scholarly journals Low-Frequency 1/f Noise Characteristics of Ultra-Thin AlOx-Based Resistive Switching Memory Devices with Magneto-Resistive Responses

Electronics ◽  
2021 ◽  
Vol 10 (20) ◽  
pp. 2525
Author(s):  
Jhen-Yong Hong ◽  
Chun-Yen Chen ◽  
Dah-Chin Ling ◽  
Isidoro Martínez ◽  
César González-Ruano ◽  
...  
Keyword(s):  
Resistive Switching ◽  
Empirical Relation ◽  
Low Frequency ◽  
High Resistance State ◽  
Noise Power ◽  
Memory Devices ◽  
Noise Power Spectral Density ◽  
Noise Characteristics ◽  
Wide Range ◽  
Resistance State

Low-frequency 1/f voltage noise has been employed to probe stochastic charge dynamics in AlOx-based non-volatile resistive memory devices exhibiting both resistive switching (RS) and magneto-resistive (MR) effects. A 1/fγ noise power spectral density is observed in a wide range of applied voltage biases. By analyzing the experimental data within the framework of Hooge’s empirical relation, we found that the Hooge’s parameter α and the exponent γ exhibit a distinct variation upon the resistance transition from the low resistance state (LRS) to the high resistance state (HRS), providing strong evidence that the electron trapping/de-trapping process, along with the electric field-driven oxygen vacancy migration in the AlOx barrier, plays an essential role in the charge transport dynamics of AlOx-based RS memory devices.

scholarly journals Flexible Memory Device Composed of Metal-Oxide and Two-Dimensional Material (SnO2/WTe2) Exhibiting Stable Resistive Switching

Materials ◽  
2021 ◽  
Vol 14 (24) ◽  
pp. 7535
Author(s):  
Ghulam Dastgeer ◽  
Amir Muhammad Afzal ◽  
Jamal Aziz ◽  
Sajjad Hussain ◽  
Syed Hassan Abbas Jaffery ◽  
...  
Keyword(s):  
Data Storage ◽  
Resistive Switching ◽  
High Resistance State ◽  
Building Blocks ◽  
Memory Device ◽  
Memory Storage ◽  
Memory Devices ◽  
Two Dimensional ◽  
Ag Filament ◽  
Resistance State

Two-terminal, non-volatile memory devices are the fundamental building blocks of memory-storage devices to store the required information, but their lack of flexibility limits their potential for biological applications. After the discovery of two-dimensional (2D) materials, flexible memory devices are easy to build, because of their flexible nature. Here, we report on our flexible resistive-switching devices, composed of a bilayer tin-oxide/tungsten-ditelluride (SnO2/WTe2) heterostructure sandwiched between Ag (top) and Au (bottom) metal electrodes over a flexible PET substrate. The Ag/SnO2/WTe2/Au flexible devices exhibited highly stable resistive switching along with an excellent retention time. Triggering the device from a high-resistance state (HRS) to a low-resistance state (LRS) is attributed to Ag filament formation because of its diffusion. The conductive filament begins its development from the anode to the cathode, contrary to the formal electrochemical metallization theory. The bilayer structure of SnO2/WTe2 improved the endurance of the devices and reduced the switching voltage by up to 0.2 V compared to the single SnO2 stacked devices. These flexible and low-power-consumption features may lead to the construction of a wearable memory device for data-storage purposes.

Resistive Switching Characteristics in Boron Doped Zinc Oxide Films

2015 ◽  
Vol 764-765 ◽  
pp. 87-91
Author(s):  
Fu Chien Chiu
Keyword(s):  
Zinc Oxide ◽  
Resistive Switching ◽  
Current Density ◽  
Nonvolatile Memory ◽  
High Resistance State ◽  
Switching Behavior ◽  
Memory Devices ◽  
Boron Doped ◽  
Resistance State ◽  
Increasing Temperature

In this work, metal/oxide/metal capacitors were fabricated and investigated using transparent boron-doped zinc oxide (ZnO:B) films for nonvolatile memory applications. Both top and bottom electrodes are tungsten. The average value of transmittance of ZnO:B films grown on silicon substrates is found to be about 91% in the visible light region. According to the relationship between transmittance and wavelength, the optical band gap of ZnO:B films is determined to be about 3.26 eV. The temperature dependent current-voltage curves show that the current density increases with increasing temperature in low-resistance state (LRS), meanwhile, the current density decreases with increasing temperature in high-resistance state (HRS). From the resistive switching behavior of the W/ZnO:B/W memory devices, the reset voltage which triggers the memory devices from an LRS to an HRS is independent of temperature. On the other hand, the set voltage which triggers the memory devices from an HRS to an LRS is increased with temperature.

