scholarly journals Energy Efficient SRAM

2019 ◽  
Vol 8 (9) ◽  
pp. 1086-1091
Keyword(s):  
Power Consumption ◽  
High Performance ◽  
Dynamic Logic ◽  
Cmos Technology ◽  
Digital Circuit ◽  
Static Noise Margin ◽  
Noise Margin ◽  
And Performance ◽  
The Stability ◽  
Static Noise

Memories are an essential unit of any digital circuit, thus their power consumption must be considered during the designing process of the cells. To improve performance, reduce delay and increase stability, it is advisable to decrease the power consumed by the memory. Due to high demand of speed, high performance, there’s a need to decrease the size of the device, thereby increasing the devices placed per chip. This high integration makes chips more complex but improves device performance. Design of SRAM cells with speed and low power is crucial so as to replace DRAMs. The layout of SRAM has advanced to meet the requirements of the present industry in accordance with parameters like delay, power consumption and stability etc. This paper presents the aim of analyzing different technologies used to make SRAM more efficient in terms of parameters such as static noise margin, latency and dissipation of power. The stability investigation of SRAM cells are usually derived from the Static Noise Margin (SNM) analysis. Here we observe a SRAM design which has used dynamic logic and pass transistor logic. We further study the effects made on this design by employing various technologies such as AVL-S, AVL-G, AVL and MT-CMOS, at 180nm CMOS technology to achieve enhancements in delay, power consumption and performance. The proposed circuits are simulated and the results obtained have been analyzed to show significant improvement over conventional SRAM designs. Cadence Virtuoso simulation is used to confirm all the results obtained in this paper for the simulation of 180 nm CMOS technology SRAMs.

scholarly journals Stability Improvement of an Efficient Graphene Nanoribbon Field-Effect Transistor-Based SRAM Design

2020 ◽  
Vol 2020 ◽  
pp. 1-7
Author(s):  
Mathan Natarajamoorthy ◽  
Jayashri Subbiah ◽  
Nurul Ezaila Alias ◽  
Michael Loong Peng Tan
Keyword(s):  
Power Consumption ◽  
Field Effect ◽  
Field Effect Transistor ◽  
Graphene Nanoribbon ◽  
Static Noise Margin ◽  
Noise Margin ◽  
Average Power Consumption ◽  
Sram Design ◽  
Effect Transistor ◽  
Static Noise

The development of the nanoelectronics semiconductor devices leads to the shrinking of transistors channel into nanometer dimension. However, there are obstacles that appear with downscaling of the transistors primarily various short-channel effects. Graphene nanoribbon field-effect transistor (GNRFET) is an emerging technology that can potentially solve the issues of the conventional planar MOSFET imposed by quantum mechanical (QM) effects. GNRFET can also be used as static random-access memory (SRAM) circuit design due to its remarkable electronic properties. For high-speed operation, SRAM cells are more reliable and faster to be effectively utilized as memory cache. The transistor sizing constraint affects conventional 6T SRAM in a trade-off in access and write stability. This paper investigates on the stability performance in retention, access, and write mode of 15 nm GNRFET-based 6T and 8T SRAM cells with that of 16 nm FinFET and 16 nm MOSFET. The design and simulation of the SRAM model are simulated in synopsys HSPICE. GNRFET, FinFET, and MOSFET 8T SRAM cells give better performance in static noise margin (SNM) and power consumption than 6T SRAM cells. The simulation results reveal that the GNRFET, FinFET, and MOSFET-based 8T SRAM cells improved access static noise margin considerably by 58.1%, 28%, and 20.5%, respectively, as well as average power consumption significantly by 97.27%, 99.05%, and 83.3%, respectively, to the GNRFET, FinFET, and MOSFET-based 6T SRAM design.

