scholarly journals Digital Performance of OCTO Layout Style on SOI MOSFET at High Temperature Environment

2019 ◽  
Vol 14 (2) ◽  
pp. 1-8
Author(s):  
Egon Henrique Salerno Galembeck ◽  
Denis Flandre ◽  
Christian Renaux ◽  
Salvador Pinillos Gimenez
Keyword(s):  
High Temperature ◽  
Field Effect Transistors ◽  
Drain Current ◽  
Cmos Technology ◽  
Silicon On Insulator ◽  
Oxide Semiconductor ◽  
Electrical Performance ◽  
Soi Mosfet ◽  
Temperature Conditions ◽  
Channel Lengths

This present paper performs an experimental comparative study of the main digital parameters and figures of merit of the octagonal layout style for the planar Silicon-On-Insulator (SOI) Metal-Oxide-Semiconductor (MOS) Field Effect Transistors (MOSFET), named OCTO SOI MOSFETs (OSM) in comparison with the typical rectangular one at high temperature environments. The devices were manufactured with the 1 mm SOI (CMOS) technology. The results demonstrate that the OSM is capable of keeping active the Longitudinal Corner Effect (LCE), the PArallel Connection of MOSFETs with Different Channel Lengths Effect (PAMDLE) and the Deactivate the Parasitic MOSFETs of the Bird’s Beak Regions Effect (DEPAMBBRE) at high temperature conditions. Therefore, the OSM is able to continue to have a better electrical performance than the one found in the rectangular SOI MOSFET (RSM) counterparts, regarding the same gate areas and bias conditions.  To illustrate, its on-state drain current (ION) and off-state drain current (IOFF) are respectively 186% higher and 64% smaller in relation to its RSM counterparts at high temperature conditions.

scholarly journals Revisiting Analytical Models of N-Type Symmetric Double-Gate MOSFETs Shaded Conditions

2020 ◽  
Vol 24 (1) ◽  
Author(s):  
Rekib Uddin Ahmed ◽  
Prabir Saha
Keyword(s):  
Integrated Circuits ◽  
Field Effect Transistors ◽  
Drain Current ◽  
Cmos Technology ◽  
Channel Length ◽  
Oxide Semiconductor ◽  
Analytical Models ◽  
Double Gate ◽  
Short Channel ◽  
Channel Effects

Nowadays, the endlessly increasing demand for faster and complex integrated circuits (IC) has been fuelled by the scaling of metal-oxide-semiconductor field-effect-transistors (MOSFET) to smaller dimensions. The continued scaling of MOSFETs approaches its physical limits due to short-channel effects (SCE). Double-gate (DG) MOSFET is one of the promising alternatives as it offers better immunity towards SCEs and can be scaled to the shortest channel length. In future, ICs can be designed using DG-CMOS technology for which mathematical models depicting the electrical characteristics of the DG MOSFETs are foremost needed. In this paper, a review on n-type symmetric DG MOSFETs models has been presented based on the analyses of electrostatic potential distribution, threshold voltage, and drain-current models. Mathematical derivations of the device models are described elaborately, and numerical simulations are also carried out to validate the replicability of models.

scholarly journals Impact of Structural Aspect, Metal Gate and Channel Material on UTB-SOI-MOSFET

2019 ◽  
Vol 9 (1) ◽  
pp. 1638-1642
Keyword(s):  
Field Effect Transistors ◽  
Silicon Film ◽  
Structural Aspect ◽  
Silicon On Insulator ◽  
Oxide Semiconductor ◽  
Thin Body ◽  
Metal Gate ◽  
Short Channel ◽  
Soi Mosfet ◽  
Utb Soi Mosfet

Ultra Thin Body Silicon on Insulator Metal Oxide Semiconductor Field Effect Transistors (UTB-SOI-MOSFETs) provide better immunity to Short Channel Effects (SCEs). But the behaviour changes at miniaturization and still the many unexplored effects need to be analysied. Here in this paper, Drain Induced Barrier Lowering (DIBL) and sub-threshold Slope (SS) variation of a n-channel UTB-SOI-MOSFET have been analyzed by changing the device structural aspects like gate length (LG), BOX thickness (tBOX) and Silicon film thickness (tSi). Also, the effect of intrinsic parameters as metal gate work function and channel material variation on DIBL and sub-threshold Slope (SS) variation has been analyzed

scholarly journals Cellular Automata Studies of Vertical Silicon Devices

VLSI Design ◽  
1998 ◽  
Vol 8 (1-4) ◽  
pp. 111-115
Author(s):  
M. Saraniti ◽  
G. Zandler ◽  
G. Formicone ◽  
S. Goodnick
Keyword(s):  
Cellular Automata ◽  
Impact Ionization ◽  
Field Effect Transistors ◽  
Drain Current ◽  
Oxide Semiconductor ◽  
Minor Importance ◽  
Semiconductor Interface ◽  
Silicon Devices ◽  
Channel Lengths ◽  
Doping Profiles

