scholarly journals Fabricate of High-Strength and High-Conductivity Cu–Cr–Si Alloys through ECAP-Bc and Aging Heat Treatment

Materials ◽  
2020 ◽  
Vol 13 (7) ◽  
pp. 1603 ◽  
Author(s):  
Tingbiao Guo ◽  
Junjie Wang ◽  
Yibo Wu ◽  
Xiaoyang Tai ◽  
Zhi Jia ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Electron Backscatter Diffraction ◽  
Aging Treatment ◽  
High Strength ◽  
High Conductivity ◽  
Grain Structure ◽  
X Ray Diffraction ◽  
Angular Pressing ◽  
The Matrix ◽  
Backscatter Diffraction

The effect of equal channel angular pressing (ECAP) through the route Bc and aging treatment on the grain structure and properties of the Cu–1Cr–0.2Si alloy was investigated. Microstructure was detected by scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron backscatter diffraction (EBSD) and the mechanical properties and electrical conductivity were tested. Results shown that after ECAP, accompanying the grains refined to nano-and submicron-structure, the Cr particles were gradually spread along the grain boundaries (GBs), aging treatment promoted Cr particles dispersed in the matrix. ECAP greatly increased the ultimate tensile strength (UTS) while having a small effect on the conductivity, and aging treatment increased electrical conductivity. The stable {111}<110> texture after ECAP and the lower dislocation density after aging treatment maybe the main reasons for the high conductivity of the material.

Design of High-Strength, High-Conductivity Alloys

MRS Bulletin ◽  
1996 ◽  
Vol 21 (6) ◽  
pp. 13-18 ◽  
Author(s):  
J. Miyake ◽  
G. Ghosh ◽  
M.E. Fine
Keyword(s):  
Electrical Conductivity ◽  
Computer Aided Design ◽  
Volume Fraction ◽  
High Strength ◽  
Pure Metal ◽  
Alloy Design ◽  
High Conductivity ◽  
Solid Solution Strengthening ◽  
Computer Aided ◽  
The Matrix

Computer-aided design of alloys is becoming increasingly useful, replacing the completely experimental approach. The computer-aided approach significantly reduces the cost of alloy design and more easily leads to optimum properties by reducing the amount of experimentation. Design of high-strength, high-conductivity alloys is a good example of the efficacy of using the computer to design experimental alloys.Alloys that have both high strength and high electrical conductivity are needed for many applications such as lead frames, connectors, conducting springs, and sliding contacts. Figure 1 shows the strength and conductivity of some commercially available copper-based alloys. Since dissolved solutes in an otherwise pure metal rapidly reduce the electrical conductivity (as well as the thermal conductivity), solid solution strengthening is not suitable for designing this class of alloys. Such alloys must be designed on the basis of precipitation or dispersion hardening. The theory of the yield stress of alloys with precipitates or dispersed phases has been well-formulated and may be used for alloy design. The solubility of the hardening phase in the matrix must be very small. Otherwise the conductivity will be degraded too much. Nordheim's rule relates conductivity to dissolved solute in alloys and is also available for alloy design. Decreasing the dissolved solute increases the conductivity and strength due to an increase in the volume fraction of the precipitate.

Microstructural Evaluation of Alloy 800H After SCWL Exposure

2021 ◽  
Vol 7 (2) ◽  
Author(s):  
D. Marušáková ◽  
C. Aparicio ◽  
R. Fukač
Keyword(s):  
Supercritical Water ◽  
Electron Backscatter Diffraction ◽  
X Ray Diffraction ◽  
Alloy 800H ◽  
X Ray ◽  
Electron Backscatter ◽  
Microstructural Evaluation ◽  
The Matrix ◽  
Core Components ◽  
Backscatter Diffraction

Abstract Alloy 800H is a candidate material for supercritical water-cooled reactors (SCWR), specifically for in-core components in Canadian-type SCWR, that will operate at a pressure of 25 MPa and a core temperature from 350 °C to 625 °C. To evaluate this, several exposures to supercritical water took place at 395 °C and 25 MPa in a supercritical water loop (SCWL). The duration of each exposure was 500, 150, and 1000 h. Scanning electron microscopy (SEM) with electron backscatter diffraction (EBSD), in combination with Raman spectroscopy (RS) and X-ray diffraction (XRD), was used to evaluate the microstructure of alloy 800H after the exposures to supercritical water. All these methods confirmed the presence of magnetite and trevorite/chromite crystals, with a thickness of less than 1 μm, on the surface after each exposure. No significant change occurred after the second and third exposures. The matrix crystallography did not change during the exposures and demonstrated grain twinning with a grain size of 100–400 μm.

