scholarly journals Defect- and H-Free Stoichiometric Silicon Carbide by Thermal CVD from the Single Source Precursor Trisilacyclohexane

2022 ◽  
Vol 3 (1) ◽  
pp. 27-40
Author(s):  
Alain E. Kaloyeros ◽  
Jonathan Goff ◽  
Barry Arkles
Keyword(s):  
Silicon Carbide ◽  
Photoelectron Spectroscopy ◽  
Film Growth ◽  
Reference Value ◽  
Chemical Vapor ◽  
Structural Defects ◽  
Single Source ◽  
High Temperature Electronics ◽  
Single Source Precursor ◽  
High Vapor

Stoichiometric silicon carbide (SiC) thin films were grown using thermal chemical vapor deposition (TCVD) from the single source precursor 1,3,5-trisilacyclohexane (TSCH) on c-Si (100) substrates within an optimized substrate temperature window ranging from 650 to 850 °C. X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (FTIR) analyses revealed that the as-deposited films consisted of a Si-C matrix with a Si:C ratio of ~1:1. FTIR and photoluminescence (PL) spectrometry studies showed that films deposited ≥ 750 °C were defect- and H-free within the detection limit of the techniques used, while ellipsometry measurements yielded an as-grown SiC average refractive index of ~2.7, consistent with the reference value for the 3C-SiC phase. The exceptional quality of the films appears sufficient to overcome limitations associated with structural defects ranging from failure in high voltage, high temperature electronics to 2-D film growth. TSCH, a liquid at room temperature with good structural stability during transport and handling as well as high vapor pressure (~10 torr at 25 °C), provides a viable single source precursor for the growth of stoichiometric SiC without the need for post-deposition thermal treatment.

Nanocrystalline Silicon Carbide Film Growth Using Hot Filament CVD

1999 ◽  
Vol 593 ◽  
Author(s):  
M.B. Yu ◽  
Rusli S.F. ◽  
Yoon J. ◽  
Cui K. Chew ◽  
J. Ahn ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Photoelectron Spectroscopy ◽  
Film Growth ◽  
Chemical Vapor ◽  
Nanocrystalline Silicon ◽  
Transverse Optical ◽  
Diffraction Spectrum ◽  
Optical Phonons ◽  
X Ray ◽  
Hot Filament

ABSTRACTNanocrystalline cubic silicon carbide (nc-SiC) films embedded in an amorphous SiC matrix was fabricated by the hot filament chemical vapor deposition (HFCVD) technique using methane and silane as reactance gases. The presence of nanocrystalline grains was confirmed by the high resolution transmission electron microscope (HRTEM). x-ray photoelectron spectroscopy (XPS) measurements showed that the atomic percentages of Si and C are nearly 50%. X-ray diffraction spectrum of the sample revealed a diffraction peak of 3C-SiC (111) at 2ϕ=35.6°. Infrared absorption of the film had a strong peak at 800 cm−1 which is related to the transverse optical phonons of Si-C bonds in 3C-SiC. Raman spectrum of the sample showed that there are two peaks at 790 cm−l and 970 cm−1 which correspond to longitudinal and transverse optical phonons of SiC respectively. Room temperature photoluminescence (PL) study of these nc-SiC samples revealed a visible peak at 2.2 eV, which has not been observed so far for 3C-SiC.

scholarly journals Deposition of Boron-Doped Thin CVD Diamond Films from Methane-Triethyl Borate-Hydrogen Gas Mixture

Processes ◽  
2020 ◽  
Vol 8 (6) ◽  
pp. 666 ◽  
Author(s):  
Nikolay Ivanovich Polushin ◽  
Alexander Ivanovich Laptev ◽  
Boris Vladimirovich Spitsyn ◽  
Alexander Evgenievich Alexenko ◽  
Alexander Mihailovich Polyansky ◽  
...  
Keyword(s):  
Film Growth ◽  
Chemical Vapor ◽  
Hydrogen Gas ◽  
Diamond Growth ◽  
Structural Defects ◽  
Boron Doped Diamond ◽  
Diamond Deposition ◽  
Synthesis Conditions ◽  
Surface Etching ◽  
Boron Doped

Boron-doped diamond is a promising semiconductor material that can be used as a sensor and in power electronics. Currently, researchers have obtained thin boron-doped diamond layers due to low film growth rates (2–10 μm/h), with polycrystalline diamond growth on the front and edge planes of thicker crystals, inhomogeneous properties in the growing crystal’s volume, and the presence of different structural defects. One way to reduce structural imperfection is the specification of optimal synthesis conditions, as well as surface etching, to remove diamond polycrystals. Etching can be carried out using various gas compositions, but this operation is conducted with the interruption of the diamond deposition process; therefore, inhomogeneity in the diamond structure appears. The solution to this problem is etching in the process of diamond deposition. To realize this in the present work, we used triethyl borate as a boron-containing substance in the process of boron-doped diamond chemical vapor deposition. Due to the oxygen atoms in the triethyl borate molecule, it became possible to carry out an experiment on simultaneous boron-doped diamond deposition and growing surface etching without the requirement of process interruption for other operations. As a result of the experiments, we obtain highly boron-doped monocrystalline diamond layers with a thickness of about 8 μm and a boron content of 2.9%. Defects in the form of diamond polycrystals were not detected on the surface and around the periphery of the plate.

scholarly journals Low-Temperature Chemical Vapor Deposition Growth of MoS2 Nanodots and Their Raman and Photoluminescence Profiles