Resistive Switching Characteristics in TiO2 ReRAM with Top Electrode of Co Selectively Formed on SAMs Printed Patterns

2007 ◽  
Vol 124-126 ◽  
pp. 603-606
Author(s):  
Sang Hee Won ◽  
Seung Hee Go ◽  
Jae Gab Lee
Keyword(s):  
Resistive Switching ◽  
Random Access ◽  
Atomic Layer ◽  
High Resistance State ◽  
Resistive Random Access Memory ◽  
Tio2 Thin Films ◽  
Selective Deposition ◽  
Precise Control ◽  
Resistance State ◽  
Switching Characteristics

Simple process for the fabrication of Co/TiO2/Pt resistive random access memory, called ReRAM, has been developed by selective deposition of Co on micro-contact printed (μ-CP) self assembled monolayers (SAMs) patterns. Atomic Layer Deposition (ALD) was used to deposit TiO2 thin films, showing its ability of precise control over the thickness of TiO2, which is crucial to obtain proper resistive switching properties of TiO2 ReRAM. The fabrication process for Co/TiO2/Pt ReRAM involves the ALD of TiO2 on sputter-deposited Pt bottom electrode, followed by μ-CP with SAMs and then selective deposition of Co. This results in the Co/TiO2/Pt structure ReRAM. For comparison, Pt/TiO2/Pt ReRAM was produced and revealing the similar switching characteristics as that of Co/TiO2/Pt, thus indicating the feasibility of Co replacement with Pt top electrode. The ratios between the high-resistance state (Off state) and the low-resistance state (On state) were larger than 102. Consequently, the selective deposition of Co with μ-CP, newly developed in this study, can simplify the process and thus implemented into the fabrication of ReRAM.

Impact of resistive switching parameters on resistive random access memory crossbar arrays

2020 ◽  
Vol 34 (12) ◽  
pp. 2050115
Author(s):  
Liping Fu ◽  
Sikai Chen ◽  
Zewei Wu ◽  
Xiaoyan Li ◽  
Mingyang You ◽  
...  
Keyword(s):  
Resistive Switching ◽  
Random Access ◽  
High Resistance State ◽  
Resistive Random Access Memory ◽  
High Density ◽  
Access Memory ◽  
Storage Density ◽  
Crossbar Array ◽  
Resistance State ◽  
Potential Impact

Sneak current issue of RRAM-based crossbar array is one of the biggest hindrances for high-density memory application. The integration of an addition selector to each cell is one of the most familiar solutions to avoid this undesired cross-talk issue, and resistive switching parameters would affect on the storage density. This paper investigates the potential impact of different resistive switching parameters on crossbar arrays with one-diode one-resistor (1D1R) and one-selector one-resistor (1S1R) architectures. Results indicate that 1S1R architecture is a more scalable technology for high-density crossbar array than 1D1R, and the storage density of 1D1R- and 1S1R-based crossbar array shows little dependence on resistance values of high-resistance state and low-resistance state, which gives a guideline for choosing appropriate selectors for RRAM crossbar array with specific parameters.

