scholarly journals Domino Sense Analogous Contradict Planning of A CMOS

2019 ◽  
Vol 8 (6S2) ◽  
pp. 261-264
Keyword(s):  
Cmos Technology ◽  
Vlsi Circuits ◽  
Domino Logic ◽  
Flip Flop ◽  
Cell Library ◽  
Dynamic Circuits ◽  
Wide Range ◽  
Pipeline Segment

The fundamental target of this paper comprises of the domino rationale way and checking path. A fast wide range parallel contradicts that accomplishes high working frequencies throughout an account pipeline segment demeanor utilizing just three undemanding redundant CMOS-rationale module types. The three essential module types are isolated by D flip failure. The three element types are set in an exceedingly dull constitution in the tallying way and Domino Logic way. Enthusiastic domino rationale circuits are broadly utilized in present day computerized VLSI circuits. These dynamic circuits are utilized in superior structures. Along these lines simultaneously refreshing the tally state with a consistent deferral at all tallying way module regarding the clock edge. This construction is versatile to self-assertive portion counter widths utilizing just the three module types. The deferral counter is contained the underlying module admittance times only, three-info AND-entryway delay and a D-type flip-flop. The motivation behind the project is to diminish the Power utilization and CMOS Technology in the counter way and Domino rationale way by utilizing DSCH in Microwind Tool. The proposed Counter way is structured utilizing 0.10µm TSMC Digital cell library and its expended 0.215mW.

scholarly journals Timing Optimization During the Physical Synthesis of Cell-Based VLSI Circuits

2017 ◽  
Author(s):  
Vinícius Dos Santos Livramento ◽  
José Luís Güntzel
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Cmos Technology ◽  
Vlsi Circuits ◽  
Consumer Electronics ◽  
Clock Frequency ◽  
Wide Range ◽  
Large Scale Integration ◽  
On Chip ◽  
Scale Integration

The evolution of CMOS technology made possible integrated circuits with billions of transistors assembled into a single silicon chip, giving rise to the jargon Very-Large-Scale Integration (VLSI). VLSI circuits span a wide range class of applications, including Application Specific Circuits and Systems-On-Chip. The latter are responsible for fueling the consumer electronics market, especially in the segment of smartphones and tablets, which are responsible for pushing hardware performance requirements every new generation. The required clock frequency affects the performance of a VLSI circuit and induces timing constraints that must be properly handled by synthesis tools. This thesis focuses on techniques for timing closure of cellbased VLSI circuits, i.e. techniques able to iteratively reduce the number of timing violations until the synthesis of the synchronous digital system reaches the specified target frequency.

Towards the Design of Cost-efficient Generic Register Using Quantum-dot Cellular Automata

2020 ◽  
Vol 10 (4) ◽  
pp. 534-547
Author(s):  
Chiradeep Mukherjee ◽  
Saradindu Panda ◽  
Asish K. Mukhopadhyay ◽  
Bansibadan Maji
Keyword(s):  
Cellular Automata ◽  
Quantum Dot ◽  
Power Dissipation ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Digital Data ◽  
Design Parameters ◽  
Flip Flop ◽  
Quantum Dot Cellular Automata ◽  
Cost Efficient

Background: The advancement of VLSI in the application of emerging nanotechnology explores quantum-dot cellular automata (QCA) which has got wide acceptance owing to its ultra-high operating speed, extremely low power dissipation with a considerable reduction in feature size. The QCA architectures are emerging as a potential alternative to the conventional complementary metal oxide semiconductor (CMOS) technology. Experimental: Since the register unit has a crucial role in digital data transfer between the electronic devices, such study leading to the design of cost-efficient and highly reliable QCA register is expected to be a prudent area of research. A thorough survey on the existing literature shows that the generic models of Serial-in Serial Out (SISO), Serial-in-Parallel-Out (SIPO), Parallel-In- Serial-Out (PISO) and Parallel-in-Parallel-Out (PIPO) registers are inadequate in terms of design parameters like effective area, delay, O-Cost, Costα, etc. Results: This work introduces a layered T gate for the design of the D flip flop (LTD unit), which can be broadly used in SISO, SIPO, PISO, and PIPO register designs. For detection and reporting of high susceptible errors and defects at the nanoscale, the reliability and defect tolerant analysis of LTD unit are also carried out in this work. The QCA design metrics for the general register layouts using LTD unit is modeled. Conclusion: Moreover, the cost metrics for the proposed LTD layouts are thoroughly studied to check the functional complexity, fabrication difficulty and irreversible power dissipation of QCA register layouts.

