Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar

2019 ◽  
Author(s):  
W. Hartner ◽  
M. Fink ◽  
G. Haubner ◽  
C. Geissler ◽  
J. Lodermeyer ◽  
...  
Keyword(s):  
Wafer Level ◽  
Automotive Radar ◽  
And Performance

A 77GHz automotive radar receiver in a wafer level package

2012 ◽  
Author(s):  
Christoph Wagner ◽  
Josef Bock ◽  
Maciej Wojnowski ◽  
Herbert Jager ◽  
Johannes Platz ◽  
...  
Keyword(s):  
Wafer Level ◽  
Automotive Radar ◽  
Wafer Level Package

Characterization of a Semiconductor Packaging System utilizing Through Glass Via (TGV) Technology

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001378-001407
Author(s):  
Tim Mobley ◽  
Roupen Keusseyan ◽  
Tim LeClair ◽  
Konstantin Yamnitskiy ◽  
Regi Nocon
Keyword(s):  
Low Cost ◽  
Glass Wafer ◽  
Wafer Level ◽  
Packaging System ◽  
Thin Glass ◽  
Wafer Level Packaging ◽  
Recent Developments ◽  
And Performance ◽  
New Generation ◽  
Semiconductor Packaging

Recent developments in hole formations in glass, metalizations in the holes, and glass to glass sealing are enabling a new generation of designs to achieve higher performance while leveraging a wafer level packaging approach for low cost packaging solutions. The need for optical transparency, smoother surfaces, hermetic vias, and a reliable platform for multiple semiconductors is growing in the areas of MEMS, Biometric Sensors, Medical, Life Sciences, and Micro Display packaging. This paper will discuss the types of glass suitable for packaging needs, hole creation methods and key specifications required for through glass vias (TGV's). Creating redistribution layers (RDL) or circuit layers on both sides of large thin glass wafer poses several challenges, which this paper will discuss, as well as, performance and reliability of the circuit layers on TGV wafers or substrates. Additionally, there are glass-to-glass welding techniques that can be utilized in conjunction with TGV wafers with RDL, which provide ambient glass-to-glass attachments of lids and standoffs, which do not outgas during thermal cycle and allow the semiconductor devices to be attached first without having to reflow at lower temperatures. Fabrication challenges, reliability testing results, and performance of this semiconductor packaging system will be discussed in this paper.

Advanced SiP Packaging Technologies of IPD for Mobile Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 1-20
Author(s):  
Geun Sik Kim ◽  
Kai Liu ◽  
Flynn Carson ◽  
Seung Wook Yoon ◽  
Meenakshi Padmanathan
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Autonomous Systems ◽  
System Level ◽  
Design And Technology ◽  
Wafer Level ◽  
Future Technology ◽  
Rf Transceivers ◽  
And Performance ◽  
3D Stacking

IPD technology was originally developed as a way to replace bulky discrete passive components, but it¡¯s now gaining popularity in ESD/EMI protection applications, as well as in RF, high-brightness LED silicon sub-mounts, and digital and mixed-signal devices. Already well known as a key enabler of system-in-packages (SiPs), IPDs enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units, and digital processors. The application area for IPD will continue to evolve, especially as new packaging technology, such as flipchip, 3D stacking, wafer level packaging become available to provide vertical interconnections within the IPD. New applications like silicon interposers will become increasingly significant to the market. Currently the IPD market is being driven primarily by RF or wireless packages and applications including, but not limited to, cell phones, WiFi, GPS, WiMAX, and WiBro. In particular, applications and products in the emerging RF CMOS market that require a low cost, smaller size, and high performance are driving demand. In order to get right products in size and performance, packaging design and technology should be considered in device integration and implemented together in IPD designs. In addition, a comprehensive understanding of electrical and mechanical properties in component and system level design is important. This paper will highlight some of the recent advancements in SiP technology for IPD and integration as well as what is developed to address future technology requirements in IPD SiP solutions. The advantage and applications of SiP solution for IPD will be presented with several examples of IPD products. The design, assembly and packaging challenges and performance characteristics will be also discussed.

Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 000545-000566
Author(s):  
John Hunt ◽  
Adren Hsieh ◽  
Eddie Tsai ◽  
Chienfan Chen ◽  
Tsaiying Wang
Keyword(s):  
Temperature Cycling ◽  
Wafer Level ◽  
Development Activity ◽  
Wafer Level Packaging ◽  
First Case ◽  
Mask Design ◽  
To Come ◽  
And Performance ◽  
Reliability Performance ◽  
The Impact

Nearly half a century ago the first die bumping was developed by IBM that would later enable what we call Wafer Level Packaging. It took nearly 40 years for Wafer Level Chip Scale Packaging (WLCSP), with all of the “packaging” done while still in wafer form to come into volume production. It began with very small packages having solderball counts of 2–6 I/Os. Over the years, the I/O count has grown, but much of the industry perception has remained that WLCSPs are limited to low I/O count, low power applications. But within the last few years, there have been growing demands for WLCSP packages to expand into applications with higher levels of complexity. With the ever increasing density and performance requirements for components in mobile electronic systems, the need has developed for an expansion of applicability for Wafer Level Package (WLP) technology. Wafer Level packaging has demonstrated a higher level of component density and functionality than has been traditionally available using standard packaging. This has led to the development of WLCSPs with larger die and increasing solderball connectivity counts. Development activity has been ongoing for improved materials and structures to achieve the required reliability performance for these larger die. For this study, we have evaluated several different metallic structures used for polymer core solderballs with two different WLCSP structures. The WLCSP structures which were evaluated included a standard 4-mask design with redistribution layer (RDL), using a Polymer 1, Metal RDL, Polymer2, and Under Bump Metallization (UBM); as well as a 3-mask design with RDL, using a Polymer 1, Metal RDL, and Polymer 2. In the first case, the solderballs are bonded to the UBM, while in the second case the balls are bonded to the RDL, using the Polymer 2 layer as the solder wettable defining layer. All of the combinations are tested using the standard JEDEC Temperature Cycling on Board (TCOB) and Drop Test (DT) methodologies. The two different metallurgies of the polymer core solderballs appear to react differently to the two different WLCSP structures. This suggests that the polymer core solderball compositions may perform best when optimized for the specific WLCSP structures that are manufactured. We will review the results of the impact of the different polymer core metallurgies on the TCOB and DT reliability performance of the WLCSPs, showing the interactions of these materials with the two WLCSP structures.

Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging Applications

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000791-000810
Author(s):  
Jeb Flemming ◽  
Roger Cook ◽  
Kevin Dunn ◽  
James Gouker
Keyword(s):  
Cost Effective ◽  
High Density ◽  
Consumer Electronics ◽  
Liquid Crystal Polymers ◽  
Portable Devices ◽  
Signal Loss ◽  
Wafer Level ◽  
Advanced Packaging ◽  
And Performance ◽  
Optical Waveguiding

Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC product development. Traditional packaging approaches to address the needs in these “High Density Portable” devices, including FR4, liquid crystal polymers, and Low Temperature Co-Fire Ceramics, are running into fundamental limits in packaging layer thinness, high density interconnects (HDI) size and density, and do not present solutions to in-package thermal management, and optical waveguiding. In this talk, 3D Glass Solutions will present on our efforts to create advanced microelectronic packing solutions using our APEX™ Glass ceramic which offers a single material capable of being simultaneously used for ultra-HDI through glass vias (TGVs), optical waveguiding, and in-package microfluidic cooling. In this talk we will discuss our latest results in wafer-level microfabrication of packaging solutions. We will present on our efforts for creating copper filled vias, surface metallization, and passivation. Furthermore, we will present our efforts in exploring this material to produce (1) ultra-HDI glass interposers, with TGVs as small as 12 microns, with 14 micron center –to-center, (2) advanced RF packages with unique surface architectures designed to minimize signal loss, and (3) creating wave guiding structures in HDI packages.