Two modes of bipolar resistive switching characteristics in asymmetric TaOx-based ReRAM cells

MRS Advances ◽  
2019 ◽  
Vol 4 (48) ◽  
pp. 2601-2607
Author(s):  
Toshiki Miyatani ◽  
Yusuke Nishi ◽  
Tsunenobu Kimoto
Keyword(s):  
Resistive Switching ◽  
High Resistance State ◽  
Opposite Polarity ◽  
Electrical Characteristics ◽  
Forming Process ◽  
Initial State ◽  
Bipolar Resistive Switching ◽  
Change Mechanism ◽  
Resistance State ◽  
Switching Characteristics

ABSTRACTImpacts of a forming process on bipolar resistive switching (RS) characteristics in Pt/TaOx/Ta2O5/Pt cells were investigated. We found that the forming resulted in a transition from an initial state to a particular high resistance state (HRS) in most of the Pt/TaOx/Ta2O5/Pt cells. Evaluation of electrical characteristics after the transition to the particular HRS revealed that two modes of bipolar RS with the conventional polarity based on valence change mechanism and with the opposite polarity could be selectively obtained by adjusting the magnitude of the applied voltage. Moreover, the cell resistance decreased gradually during set processes in the bipolar RS with the opposite polarity.

Annealing Effect of Al2O3 Tunnel Barriers in HfO2-Based ReRAM Devices on Nonlinear Resistive Switching Characteristics

2015 ◽  
Vol 15 (10) ◽  
pp. 7569-7572 ◽  
Author(s):  
Sukhyung Park ◽  
Kyoungah Cho ◽  
Jungwoo Jung ◽  
Sangsig Kim
Keyword(s):  
Resistive Switching ◽  
Conduction Mechanism ◽  
Random Access ◽  
High Resistance State ◽  
Resistive Random Access Memory ◽  
Tunnel Barrier ◽  
Tunnel Barriers ◽  
Retention Characteristics ◽  
Resistance State ◽  
Switching Characteristics

In this study, we demonstrate the enhancement of the nonlinear resistive switching characteristics of HfO2-based resistive random access memory (ReRAM) devices by carrying out thermal annealing of Al2O3 tunnel barriers. The nonlinearity of ReRAM device with an annealed Al2O3 tunnel barrier is determined to be 10.1, which is larger than that of the ReRAM device with an as-deposited Al2O3 tunnel barrier. From the electrical characteristics of the ReRAM devices with as-deposited and annealed Al2O3 tunnel barriers, it reveals that there is a trade-off relationship between nonlinearity in low-resistance state (LRS) current and the ratio of the high-resistance state (HRS) and the LRS. The enhancement of nonlinearity is attributed to a change in the conduction mechanism in the LRS of the ReRAM after the annealing. While the conduction mechanism before the annealing follows Ohmic conduction, the conduction of the ReRAM after the annealing is controlled by a trap-controlled space charge limited conduction mechanism. Additionally, the annealing of the Al2O3 tunnel barriers is also shown to improve the endurance and retention characteristics.

Influence of SiO2 Layer on Resistive Switching Properties of SiO2/CuXO Stack Structure

2011 ◽  
Vol 687 ◽  
pp. 106-111
Author(s):  
Chih Yi Liu ◽  
Yu Chen Li ◽  
Chun Hung Lai ◽  
Shih Kun Liu
Keyword(s):  
Resistive Switching ◽  
High Resistance State ◽  
Switching Behavior ◽  
Forming Process ◽  
Dc Voltage ◽  
Si Substrates ◽  
Non Volatile Memory ◽  
Resistance State ◽  
The Difference ◽  
Switching Characteristics

CuxO and SiO2thin films were deposited using a radio-frequency magnetron sputter on Pt/Ti/SiO2/Si substrates to form SiO2/CuxO/Pt and CuxO/Pt structures. The current-voltage characteristics were measured by DC voltage sweeping using a tungsten (W) probe. The two structures needed a large voltage to initiate the first resistive switching; this sweep was called the forming process. Afterwards, the resistances of the two structures could be switched reversibly between the low-resistance-state (LRS) and high-resistance-state (HRS) by applying a DC voltage. The conduction mechanisms of the LRS and the HRS were dominated by Ohmic conduction. Structures with non-destructive readout characteristics and long retention time were suitable for use in non-volatile memory. The difference between resistive switching in W-probe/SiO2/CuxO/Pt and W-probe/CuxO/Pt structures was investigated. The additional SiO2layer decreased the switching voltages and currents; this should be due to the presence of pinholes within the SiO2layer. The influence of SiO2thickness on the resistive switching characteristics was also investigated. The switching voltages and currents, except the forming voltage, decreased as the thickness of SiO2decreased. The conducting filament model with a thermochemical reaction was suggested to best explain the resistive switching behavior that was observed.

