 nm CMOS

2021 ◽  
pp. 2150210
Author(s):  
Benqing Guo ◽  
Hongpeng Chen ◽  
Xuebing Wang ◽  
Lei Li ◽  
Wanting Zhou

In this paper, a wideband receiver front-end including the flexible reconfigurable main and auxiliary paths is proposed. Therein, the main path has the low-noise advantage thanks to the low-noise transconductance amplifier (LNTA) preceding the mixer and baseband. Meanwhile, by utilizing a mixer-first structure, the auxiliary path renders a high in-band and out-of-band linearity. Furthermore, an inductor resonance structure is also designed to mitigate the baseband noise crosstalk issue which is disclosed by a charging/discharging mechanism via the tail capacitance of passive mixers. Both of the receiving paths have shared a common baseband circuit while loading a commonly-shared 25% duty-cycle LO source generator. Simulation results by a 180 nm CMOS have demonstrated that the main path provides a low noise figure (NF) of 2.7 dB, while the auxiliary path obtains the in-band and out-of-band IIP3 of 9.2 and 21 dBm under typical LO excitation frequency of [Formula: see text] GHz. The power consumption of the main path of the dual-path front-end is 57 mW and that of the auxiliary path is 26 mW under a supply voltage of 1.8 V.

Author(s):  
Mantas Sakalas ◽  
Niko Joram ◽  
Frank Ellinger

Abstract This study presents an ultra-wideband receiver front-end, designed for a reconfigurable frequency modulated continuous wave radar in a 130 nm SiGe BiCMOS technology. A variety of innovative circuit components and design techniques were employed to achieve the ultra-wide bandwidth, low noise figure (NF), good linearity, and circuit ruggedness to high input power levels. The designed front-end is capable of achieving 1.5–40 GHz bandwidth, 30 dB conversion gain, a double sideband NF of 6–10.7 dB, input return loss better than 7.5 dB and an input referred 1 dB compression point of −23 dBm. The front-end withstands continuous wave power levels of at least 25 and 20 dBm at low band and high band inputs respectively. At 3 V supply voltage, the DC power consumption amounts to 302 mW when the low band is active and 352 mW for the high band case, whereas the total IC size is $3.08\, {\rm nm{^2}}$ .


Author(s):  
M. Sumathi ◽  
S. Malarvizhi

In this paper, low voltage design concepts and new CMOS front-end circuits for 2.4GHz wireless applications are presented. The performances of these circuits are analysed and compared with other existing structures using TSMC 0.18-μm CMOS technology scale. The design trade-offs between impedance matching, power gain and noise figure of low-noise amplifiers are highlighted. The advantage of the introduced mixer topology is expressed in terms of conversion gain, noise figure and linearity. At a supply voltage of 1.8V, the design and performance analysis have been performed using Agilent’s Advanced Design System (ADS2009) software.


2013 ◽  
Vol 479-480 ◽  
pp. 1014-1017
Author(s):  
Yi Cheng Chang ◽  
Meng Ting Hsu ◽  
Yu Chang Hsieh

In this study, three stage ultra-wide-band CMOS low-noise amplifier (LNA) is presented. The UWB LNA is design in 0.18μm TSMC CMOS technique. The LNA input and output return loss are both less than-10dB, and achieved 10dB of average power gain, the minimum noise figure is 6.55dB, IIP3 is about-9.5dBm. It consumes 11mW from a 1.0-V supply voltage.


2019 ◽  
Vol 28 (08) ◽  
pp. 1920005 ◽  
Author(s):  
Tian Qi ◽  
Songbai He

A broadband low-noise amplifier (LNA) using 0.13 [Formula: see text]m GaAs HEMT technology for Ku-band applications is presented in this paper. By introducing an improved self-bias architecture, the LNA is achieved with low noise figure (NF) and high power gain. Compared with traditional LNA, self-bias architecture can reduce DC supplies to single one, and the improved architecture proposed here also takes part in source matching to reduce the complexity matching networks for broadband applications. To verify, an LNA operating over 12–18-GHz bandwidth is fabricated. The measurement results, for all the 72 chips on the wafer, and their average values are in great accordance with the simulation results, with 25.5–27.5-dB power gain, 1.1–1.8-dB NF, 15–17.5-dBm output power at [Formula: see text] and with a chip size of 2 mm [Formula: see text] 1.5 mm.


2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000207-000210
Author(s):  
Martin Oppermann ◽  
Felix Thurow ◽  
Ralf Rieger

Abstract Next generation of RF sensor modules, mainly for airborne applications, will cover a variety of multifunction in terms of different operating modes, e.g. Radar, EW and Communications / Datalinks. The operating frequencies will cover a bandwidth of > 10 GHz and for realisation of modern Active Electronically Steered Antennas (AESA) the Transmit/Receive (T/R) modules have to match with challenging geometry demands, and RF requirements, like switching and filtering between different operational frequencies in transmit and receive mode. New GaN technology based MMICs, e.g. LNA, HPA are in development and multifunctional components (MFC MMICs) cover more than one RF function in one chip. Different front end demonstrators will be presented, based on multilayer ceramic (LTCC) and RF-PCB and associated assembly technologies, like chip&wire and SMD reflow soldering. These TRM front ends include a Low Noise Amplifier with an integrated Switch (LNA/SW) and for characterisation the measured Noise Figure (NF), a key characteristic for receive performance, will be compared. The need for high integration on module level is obvious and therefore specific demands for low loss ceramic and PCB based modules, packages and housings exist.