2021 ◽  
Vol 3 ◽  
Author(s):  
Larionette P. L. Mawlong ◽  
Ravi K. Biroju ◽  
P. K. Giri
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Substrate Temperature ◽  
Vapor Deposition ◽  
Photoelectron Spectroscopy ◽  
Flexible Substrate ◽  
Chemical Vapor ◽  
Structural Defects ◽  
Chemical Vapor Deposition Growth ◽  
Raman Modes

We report on the growth of an ordered array of MoS2 nanodots (lateral sizes in the range of ∼100–250 nm) by a thermal chemical vapor deposition (CVD) method directly onto SiO2 substrates at a relatively low substrate temperature (510–560°C). The temperature-dependent growth and evolution of MoS2 nanodots and the local environment of sulfur-induced structural defects and impurities were systematically investigated by field emission scanning electron microscopy, micro-Raman spectroscopy, and X-ray photoelectron spectroscopy (XPS) techniques. At the substrate temperature of 560°C, we observed mostly few-layer MoS2, and at 510°C, multilayer MoS2 growth, as confirmed from the Raman line shape analysis. With reduced substrate temperature, the density of MoS2 nanodots decreases, and layer thickness increases. Raman studies show characteristic Raman modes of the crystalline MoS2 layer, along with two new Raman modes centered at ∼346 and ∼361 cm−1, which are associated with MoO2 and MoO3 phases, respectively. Room temperature photoluminescence (PL) studies revealed strong visible PL from MoS2 layers, which is strongly blue-shifted from the bulk MoS2 flakes. The strong visible emission centered at ∼ 658 nm signifies a free excitonic transition in the direct gap of single-layer MoS2. Position-dependent PL profiles show excellent uniformity of the MoS2 layers for samples grown at 540 and 560°C. These results are significant for the low-temperature CVD growth of a few-layer MoS2 dots with direct bandgap photoluminescence on a flexible substrate.

Aerosol-assisted chemical vapor deposition of WS2 from the single source precursor WS(S2)(S2CNEt2)2

2017 ◽  
Vol 53 (55) ◽  
pp. 7728-7731 ◽  
Author(s):  
Nathaniel E. Richey ◽  
Chandler Haines ◽  
Jessica L. Tami ◽  
Lisa McElwee-White
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Single Source ◽  
Single Source Precursor

WS(S2)(S2CNEt2)2 is a single source precursor for deposition of nanostructured WS2 above 350 °C.

Single Source CVD of LiAlO2

1997 ◽  
Vol 495 ◽  
Author(s):  
Wonyong Koh ◽  
Su-Jin Ku ◽  
Yunsoo Kim
Keyword(s):  
Photoelectron Spectroscopy ◽  
Profile Analysis ◽  
Chemical Vapor ◽  
Single Source ◽  
Elastic Recoil ◽  
Elastic Recoil Detection ◽  
Si Substrates ◽  
Metal Contents ◽  
Deposited Film ◽  
Heterometallic Compound

ABSTRACTWe successfully deposited LiAlO2 films on Si substrates at 400–600 °C by single source chemical vapor deposition using a heterometallic compound, Li(O'Pr)2Al(CH3)2, which contains Li, Al, and O at the same 1:1:2 ratio as LiAlO2. Li(O'Pr)2Al(CH3)2 is sufficiently volatile to be vapor-transported at 50 °C. Elastic recoil detection and Rutherford backscattering spectroscopy analyses of a deposited film indicate that the film is stoichiometric (Li:Al:O = 1.0:1.0:2.0) and contains a few atomic percent hydrogen (5 %) and carbon (2 %). Depth profile analysis of X-ray photoelectron spectroscopy also confirms the 1:1 ratio of metal contents in the films. As-deposited films were amorphous, however, crystallized to β- or γ-LiA1O2 after annealing at 950 °C.

Low Pressure CVD Growth of AlxTi1-xN Films with Tetrakis- (Dimethylamido)Titanium (Tdmat) and Dimethyl Aluminum Hydride (DMAH) Precursors

1997 ◽  
Vol 495 ◽  
Author(s):  
Y.-M. Sun ◽  
J. Endle ◽  
J. G. Ekerdt ◽  
N. M. Russell ◽  
M. D. Healy ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Film Growth ◽  
Aluminum Hydride ◽  
Chemical Vapor ◽  
Initial Growth ◽  
Lower Growth ◽  
Al Content ◽  
Partial Pressures ◽  
Cvd Growth ◽  
C And N

ABSTRACTAlxTi1-xN film growth has been studied by a organometallic chemical vapor deposition and in-situ X-ray photoelectron spectroscopy. Terakis(dimethylamido)titanium (TDMAT) and dimethyl aluminum hydride (DMAH) were used as the Ti, N and Al precursors. AlTiN film growth was observed on SiO2/Si(100) with substrate temperatures between 200 and 400 °C. The Al content in the film is controlled by the ratio of partial pressures of the two precursors in the gas phase. The metal to C to N ratio is approximately constant at 1:1:1 for most conditions studied. The chemical states of Ti, C, and N in AlxTi1-xN and titanium-carbo-nitride (TiCN) films are identical, while the Al chemical state is nitride at low, but increasingly carbidic at high Al concentration. The initial growth rate on SiO2 was significantly suppressed by the presence of DMAH. At lower growth temperatures, the DMAH effect is more severe. Good step coverage was observed for AlxTi1-xN on 0.3 μm vias with a 3:1 aspect ratio.

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