scholarly journals The Effect of Asymmetry on Strain Distribution, Microstructure and Texture of Multilayer Aluminum Composites Formed by Roll-Bonding

2020 ◽  
Vol 7 ◽  
Author(s):  
D. C. C. Magalhães ◽  
J. B. Rubert ◽  
O. M. Cintho ◽  
V. L. Sordi ◽  
A. M. Kliauga
Keyword(s):  
Accumulative Roll Bonding ◽  
Electron Backscatter Diffraction ◽  
Shear Bands ◽  
High Strength ◽  
X Ray Diffraction ◽  
Element Analysis ◽  
Roll Bonding ◽  
Refined Microstructure ◽  
Composite Shear ◽  
Backscatter Diffraction

AA1050/AA7050 multilayered composite sheets with a proportion of 1:1 were produced by Accumulative Roll Bonding (ARB) and Asymmetric Accumulative Roll-Bonding (AARB), using up to 8 cycles and intermediate annealing treatments at 500°C. The main purpose was to produce one composite sheet with high strength and moderate ductility, taking advantage of the mechanical properties of these aluminum alloys. Microstructural features were investigated in order to evaluate the potential to achieve a refined microstructure and the development of structural patterns. The strain distributions as a function of friction and asymmetry were simulated by finite element analysis. Texture was evaluated by X-ray diffraction and electron backscatter diffraction. A continuous layer pattern was obtained by ARB, up to 6 cycles but after 8 cycles shear bands fragmented the harder layers. In the early AARB cycles, the bending and necking of the AA7050 layers yielded a wavy-pattern. The shear strain in the AARB process has a strong influence on achieving a wavy-pattern, more than the flow stress differences of the alloys in the composite. Shear texture increased with the degree of the layers’ discontinuity. Different sources of shear contributed to the formation of microstructural patterns: the shear due to asymmetry, the frictional shear at roll-sheet interface and at the central layer interface and the shear at the layers’ interface. In addition, the ARB process achieved a better interfacial adhesion at the middle interface and higher strength and elongation than the AARB process.

Microstructure and properties of high-conductivity, super-high-strength Cu–8.0Ni–1.8Si–0.6Sn–0.15Mg alloy

2009 ◽  
Vol 24 (6) ◽  
pp. 2123-2129 ◽  
Author(s):  
Z. Li ◽  
Z.Y. Pan ◽  
Y.Y. Zhao ◽  
Z. Xiao ◽  
M.P. Wang
Keyword(s):  
Electrical Conductivity ◽  
Processing Condition ◽  
Solution Treatment ◽  
High Strength ◽  
High Conductivity ◽  
Age Hardening ◽  
Transmission Electron ◽  
The Matrix ◽  
Strength Alloy ◽  
Evolution Of Microstructure

A high-conductivity and super-high-strength alloy, Cu-8.0Ni-1.8Si-0.6Sn-0.15Mg, has been developed. The processing conditions of the alloy have been investigated. The evolution of microstructure of the alloy on aging has been examined by transmission electron microscopy. The processing condition giving the highest hardness and good electrical conductivity is as follows: solution treatment at 970 °C for 4 h, cold rolling to 60% reduction, and aging at 500 °C for 30 min. The processed alloy has an average tensile strength of 1180 MPa, 0.2% proof strength of 795 MPa, elongation of 2.75%, and average electrical conductivity of 26.5% IACS. Orthorhombic Ni2Si precipitates are responsible for the age-hardening effect. The orientation relationship between the precipitates and the matrix is (110)m(211)p and. DO22 ordering together with spinodal decomposition also contributed to the hardening.

Al-5Cu Alloy Processed by Equal-Channel Angular Pressing

2016 ◽  
Vol 879 ◽  
pp. 843-848 ◽  
Author(s):  
Hai Long Jia ◽  
Knut Marthinsen ◽  
Yan Jun Li
Keyword(s):  
Equal Channel Angular Pressing ◽  
Electron Backscatter Diffraction ◽  
Uniform Elongation ◽  
Rate Sensitivity ◽  
High Strength ◽  
Secondary Phase ◽  
Grain Structure ◽  
Ultrafine Grains ◽  
Cu Content ◽  
Angular Pressing

