Automated Detection of Pin Defects on Counterfeit Microelectronics

2018 ◽  
Author(s):  
Pallabi Ghosh ◽  
Domenic Forte ◽  
Damon L. Woodard ◽  
Rajat Subhra Chakraborty
Keyword(s):  
Integrated Circuits ◽  
Depth Map ◽  
Optical Microscope ◽  
Automated Detection ◽  
Detection Methods ◽  
Global Supply Chains ◽  
Subject Matter Experts ◽  
Security Breaches ◽  
The Past ◽  
Skilled Subject

Abstract Counterfeit electronics constitute a fast-growing threat to global supply chains as well as national security. With rapid globalization, the supply chain is growing more and more complex with components coming from a diverse set of suppliers. Counterfeiters are taking advantage of this complexity and replacing original parts with fake ones. Moreover, counterfeit integrated circuits (ICs) may contain circuit modifications that cause security breaches. Out of all types of counterfeit ICs, recycled and remarked ICs are the most common. Over the past few years, a plethora of counterfeit IC detection methods have been created; however, most of these methods are manual and require highly-skilled subject matter experts (SME). In this paper, an automated bent and corroded pin detection methodology using image processing is proposed to identify recycled ICs. Here, depth map of images acquired using an optical microscope are used to detect bent pins, and segmented side view pin images are used to detect corroded pins.

Fluorocarbon Precursor for High Aspect Ratio via Milling in Focused Ion Beam Modification of Integrated Circuits

2004 ◽  
Author(s):  
Valery Ray
Keyword(s):  
Side Effects ◽  
Aspect Ratio ◽  
Integrated Circuits ◽  
High Aspect Ratio ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Enabling Technology ◽  
Si Substrate ◽  
Ion Beam Modification ◽  
The Past

Abstract Gas Assisted Etching (GAE) is the enabling technology for High Aspect Ratio (HAR) circuit access via milling in Focused Ion Beam (FIB) circuit modification. Metal interconnect layers of microelectronic Integrated Circuits (ICs) are separated by Inter-Layer Dielectric (ILD) materials, therefore HAR vias are typically milled in dielectrics. Most of the etching precursor gases presently available for GAE of dielectrics on commercial FIB systems, such as XeF2, Cl2, etc., are also effective etch enhancers for either Si, or/and some of the metals used in ICs. Therefore use of these precursors for via milling in dielectrics may lead to unwanted side effects, especially in a backside circuit edit approach. Making contacts to the polysilicon lines with traditional GAE precursors could also be difficult, if not impossible. Some of these precursors have a tendency to produce isotropic vias, especially in Si. It has been proposed in the past to use fluorocarbon gases as precursors for the FIB milling of dielectrics. Preliminary experimental evaluation of Trifluoroacetic (Perfluoroacetic) Acid (TFA, CF3COOH) as a possible etching precursor for the HAR via milling in the application to FIB modification of ICs demonstrated that highly enhanced anisotropic milling of SiO2 in HAR vias is possible. A via with 9:1 aspect ratio was milled with accurate endpoint on Si and without apparent damage to the underlying Si substrate.

ATE Failure Isolation Methodologies for Failure Analysis, Design Debug and Yield Enhancement

1998 ◽  
Author(s):  
D.S. Patrick ◽  
L.C. Wagner ◽  
P.T. Nguyen
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Yield Enhancement ◽  
Production Test ◽  
Final Test ◽  
Critical Design ◽  
The Past ◽  
Product Engineering ◽  
Time Savings ◽  
Analysis Design

Abstract Failure isolation and debug of CMOS integrated circuits over the past several years has become increasingly difficult to perform on standard failure analysis functional testers. Due to the increase in pin counts, clock speeds, increased complexity and the large number of power supply pins on current ICS, smaller and less equipped testers are often unable to test these newer devices. To reduce the time of analysis and improve the failure isolation capabilities for failing ICS, failure isolation is now performed using the same production testers used in product development, multiprobe and final test. With these production testers, the test hardware, program and pattern sets are already available and ready for use. By using a special interface that docks the production test head to failure isolation equipment such as the emission microscope, liquid crystal station and E-Beam prober, the analyst can quickly and easily isolate the faillure on an IC. This also enables engineers in design, product engineering and the waferfab yield enhancement groups to utilize this equipment to quickly solve critical design and yield issues. Significant cycle time savings have been achieved with the migration to this method of electrical stimulation for failure isolation.

scholarly journals Deep Recurrent Neural Networks for Automatic Detection of Sleep Apnea from Single Channel Respiration Signals

Sensors ◽  
2020 ◽  
Vol 20 (18) ◽  
pp. 5037
Author(s):  
Hisham ElMoaqet ◽  
Mohammad Eid ◽  
Martin Glos ◽  
Mutaz Ryalat ◽  
Thomas Penzel
Keyword(s):  
Feature Extraction ◽  
Sleep Apnea ◽  
Short Term Memory ◽  
Single Channel ◽  
Automated Detection ◽  
Detection Methods ◽  
Short Term ◽  
Term Memory ◽  
Deep Recurrent Neural Network ◽  
Long Short Term Memory