We present systematic theoretical Cellular Automata (CA) studies of a novel nanometer scale Si device, namely vertically grown Metal Oxide Field Effect Transistors (MOSFET) with channel lengths between 65 and 120 nm. The CA simulations predict drain characteristics and output conductance as a function of gate length. The excellent agreement with available experimental data indicates a high quality oxide/semiconductor interface. Impact ionization is shown to be of minor importance. For inhomogeneous p-doping profiles along the channel, significantly improved drain current saturation is predicted.

scholarly journals Using the Hexagonal Layout Style for MOSFETs to Boost the Device Matching in Ionizing Radiation Environments

2020 ◽  
Vol 15 (2) ◽  
pp. 1-5
Author(s):  
Vinicius Vono Peruzzi ◽  
William Cruz ◽  
Gabriel Augusto Da Silva ◽  
Eddy Simoen ◽  
Cor Claeys ◽  
...  
Keyword(s):  
Silicon Germanium ◽  
Field Effect Transistors ◽  
Alpha Angle ◽  
Cmos Technology ◽  
Channel Length ◽  
Oxide Semiconductor ◽  
Electrical Performance ◽  
X Rays ◽  
Length Effect ◽  
Corner Effect

This paper describes an experimental comparative study of the matching between conventional (rectangular gate shape) and Diamond (hexagonal gate geometry) n-channel Metal-Oxide-Semiconductor (MOS) Field Effect Transistors (MOSFETs), which were manufactured in an 130 nm Silicon-Germanium Bulk Complementary MOS (CMOS) technology and exposed to different X-rays Total Ionizing Doses (TIDs). The results indicate that the Diamond layout style with alpha () angle equal to 90˚ for MOSFETs is capable of boosting the device matching by at least 17% regarding the electrical pa-rameters studied (Threshold Voltage and Subthreshold Slope) as compared with the conventional MOSFET counterparts, considering that they present the same gate area, channel width, bias conditions and for the same TID. This is due to the Longitudinal Corner Effect (LCE). Parallel MOSFETs with Different Channel Length Effect (PAMDLE) and Deactivation of Parasitic MOSFETs in the Bird’s Beak Regions Effect (DEPAMBBRE) present in the structure of Diamond MOSFETs. Therefore, the Diamond layout style can be consid-ered an alternative hardness-by-design (HBD) layout strategy to boost the electrical performance and TID tolerance of MOSFETs enabling analog or radio-frequency CMOS inte-grated circuits (ICs) applications.

Projected Performance of Sub-10 nm GaN-based Double Gate MOSFETs

2017 ◽  
Vol 2 (2) ◽  
pp. 15-19 ◽  
Author(s):  
Md. Saud Al Faisal ◽  
Md. Rokib Hasan ◽  
Marwan Hossain ◽  
Mohammad Saiful Islam
Keyword(s):  
High Speed ◽  
Field Effect Transistors ◽  
Cmos Technology ◽  
Channel Length ◽  
Capacitive Coupling ◽  
Oxide Semiconductor ◽  
Double Gate ◽  
Short Channel ◽  
Channel Effects ◽  
Silvaco Atlas

GaN-based double gate metal-oxide semiconductor field-effect transistors (DG-MOSFETs) in sub-10 nm regime have been designed for the next generation logic applications. To rigorously evaluate the device performance, non-equilibrium Green’s function formalism are performed using SILVACO ATLAS. The device is turn on at gate voltage, VGS =1 V while it is going to off at VGS = 0 V. The ON-state and OFF-state drain currents are found as 12 mA/μm and ~10-8 A/μm, respectively at the drain voltage, VDS = 0.75 V. The sub-threshold slope (SS) and drain induced barrier lowering (DIBL) are ~69 mV/decade and ~43 mV/V, which are very compatible with the CMOS technology. To improve the figure of merits of the proposed device, source to gate (S-G) and gate to drain (G-D) distances are varied which is mentioned as underlap. The lengths are maintained equal for both sides of the gate. The SS and DIBL are decreased with increasing the underlap length (LUN). Though the source to drain resistance is increased for enhancing the channel length, the underlap architectures exhibit better performance due to reduced capacitive coupling between the contacts (S-G and G-D) which minimize the short channel effects. Therefore, the proposed GaN-based DG-MOSFETs as one of the excellent promising candidates to substitute currently used MOSFETs for future high speed applications.

AlGaN/GaN Metal-Oxide-Semiconductor Heterostructure Field-Effect Transistors (MOSHFETs) with the Delta-Doped Barrier Layer

2002 ◽  
Vol 743 ◽  
Author(s):  
Z. Y. Fan ◽  
J. Li ◽  
J. Y. Lin ◽  
H. X. Jiang ◽  
Y. Liu ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Cutoff Frequency ◽  
Drain Current ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Semiconductor Heterostructure ◽  
Heterostructure Field Effect Transistors ◽  
Gate Control

ABSTRACTThe fabrication and characterization of AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with the δ-doped barrier are reported. The incorporation of the SiO2 insulated-gate and the δ-doped barrier into HFET structures reduces the gate leakage and improves the 2D channel carrier mobility. The device has a high drain-current-driving and gate-control capabilities as well as a very high gate-drain breakdown voltage of 200 V, a cutoff frequency of 15 GHz and a maximum frequency of oscillation of 34 GHz for a gate length of 1 μm. These characteristics indicate a great potential of this structure for high-power-microwave applications.

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