An ECAP (equal channel angular pressing) processed UFG Al-5Cu alloy was characterized by electron backscatter diffraction (EBSD). It is revealed that a bimodal grain structure, i.e. ultrafine grains accompanied by micron-sized grains was developed after 4 passes. A high strength (~501 MPa) and a relatively large elongation to failure (~28%) with ~5% uniform elongation were achieved simultaneously after 4 passes of ECAP. The high strength is due to a combination of strengthening by solute, high density of dislocations and ultrafine grains. The enhancement of uniform elongation is primarily due to the enhanced work hardening resulted from the solute Cu content and the bimodal grain structure. The large post-uniform elongation is attributed to the high strain rate sensitivity of the UFG Al-5Cu alloy. More importantly, the present work revealed that during ECAP high solid solution content of Cu and coarse secondary phase particles can introduce inhomogeneous deformation resulting in a desirable bimodal grain structure, which can be utilized as a strategy to gain both high strength and relatively good ductility.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

scholarly journals Stable and Metastable Phase Equilibria Involving the Cu6Sn5 Intermetallic

2021 ◽  
Author(s):  
A. Leineweber ◽  
M. Löffler ◽  
S. Martin
Keyword(s):  
Phase Equilibria ◽  
Electron Backscatter Diffraction ◽  
Metastable Phase ◽  
Stable Phase ◽  
X Ray Diffraction ◽  
X Ray ◽  
Heat Treated ◽  
Ordered Phases ◽  
Backscatter Diffraction ◽  
Kinetics Of

Abstract Cu6Sn5 intermetallic occurs in the form of differently ordered phases η, η′ and η′′. In solder joints, this intermetallic can undergo changes in composition and the state of order without or while interacting with excess Cu and excess Sn in the system, potentially giving rise to detrimental changes in the mechanical properties of the solder. In order to study such processes in fundamental detail and to get more detailed information about the metastable and stable phase equilibria, model alloys consisting of Cu3Sn + Cu6Sn5 as well as Cu6Sn5 + Sn-rich melt were heat treated. Powder x-ray diffraction and scanning electron microscopy supplemented by electron backscatter diffraction were used to investigate the structural and microstructural changes. It was shown that Sn-poor η can increase its Sn content by Cu3Sn precipitation at grain boundaries or by uptake of Sn from the Sn-rich melt. From the kinetics of the former process at 513 K and the grain size of the η phase, we obtained an interdiffusion coefficient in η of (3 ± 1) × 10−16 m2 s−1. Comparison of this value with literature data implies that this value reflects pure volume (inter)diffusion, while Cu6Sn5 growth at low temperature is typically strongly influenced by grain-boundary diffusion. These investigations also confirm that η′′ forming below a composition-dependent transus temperature gradually enriches in Sn content, confirming that Sn-poor η′′ is metastable against decomposition into Cu3Sn and more Sn-rich η or (at lower temperatures) η′. Graphic Abstract

Physical Based Microstructure Modelling Coupled with Nucleation Theory during and after Hot Forming of AA5083

2010 ◽  
Vol 89-91 ◽  
pp. 509-514
Author(s):  
Pavel Sherstnev ◽  
Christof Sommitsch ◽  
Stefan Mitsche ◽  
Carsten Melzer
Keyword(s):  
Aluminium Alloy ◽  
Hot Rolling ◽  
Volume Fraction ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Nucleation Theory ◽  
Structure Evolution ◽  
Nucleation Sites ◽  
Nucleation Mechanisms ◽  
Backscatter Diffraction

A physical model based on three types of dislocations and three nucleation sites for recrystallized grain is applied to hot rolling simulation. This model was implemented into a commercial Finite Element (FE) analysis package FORGE 2008 to calculate both the structure evolution during and the recrystallized volume fraction after hot working of aluminium alloy 5083. It is shown that the main nucleation mechanisms in the aluminium alloy are the particle stimulated nucleation (PSN) and nucleation at grain boundaries. Hence the precipitation kinetics during homogenisation was investigated by use of the thermodynamic calculation software MatCalc. To validate the simulation results hot rolling experiments were performed by means of a laboratory mill. The grain structure evolution was analysed by electron backscatter diffraction (EBSD).