scholarly journals Electric Modulation of Conduction in MAPbBr3 Single Crystals

2020 ◽  
Author(s):  
Shanming Ke ◽  
Shangyu Luo ◽  
Jinhui Gong ◽  
Liwen Qiu ◽  
Renhong Liang ◽  
...  
Keyword(s):  
Electric Field ◽  
Single Crystals ◽  
Resistive Switching ◽  
High Resistance ◽  
High Resistance State ◽  
Pt Symmetry ◽  
Interface Trap ◽  
Electrode Area ◽  
Resistance State ◽  
Open Question

Abstract The resistive switching (RS) mechanism of hybrid organic-inorganic perovskites is an open question until now. Here, a switchable diode-like RS behavior in MAPbBr3 single crystals using Au (or Pt) symmetry electrodes is reported. Both the high resistance state (HRS) and low resistance state (LRS) are electrode-area dependent and light responsive. We propose an electric-field-driven inner p-n junction accompanied by an interface trap-controlled SCLC mechanism to explain this switchable diode-like RS behavior in MAPbBr3 single crystals.

scholarly journals Effects of Sm2O3 and V2O5 Film Stacking on Switching Behaviors of Resistive Random Access Memories

Crystals ◽  
2019 ◽  
Vol 9 (6) ◽  
pp. 318
Author(s):  
Lin ◽  
Wu ◽  
Chen
Keyword(s):  
Resistive Switching ◽  
Random Access ◽  
Single Layer ◽  
High Resistance State ◽  
Switching Behavior ◽  
Bipolar Resistive Switching ◽  
Compliance Behavior ◽  
Order Of Magnitude ◽  
Resistance State ◽  
Switching Characteristics

: In this work, the resistive switching characteristics of resistive random access memories (RRAMs) containing Sm2O3 and V2O5 films were investigated. All the RRAM structures made in this work showed stable resistive switching behavior. The High-Resistance State and Low-Resistance State of Resistive memory (RHRS/RLRS) ratio of the RRAM device containing a V2O5/Sm2O3 bilayer is one order of magnitude higher than that of the devices containing a single layer of V2O5 or Sm2O3. We also found that the stacking sequence of the Sm2O3 and V2O5 films in the bilayer structure can affect the switching features of the RRAM, causing them to exhibit both bipolar resistive switching (BRS) behavior and self-compliance behavior. The current conduction mechanisms of RRAM devices with different film structures were also discussed.

scholarly journals Resistive Switching Characteristics of HfO2 Thin Films on Mica Substrates Prepared by Sol-Gel Process

Nanomaterials ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 1124 ◽  
Author(s):  
Chao-Feng Liu ◽  
Xin-Gui Tang ◽  
Lun-Quan Wang ◽  
Hui Tang ◽  
Yan-Ping Jiang ◽  
...  
Keyword(s):  
Thin Films ◽  
Resistive Switching ◽  
Photoelectron Spectroscopy ◽  
Sol Gel ◽  
Random Access ◽  
High Resistance State ◽  
X Ray ◽  
Low Resistance ◽  
Sol Gel Process ◽  
Resistance State

The resistive switching (RS) characteristics of flexible films deposited on mica substrates have rarely been reported upon, especially flexible HfO2 films. A novel flexible Au/HfO2/Pt/mica resistive random access memory device was prepared by a sol-gel process, and a Au/HfO2/Pt/Ti/SiO2/Si (100) device was also prepared for comparison. The HfO2 thin films were grown into the monoclinic phase by the proper annealing process at 700 °C, demonstrated by grazing-incidence X-ray diffraction patterns. The ratio of high/low resistance (off/on) reached 1000 and 50 for the two devices, respectively, being relatively stable for the former but not for the latter. The great difference in ratios for the two devices may have been caused by different concentrations of the oxygen defect obtained by the X-ray photoelectron spectroscopy spectra indicating composition and chemical state of the HfO2 thin films. The conduction mechanism was dominated by Ohm’s law in the low resistance state, while in high resistance state, Ohmic conduction, space charge limited conduction (SCLC), and trap-filled SCLC conducted together.

Sign in / Sign up

Export Citation Format

Share Document