Sleep apnea is a common sleep disorder that causes repeated breathing interruption during sleep. The performance of automated apnea detection methods based on respiratory signals depend on the signals considered and feature extraction methods. Moreover, feature engineering techniques are highly dependent on the experts’ experience and their prior knowledge about different physiological signals and conditions of the subjects. To overcome these problems, a novel deep recurrent neural network (RNN) framework is developed for automated feature extraction and detection of apnea events from single respiratory channel inputs. Long short-term memory (LSTM) and bidirectional long short-term memory (BiLSTM) are investigated to develop the proposed deep RNN model. The proposed framework is evaluated over three respiration signals: Oronasal thermal airflow (FlowTh), nasal pressure (NPRE), and abdominal respiratory inductance plethysmography (ABD). To demonstrate our results, we use polysomnography (PSG) data of 17 patients with obstructive, central, and mixed apnea events. Our results indicate the effectiveness of the proposed framework in automatic extraction for temporal features and automated detection of apneic events over the different respiratory signals considered in this study. Using a deep BiLSTM-based detection model, the NPRE signal achieved the highest overall detection results with true positive rate (sensitivity) = 90.3%, true negative rate (specificity) = 83.7%, and area under receiver operator characteristic curve = 92.4%. The present results contribute a new deep learning approach for automated detection of sleep apnea events from single channel respiration signals that can potentially serve as a helpful and alternative tool for the traditional PSG method.

Some Properties and Detection Methods of Paper Sludge

2012 ◽  
Vol 560-561 ◽  
pp. 52-56
Author(s):  
Kai Zhang ◽  
Chao Jun Wu ◽  
Jia Chuan Chen
Keyword(s):  
Water Content ◽  
Organic Material ◽  
Ph Value ◽  
Optical Microscope ◽  
Ash Content ◽  
Detection Methods ◽  
Paper Sludge ◽  
Sludge Treatment ◽  
Material Content ◽  
The Third

Some properties of paper sludge were analyzed, including water content, organic material content, pH value, fiber content, ash content ,C, H, S, N content and metal content of sludge in three sedimentation tanks.Besides,COD,SS, sludge concentration were analyzed and optical microscope photoes of sludge were got.The results showed that water content was high, organic material content was high, pH value of three sludges was alkalescent, metal elements were varied, lots of bacteria in wet sludge. From the first tank to the third one,COD and SS are gradually diminishing The research of sludge’s properties may be helpful to sludge treatment.

scholarly journals Fraud in Animal Origin Food Products: Advances in Emerging Spectroscopic Detection Methods over the Past Five Years

Foods ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 1069 ◽  
Author(s):  
Abdo Hassoun ◽  
Ingrid Måge ◽  
Walter F. Schmidt ◽  
Havva Tümay Temiz ◽  
Li Li ◽  
...  
Keyword(s):  
Analytical Techniques ◽  
Food Products ◽  
Alternative Methods ◽  
Detection Methods ◽  
Animal Origin ◽  
Spectroscopic Techniques ◽  
Food Fraud ◽  
The Past ◽  
Art Research ◽  
Animal Origin Food

Animal origin food products, including fish and seafood, meat and poultry, milk and dairy foods, and other related products play significant roles in human nutrition. However, fraud in this food sector frequently occurs, leading to negative economic impacts on consumers and potential risks to public health and the environment. Therefore, the development of analytical techniques that can rapidly detect fraud and verify the authenticity of such products is of paramount importance. Traditionally, a wide variety of targeted approaches, such as chemical, chromatographic, molecular, and protein-based techniques, among others, have been frequently used to identify animal species, production methods, provenance, and processing of food products. Although these conventional methods are accurate and reliable, they are destructive, time-consuming, and can only be employed at the laboratory scale. On the contrary, alternative methods based mainly on spectroscopy have emerged in recent years as invaluable tools to overcome most of the limitations associated with traditional measurements. The number of scientific studies reporting on various authenticity issues investigated by vibrational spectroscopy, nuclear magnetic resonance, and fluorescence spectroscopy has increased substantially over the past few years, indicating the tremendous potential of these techniques in the fight against food fraud. It is the aim of the present manuscript to review the state-of-the-art research advances since 2015 regarding the use of analytical methods applied to detect fraud in food products of animal origin, with particular attention paid to spectroscopic measurements coupled with chemometric analysis. The opportunities and challenges surrounding the use of spectroscopic techniques and possible future directions will also be discussed.

scholarly journals Detecting Ca2+ sparks on stationary and varying baselines

2011 ◽  
Vol 301 (3) ◽  
pp. C717-C728 ◽  
Author(s):  
Peter Bankhead ◽  
C. Norman Scholfield ◽  
Tim M. Curtis ◽  
J. Graham McGeown
Keyword(s):  
Automated Detection ◽  
Noise Model ◽  
Detection Methods ◽  
Data Sets ◽  
Baseline Subtraction ◽  
Variance Stabilization ◽  
Reliable Detection ◽  
Large Populations ◽  
Microscopy Images ◽  
Straightforward Approach