Mitrofanovite, Pt3Te4, a new mineral from the East Chuarvy deposit, Fedorovo–Pana intrusion, Kola Peninsula, Russia

2018 ◽  
Vol 83 (4) ◽  
pp. 523-530 ◽  
Author(s):  
Victor V. Subbotin ◽  
Anna Vymazalová ◽  
František Laufek ◽  
Yevgeny E. Savchenko ◽  
Chris J. Stanley ◽  
...  
Keyword(s):  
Kola Peninsula ◽  
Electron Backscatter Diffraction ◽  
New Mineral ◽  
Synthetic Analogue ◽  
X Ray Diffraction ◽  
X Ray ◽  
Structural Identity ◽  
Polarised Light ◽  
Fe Alloys ◽  
Backscatter Diffraction

AbstractMitrofanovite, Pt3Te4, is a new telluride discovered in low-sulfide disseminated ore in the East Chuarvy deposit, Fedorovo–Pana intrusion, Kola Peninsula, Russia. It forms anhedral grains (up to ~20 μm × 50 μm) commonly in intergrowths with moncheite in aggregates with lukkulaisvaaraite, kotulskite, vysotskite, braggite, keithconnite, rustenburgite and Pt–Fe alloys hosted by a chalcopyrite–pentlandite–pyrrhotite matrix. Associated silicates are: orthopyroxene, augite, olivine, amphiboles and plagioclase. Mitrofanovite is brittle; it has a metallic lustre and a grey streak. Mitrofanovite has a good cleavage, along {001}. In plane-polarised light, mitrofanovite is bright white with medium to strong bireflectance, slight pleochroism, and strong anisotropy on non-basal sections with greyish brown rotation tints; it exhibits no internal reflections. Reflectance values for the synthetic analogue of mitrofanovite in air (Ro, Re’ in %) are: 58.4, 54.6 at 470 nm; 62.7, 58.0 at 546 nm; 63.4, 59.1 at 589 nm; and 63.6, 59.5 at 650 nm. Fifteen electron-microprobe analyses of mitrofanovite gave an average composition: Pt 52.08, Pd 0.19, Te 47.08 and Bi 0.91, total 100.27 wt.%, corresponding to the formula (Pt2.91Pd0.02)Σ2.93(Te4.02Bi0.05)Σ4.07 based on 7 atoms; the average of eleven analyses on synthetic analogue is: Pt 52.57 and Te 47.45, total 100.02 wt.%, corresponding to Pt2.94Te4.06. The density, calculated on the basis of the formula, is 11.18 g/cm3. The mineral is trigonal, space group R$\overline 3 $m, with a = 3.9874(1), c = 35.361(1) Å, V = 486.91(2) Å3 and Z = 3. The crystal structure was solved and refined from the powder X-ray-diffraction data of synthetic Pt3Te4. Mitrofanovite is structurally and chemically related to moncheite (PtTe2). The strongest lines in the powder X-ray diffraction pattern of synthetic mitrofanovite [d in Å (I) (hkl)] are: 11.790(23)(003), 5.891(100)(006), 2.851(26)(107), 2.137(16)(1013), 2.039(18)(0114), 1.574(24)(0120), 1.3098(21)(0027). The structural identity of natural mitrofanovite with synthetic Pt3Te4 was confirmed by electron backscatter diffraction measurements on the natural sample. The mineral name is chosen to honour Felix P. Mitrofanov, a Russian geologist who was among the first to discover platinum-group element mineralisation in the Fedorova–Pana complex.

scholarly journals Initiation and short crack growth behaviour of environmentally induced cracks in AA5083 H131 investigated across time and length scales

2019 ◽  
Vol 37 (5) ◽  
pp. 469-481 ◽  
Author(s):  
Visweswara C. Gudla ◽  
Alistair Garner ◽  
Malte Storm ◽  
Parmesh Gajjar ◽  
James Carr ◽  
...  
Keyword(s):  
Electron Backscatter Diffraction ◽  
Three Dimensional ◽  
High Strength ◽  
Time Lapse ◽  
Growth Behaviour ◽  
Spectroscopy Analysis ◽  
Crack Growth Behaviour ◽  
Rate Testing ◽  
X Ray Computed ◽  
Backscatter Diffraction

AbstractEnvironmentally induced cracking (EIC) in a sensitized high-strength AA5083 H131 alloy has been investigated using time-lapse synchrotron X-ray computed tomography combined with post-mortem correlative characterization. Small corrosion features deliberately introduced in a pre-exposure step were found to be the site of initiation for over 95% of the 44 EIC cracks that developed under slow strain rate testing. Detailed analysis using three-dimensional electron backscatter diffraction and energy-dispersive spectroscopy analysis of a single crack confirmed the intergranular nature of the cracks from the start and that the pre-exposure corrosion was associated with an α-AlFeMnSi particle cluster. It also appears that several cracks may have initiated at this site, which later coalesced to form the 300-μm-long crack that ultimately developed. Of further note is the fact that initiation of the EIC cracks across the sample started below the yield strength and continued beyond the ultimate tensile strength. The most rapid crack propagation occurred during sample extension following a period of fixed displacement.

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