BCB-Based Dry Film low k Permanent Polymer with sub 4-μm Vias for Advanced WLP and FO-WLP Applications

2015 ◽  
Vol 2015 (1) ◽  
pp. 000079-000085 ◽  
Author(s):  
Michael Toepper ◽  
Tanja Braun ◽  
Robert Gernhardt ◽  
Martin Wilke ◽  
Piotr Mackowiak ◽  
...  
Keyword(s):  
Laser Scanning ◽  
New Technology ◽  
Side Wall ◽  
Wafer Level ◽  
Major Barrier ◽  
Wafer Level Packaging ◽  
And Performance ◽  
Low K ◽  
Metallization Process ◽  
Dry Film

There is a strong demand to increase the routing density of the RDL to match the requirements for future microelectronic systems which are mainly miniaturization and performance. Photo-resists for structuring the metallization or acting as a mold for electroplating are common for very fine lines and spaces due to the developments in the front-end processing. For example chemical amplified Photo-resists are now moving in the back-end and wafer level packaging process. The results are mainly governed by the performance of the equipment i.e. the photo-tool. This is different for the permanent dielectric polymer material. The major difference in photo-resists and dielectric photo-polymer are the different functions of the material systems. Photo-resists are only temporary masks for subsequent process steps like etching and plating. This is different for the photo-polymers which are a permanent part of the future systems. In this paper a new technology is discussed which uses a laser scanning ablation process and BCB-Based Dry Film low k Permanent Polymer. Laser ablation of polymers is in principle not a new technology. Low speed and high cost was the major barrier. But the combination of a scanning technology together with quartz masks has opened this technology to overcome the limitation of the current photo-polymer process. The new technology is described in detail and the results of structuring BCB-Based Films down to less than 4 μm via diameter in a 15 μm thick film has been shown. The via side wall can be controlled by the fluence of the laser pulse. Test structures have been designed and fabricated to demonstrate the excellent electrical resistivity of the vias using a two-layer metallization process.

scholarly journals Reliability and Performance of Wafer Level Fan Out Package for Automotive Radar

2021 ◽  
Vol 34 (1) ◽  
pp. 32-39
Author(s):  
Walter Hartner ◽  
Martin Niessner ◽  
Francesca Arcioni ◽  
Markus Fink ◽  
Christian Geissler ◽  
...  
Keyword(s):  
Phase Shift ◽  
Thermal Performance ◽  
Integrated Circuit ◽  
Solder Ball ◽  
Mechanical Performance ◽  
Special Focus ◽  
Wafer Level ◽  
Automotive Radar ◽  
Thermal Measurements ◽  
The Impact

Embedded wafer level ball grid array (eWLB) or FO-WLP (Fan-out wafer-level packaging) is investigated as a package for MMICs (Monolithic Microwave Integrated Circuit) for automotive radar applications in the 77GHz range. Special focus is put on the thermo-mechanical performance to achieve automotive quality targets. The typical fatigue modes “solder ball fatigue” and “copper fatigue”, evolving during thermo-mechanical stress like cycling on board will be discussed. Simulation as well as experimental preparation results for typical fatigue levels are given. In addition, several influencing parameters are listed and rated regarding their effectiveness. The theoretical framework why solder ball fatigue is the only failure mode causing electrical failure is provided.   The impact of different thermo-mechanically driven fatigue modes is discussed. The two important parameters to be considered for the functionality of the Radar system are RF (Radio Frequency) and thermal performance.   For elaborating the RF performance with present fatigue modes, the phase shift between different channels and pads is analyzed by full-wave EM (Electromagnetic) simulation. It is found that for fatigue levels up to 90% the phase shift stays below specification for single fatigue modes and may approach specification only for an unlikely combination of all 90% fatigue modes.   For assessing the thermal performance with present fatigue modes, thermal simulation as well as thermal measurements are used. Assuming 50% degradation in average for all thermal balls, an increase in RTH of up to about 30% is seen. On average for all thermal measurements, the deviation between measurement and simulation is within ±1°C.