scholarly journals A wide-range all-digital duty-cycle corrector with output clock phase alignment in 65nm CMOS technology

2011 ◽  
Vol 8 (15) ◽  
pp. 1245-1251 ◽  
Author(s):  
Ching-Che Chung ◽  
Duo Sheng ◽  
Sung-En Shen
Keyword(s):  
Duty Cycle ◽  
Cmos Technology ◽  
Phase Alignment ◽  
Wide Range

A 31 GHz body-biased configurable power amplifier in 28 nm FD-SOI CMOS for 5 G applications

2020 ◽  
pp. 1-18
Author(s):  
Florent Torres ◽  
Eric Kerhervé ◽  
Andreia Cathelin ◽  
Magali De Matos
Keyword(s):  
Power Amplifier ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Silicon On Insulator ◽  
Oxide Semiconductor ◽  
Fully Depleted ◽  
Technology Roadmap ◽  
Wide Range ◽  
28 Nm ◽  
Soi Cmos

Abstract This paper presents a 31 GHz integrated power amplifier (PA) in 28 nm Fully Depleted Silicon-On-Insulator Complementary Metal Oxide Semiconductor (FD-SOI CMOS) technology and targeting SoC implementation for 5 G applications. Fine-grain wide range power control with more than 10 dB tuning range is enabled by body biasing feature while the design improves voltage standing wave ratio (VSWR) robustness, stability and reverse isolation by using optimized 90° hybrid couplers and capacitive neutralization on both stages. Maximum power gain of 32.6 dB, PAEmax of 25.5% and Psat of 17.9 dBm are measured while robustness to industrial temperature range and process spread is demonstrated. Temperature-induced performance variation compensation, as well as amplitude-to-phase modulation (AM-PM) optimization regarding output power back-off, are achieved through body-bias node. This PA exhibits an International Technology Roadmap for Semiconductors figure of merit (ITRS FOM) of 26 925, the highest reported around 30 GHz to authors' knowledge.

scholarly journals Analysis On Power Gating Circuits Based Low Power VLSI Circuits (BCD Adder)

2021 ◽  
Vol 2089 (1) ◽  
pp. 012080
Author(s):  
M. Srinivas ◽  
K.V. Daya Sagar
Keyword(s):  
Energy Consumption ◽  
Low Power ◽  
Power Dissipation ◽  
Supply Voltage ◽  
Oxide Thickness ◽  
Cmos Technology ◽  
Digital Circuit ◽  
Leakage Power ◽  
Vlsi Circuits ◽  
Battery Life

Abstract Currently, energy consumption in the digital circuit is a key design parameter for emerging mobile products. The principal cause of the power dissipation during idle mode is leakage currents, which are rising dramatically. Sub-threshold leakage is increased by the scaling of threshold voltage when gate current leakage increases because oxide thickness is scaled. With rising demands for mobile devices, leakage energy consumption has received even greater attention. Since a mobile device spends most of its time in standby mode, leakage power savings need to prolong the battery life. That is why low power has become a significant factor in CMOS circuit design. The required design and simulation of an AND gate with the BSIM4 MOS parameter model at 27 0C, supply voltage of 0,70V with CMOS technology of 65nm are the validation of the suitability of the proposed circuit technology. AND simulation. The performance parameters for the two AND input gate are compared with the current MTCMOS and SCCMOS techniques, such as sub-threshold leakage power dissipations in active and standby modes, the dynamic dissipation, and propagation period. The proposed hybrid super cutoff complete stack technique compared to the current MTCMOS technology shows a reduction in sub-threshold dissipation power dissipation by 3. 50x and 1.15x in standby modes and active modes respectively. The hybrid surface-cutting technique also shows savings of 2,50 and 1,04 in power dissipation at the sub-threshold in standby modes and active modes compared with the existing SCCMOS Technique.