Studies concerning the physiological significance of Ca2+ sparks often depend on the detection and measurement of large populations of events in noisy microscopy images. Automated detection methods have been developed to quickly and objectively distinguish potential sparks from noise artifacts. However, previously described algorithms are not suited to the reliable detection of sparks in images where the local baseline fluorescence and noise properties can vary significantly, and risk introducing additional bias when applied to such data sets. Here, we describe a new, conceptually straightforward approach to spark detection in linescans that addresses this issue by combining variance stabilization with local baseline subtraction. We also show that in addition to greatly increasing the range of images in which sparks can be automatically detected, the use of a more accurate noise model enables our algorithm to achieve similar detection sensitivities with fewer false positives than previous approaches when applied both to synthetic and experimental data sets. We propose, therefore, that it might be a useful tool for improving the reliability and objectivity of spark analysis in general, and describe how it might be further optimized for specific applications.

Automated detection methods for architectural distortions around skinline and within mammary gland on mammograms

2003 ◽  
Vol 1256 ◽  
pp. 950-955 ◽  
Author(s):  
T Matsubara ◽  
T Ichikawa ◽  
T Hara ◽  
H Fujita ◽  
S Kasai ◽  
...  
Keyword(s):  
Mammary Gland ◽  
Automated Detection ◽  
Detection Methods

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

2011 ◽  
Author(s):  
Su Wang ◽  
S. W. Ricky Lee
Keyword(s):  
Integrated Circuits ◽  
Cross Sections ◽  
Three Dimensional ◽  
Optical Microscope ◽  
Copper Plating ◽  
Ray Method ◽  
Plating Bath ◽  
Bottom Up ◽  
Electroplating Process ◽  
Filling Mechanism

There is an increasing demand for electronic devices with smaller sizes, higher performance and increased functionality. The development of vertical interconnects or through silicon vias (TSV) may be one of the most promising approaches to provide the three-dimensional (3D) integration of integrated circuits (IC). It is possible to improve the system’s performance with shorter RC delay, shorter signal paths and less power consumption. Electroplating process is one of the major contributors to the cost of TSV. Thus, plating time is one of our major concerns in TSV applications. About 80% of the TSVs are filled with copper due to its high conductivity and wide applications in multilayer wiring. Even though the electroplating of copper for interconnections is well established for the copper damascene micro-fabrication process, it has been shown that the filling of TSVs with copper plating is a different situation due to the much larger dimensions of TSVs. Generally the filling mechanism consists of conformal plating and bottom up plating. A 100% bottom up filling is preferred for copper filling in TSV. A seam may exist in via if the majority of filling mechanism is conformal plating. Thus, the bottom up filling profile is one the critical points to achieve void free filling. In this study, the void free copper filling TSVs with diameter from 10–30 m and depth from 50–150 m will be investigated by copper electroplating. A near 100% bottom up plating formula was developed in order to achieve void free and seam free filling. Filling performance of this plating formula was evaluated by examining vertical cross-sections and top-down cross-section of the filled TSVs using optical microscope and X-ray method. Pretreatment process and relationship with diffusion time will be also studied with respect to the TSV plating process. The effect of concentration of copper, acid and additives will be optimized to achieve the desired bottom up plating process. The ultimate goal is to achieve TSV plating with shorter plating time and better consistency. Electroplating experiment was conducted with an industrial electroplating tool. Successful plating results are demonstrated with optimized plating bath and plating mechanism. The void free and seam free copper deposition results are shown with minimized overburden. The time taken for the plating process is also greatly reduced with this near 100% bottom up plating formula. The benefits of this novel plating mechanism will be discussed in detail in this paper.

scholarly journals DiODe v2: Unambiguous and Fully-Automated Detection of Directional DBS Lead Orientation

2021 ◽  
Vol 11 (11) ◽  
pp. 1450
Author(s):  
Till A. Dembek ◽  
Alexandra Hellerbach ◽  
Hannah Jergas ◽  
Markus Eichner ◽  
Jochen Wirths ◽  
...  
Keyword(s):  
Deep Brain Stimulation ◽  
Open Source ◽  
Brain Stimulation ◽  
Center Of Mass ◽  
Automated Detection ◽  
Ct Scans ◽  
True Solution ◽  
X Ray ◽  
The Past ◽  
Deep Brain

Directional deep brain stimulation (DBS) leads are now widely used, but the orientation of directional leads needs to be taken into account when relating DBS to neuroanatomy. Methods that can reliably and unambiguously determine the orientation of directional DBS leads are needed. In this study, we provide an enhanced algorithm that determines the orientation of directional DBS leads from postoperative CT scans. To resolve the ambiguity of symmetric CT artifacts, which in the past, limited the orientation detection to two possible solutions, we retrospectively evaluated four different methods in 150 Cartesia™ directional leads, for which the true solution was known from additional X-ray images. The method based on shifts of the center of mass (COM) of the directional marker compared to its expected geometric center correctly resolved the ambiguity in 100% of cases. In conclusion, the DiODe v2 algorithm provides an open-source, fully automated solution for determining the orientation of directional DBS leads.

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