M-Series with Adaptive Patterning for High-Yield Fan-Out SIP

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 000751-000773
Author(s):  
Craig Bishop ◽  
Suresh Jayaraman ◽  
Boyd Rogers ◽  
Chris Scanlan ◽  
Tim Olson
Keyword(s):  
New Technology ◽  
Minimum Size ◽  
High Yield ◽  
Wafer Level ◽  
Design Rules ◽  
Optical Scanner ◽  
Wafer Level Packaging ◽  
And Performance ◽  
The Cost ◽  
Semiconductor Chips

Fan-Out Wafer Level Packaging (FOWLP) holds immediate promise for packaging semiconductor chips with higher interconnect density than the incumbent Wafer Level Chip Scale Packaging (WLCSP). FOWLP enables size and performance capabilities similar to WLCSP, while extending capabilities to include multi-device system-in-packages. FOWLP can support applications that integrate multiple heterogeneously processed die at lower cost than 2.5D silicon interposer technologies. Current industry challenges with die position yield after die placement and molding result in low-density design rules and the high-cost of accurate die placement. Efficiently handling die shift is essential for making FOWLP cost-competitive with other technologies such as FCCSP and QFN. This presentation will provide an overview of Adaptive Patterning, a new technology for overcoming variability of die positions after placement and molding. In this process, an optical scanner is used to measure the true XY position and rotation of each die after panelization. The die measurements are then fed into a proprietary software engine that generates a unique pattern for each package. The resulting patterns are dispatched to a lithography system, which dynamically implements the unique patterns for all packages within a panel. For system-in-packages, this process offers a unique advantage over a fixed pattern: each die shift can be handled independently. With a fixed pattern, the design tolerances need to be large enough for all die to shift in opposing directions, otherwise yield loss in incurred. With Adaptive Patterning, vias and RDL features remain at minimum size and are matched to the measured die shift. The die-to-die interconnects are dynamically generated and account for the unique position of each die. Thus, Adaptive Patterning retains the same high-density design rules regardless of how many die are in a package. Adaptive Patterning provides the capability to use high-throughput die placement to drive down cost, while enabling higher-density system-in-package interconnect. With this technology the industry can finally realize the cost, flexibility, and form factor benefits of FOWLP.

Low-cost eWLB packaging for automotive radar MMICs in the 76–81 GHz range

2013 ◽  
Vol 5 (1) ◽  
pp. 25-34 ◽  
Author(s):  
J. Böck ◽  
M. Wojnowski ◽  
C. Wagner ◽  
H. Knapp ◽  
W. Hartner ◽  
...  
Keyword(s):  
System Integration ◽  
Low Cost ◽  
Wafer Level ◽  
Automotive Radar ◽  
Package Design ◽  
Radar Sensors ◽  
Radar Systems ◽  
Plastic Package ◽  
Rf Performance ◽  
Near Future

Embedded wafer-level ball grid array (eWLB) is investigated as a low-cost plastic package for automotive radar applications in the 76–81 GHz range. Low transmission losses from chip to package and board are achieved by appropriate circuit and package design. Special measures are taken to effectively remove the heat from the package and to optimize the package process to achieve automotive quality targets. A 77 GHz radar chip set in eWLB package is developed, which can be applied on the system board using standard solder reflow assembly. These radar MMICs provide excellent radio frequency (RF) performance for the next generation automotive radar sensors. The potential for even higher system integration is shown by a radar transceiver with antennas integrated in the eWLB package. These results demonstrate that eWLB technology is an attractive candidate to realize low-cost radar systems and to enable radar safety affordable for everyone in the near future.

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