Design and Analysis of Power Efficient TG Based Dual Edge Triggered Flip-Flops with Stacking Technique

2019 ◽  
Vol 29 (08) ◽  
pp. 2050123 ◽  
Author(s):  
Neethu Anna Sabu ◽  
K. Batri
Keyword(s):  
Vlsi Design ◽  
Cmos Technology ◽  
Flip Flop ◽  
Circuit Performance ◽  
Power Efficient ◽  
Transmission Gate ◽  
Double Edge ◽  
Speed Performance ◽  
Layout Area ◽  
Power Delay Product

One of the paramount issues in the field of VLSI design is the rapid increase in power consumption. Therefore, it is necessary to develop power-efficient circuits. Here, three new simple architectures are presented for a Dynamic Double Edge Triggered Flip-flop named as Transistor Count Reduction Flip-flop, S-TCRFF (Series Stacking in TCRFF) and FST in TCRFF (Forced Stacking of Transistor in TCRFF). The first one features a dynamic design comprising of transmission gate in which total transistor count has greatly reduced without affecting the logic, thereby attaining better power and speed performance. For the reduction of static power, two types of stacking called series and forced transistor stacking are applied. The circuits are simulated using Cadence Virtuoso in 45[Formula: see text]nm CMOS technology with a power supply of 1[Formula: see text]V at 500[Formula: see text]MHz when input switching activity is 25%. The simulated results indicated that the new designs (TCRFF, S-TCRFF and FST in TCRFF) excelled in different circuit performance indices like Power-Delay-Product (PDP), Energy-Delay-Product (EDP), average and leakage power with less layout area compared with the performance of nine recently proposed FF designs. The improvement in PDPdq value was up to 89.2% (TCRFF), 89.9% (S-TCRFF) and 90.3% (FST in TCRFF) with conventional transmission gate FF (TGFF).

scholarly journals Novel Low-Complexity and Low-Power Flip-Flop Design

Electronics ◽  
2020 ◽  
Vol 9 (5) ◽  
pp. 783
Author(s):  
Jin-Fa Lin ◽  
Zheng-Jie Hong ◽  
Chang-Ming Tsai ◽  
Bo-Cheng Wu ◽  
Shao-Wei Yu
Keyword(s):  
Low Power ◽  
Average Power ◽  
Circuit Complexity ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Digital Circuit ◽  
Oxide Semiconductor ◽  
System Level ◽  
Flip Flop ◽  
Chip Area

In this paper, a compact and low-power true single-phase flip-flop (FF) design with fully static operations is presented. The design is developed by using various circuit-reduction schemes and features a hybrid logic style employing both pass transistor logic (PTL) and static complementary metal-oxide semiconductor (CMOS) logic to reduce circuit complexity. These circuit optimization measures pay off in various aspects, including smaller clock-to-Q (CQ) delay, lower average power, lower leakage power, and smaller layout area; and the transistor-count is only 17. Fabricated in TSMC 180 nm CMOS technology, it reduces by over 29% the chip area compared to the conventional transmission gate FF (TGFF). To further show digital circuit/system level advantages, a multi-mode shift register has been realized. Experimental measurement results at 1.8 V/4 MHz show that, compared with the TGFF design, the proposed design saves 64.7% of power consumption while reducing chip area by 26.2%.

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