Author(s):  
Tran Van Hoi ◽  
Ngo Thi Lanh ◽  
Nguyen Xuan Truong ◽  
Nguyen Huu Duc ◽  
Bach Gia Duong

<p>This paper focuses on the design and implementation of a front-end for a Vinasat satellite receiver with auto-searching mechanism and auto-tracking satellite. The front-end consists of a C-band low-noise block down-converter and a L-band receiver. The receiver is designed to meet the requirements about wide-band, high sensitivity, large dynamic range, low noise figure. To reduce noise figure and increase bandwidth, the C-band low-noise amplifier is designed using T-type of matching network with negative feedback and the L-band LNA is designed using cascoded techniques. The local oscillator uses a voltage controlled oscillator combine phase locked loop to reduce the phase noise and select channels. The front-end has successfully been designed and fabricated with parameters: Input frequency is C-band; sensitivity is greater than -130 dBm for C-band receiver and is greater than -110dBm for L-band receiver; output signals are AM/FM demodulation, I/Q demodulation, baseband signals.</p>


2013 ◽  
Vol 284-287 ◽  
pp. 2647-2651
Author(s):  
Zhe Yang Huang ◽  
Che Cheng Huang ◽  
Jung Mao Lin ◽  
Chung Chih Hung

This paper presents a wideband wireless receiver front-end for 3.1-5.0GHz band group-1 (BG-1) WiMedia application. The front-end circuits are designed in 0.18um standard CMOS process. The experimental results show the maximum conversion power gain is 45.5dB; minimum noise figure is 2.9dB. Input return loss is lower than -9.3dB and output return loss is lower than -6.8dB. The maximum LO conversion power is 0dBm. 3dB working frequency is 1.9GHz (3.1GHz-5.0GHz) Total power consumption is 24.3mW including LNA, mixer and all buffers. Total chip area is 1.27mm2 including dummy and pads.


2021 ◽  
Vol 2021 (2) ◽  
Author(s):  
E. Kudabay ◽  
◽  
A. Salikh ◽  
V.A. Moseichuk ◽  
A. Krivtsun ◽  
...  

The purpose of this paper is to design a microwave monolithic integrated circuit (MMIC) for low noise amplifier (LNA) X-band (7-12 GHz) based on technology of gallium nitride (GaN) high electron mobility transistor (HEMT) with a T-gate, which has 100 nm width, on a silicon (Si) semi-insulating substrate of the OMMIC company. The amplifier is based on common-source transistors with series feedback, which was formed by high-impedance transmission line, and with parallel feedback to match noise figure and power gain. The key characteristics of an LNA are noise figure and gain. However, in this paper, it was decided to design the LNA, which should have a good margin in terms of input and output power. As a result, GaN technology was chosen, which has a higher noise figure compared to other technologies, but eliminates the need for an input power limiter, which in turn significantly increases the overall noise figure. As a result LNA MMIC was developed with the following characteristics: noise figure less than 1.6 dB, small-signal gain more than 20 dB, return loss better than -13 dB and output power more than 19 dBm with 1 dB compression in the range from 7 to 12 GHz in dimensions 2x1.5 mm², which has a supply voltage of 8 V and a current consumption of less than 70 mA. However, it should be said that LNA was only modeled in the AWR DE.


Sensors ◽  
2021 ◽  
Vol 21 (24) ◽  
pp. 8340
Author(s):  
Behnam S. Rikan ◽  
David Kim ◽  
Kyung-Duk Choi ◽  
Seyed Ali H. Asl ◽  
Joon-Mo Yoo ◽  
...  

This paper presents and discusses a Low-Band (LB) Low Noise Amplifier (LNA) design for a diversity receive module where the application is for multi-mode cellular handsets. The LB LNA covers the frequency range between 617 MHz to 960 MHz in 5 different frequency bands and a 5 Pole Single Throw (5PST) switch selects the different frequency bands where two of them are for the main and three for the auxiliary bands. The presented structure covers the gain modes from −12 to 18 dB with 6 dB gain steps where each gain mode has a different current consumption. In order to achieve the Noise Figure (NF) specifications in high gain modes, we have adopted a cascode Common-Source (CS) with inductive source degeneration structure for this design. To achieve the S11 parameters and current consumption specifications, the core and cascode transistors for high gain modes (18 dB, 12 dB, and 6 dB) and low gain modes (0 dB, −6 dB, and −12 dB) have been separated. Nevertheless, to keep the area low and keep the phase discontinuity within ±10∘, we have shared the degeneration and load inductors between two cores. To compensate the performance for Process, Voltage, and Temperature (PVT) variations, the structure applies a Low Drop-Out (LDO) regulator and a corner case voltage compensator. The design has been proceeded in a 65-nm RSB process design kit and the supply voltage is 1 V. For 18 dB and −12 dB gain modes as two examples, the NF, current consumption, and Input Third Order Intercept Point (IIP3) values are 1.2 dB and 16 dB, 10.8 mA and 1.2 mA, and −6 dBm and 8 dBm, respectively.


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