A 32 nm Read Disturb-free 11T SRAM Cell with Improved Write Ability

2019 ◽  
Vol 29 (05) ◽  
pp. 2050067
Author(s):  
S. R. Mansore ◽  
R. S. Gamad ◽  
D. K. Mishra
Keyword(s):  
High Performance ◽  
Model Simulation ◽  
Random Access ◽  
Leakage Power ◽  
Access Memory ◽  
Static Noise Margin ◽  
Noise Margin ◽  
Sram Cell ◽  
Operation Characteristics ◽  
Static Noise

Data stability, write ability and leakage power are major concerns in submicron static random access memory (SRAM) cell design. This paper presents an 11T SRAM cell with differential write and single-ended read. Proposed cell offers improved write ability by interrupting its ground connection during write operation. Separate read buffer provides disturb-free read operation. Characteristics are obtained from HSPICE simulation using 32[Formula: see text]nm high-performance predictive technology model. Simulation results show that the proposed cell achieves 4.5[Formula: see text] and 1.06[Formula: see text] higher read static noise margin (RSNM) as compared to conventional 6T (C6T) and PNN-based 10T cells, respectively, at 0.4[Formula: see text]V. Write static noise margin (WSNM) of the proposed design is 1.65[Formula: see text], 1.71[Formula: see text] and 1.77[Formula: see text] larger as compared to those of C6T, PPN-based 10T and PNN-based 10T cells, respectively, at 0.4V. Write “1” delay of the proposed cell is 0.108[Formula: see text] and 0.81[Formula: see text] as those of PPN10T and PNN10T cells, respectively. Proposed circuit consumes 1.40[Formula: see text] lesser read power as compared to PPN10T cell at 0.4[Formula: see text]V. Leakage power of the proposed cell is 0.35[Formula: see text] of C6T cell at 0.4[Formula: see text]V. Proposed 11T cell occupies 1.65[Formula: see text] larger area as compared to that of conventional 6T.

scholarly journals FinFET SRAM cell with improved stability and power for low power applications.

2019 ◽  
Vol 14 (2) ◽  
pp. 1-8
Author(s):  
Shilpi Birla
Keyword(s):  
Memory Cell ◽  
Static Noise Margin ◽  
Noise Margin ◽  
Sram Cell ◽  
Improved Stability ◽  
Cell Stability ◽  
Subthreshold Voltage ◽  
The Stability ◽  
Subthreshold Operation ◽  
Static Noise

In this paper, a new 11T SRAM cell using Double gate FET (FinFET technology) has been proposed, cell basic component is the 6T SRAM cell with 4 NMOS access transistors to improve the stability over CMOSFET circuits and also makes it a dual port memory cell. The proposed cell also used a header scheme in which one extra PMOS transistor is used which is biased at different voltages to improve the read and write stability which helps in reducing the leakage current, active power. The cell shows improvement in RSNM (Read Static Noise Margin) with LP8T by 2.39x at threshold and subthreshold voltage 2.68x with D6T SRAM cell, 5.5x with TG8T. The WSNM (Write Static Noise Margin) and HM (Hold Margin) of the SRAM cell at 0.9V is 306mV and 384mV.At subthreshold operation also, it shows improvement. The Leakage power reduced by 0.125x with LP8T, 0.022x with D6T SRAM cell, TG8T and SE8T. Impact of process variation on cell stability also been analyzed.

Variability aware FinFET SRAM cell with improved stability and power for low power applications

Circuit World ◽  
2019 ◽  
Vol 45 (4) ◽  
pp. 196-207
Author(s):  
Shilpi Birla
Keyword(s):  
Low Power ◽  
Threshold Voltage ◽  
Leakage Power ◽  
Static Noise Margin ◽  
Content Type ◽  
Noise Margin ◽  
Sram Cell ◽  
Memory Circuits ◽  
The Stability ◽  
Static Noise

Purpose Major area of a die is consumed in memory components. Almost 60-70% of chip area is being consumed by “Memory Circuits”. The dominant memory in this market is SRAM, even though the SRAM size is larger than embedded DRAM, as SRAM does not have yield issues and the cost is not high as compared to DRAM. At the same time, the other attractive feature for the SRAM is speed, and it can be used for low power applications. CMOS SRAM is the crucial component in microprocessor chips and applications, and as the said major portion of the area is dedicated to SRAM arrays, CMOS SRAM is considered to be the stack holders in the memory market. Because of the scaling feature of CMOS, SRAM had its hold in the market over the past few decades. In recent years, the limitations of the CMOS scaling have raised so many issues like short channel effects, threshold voltage variations. The increased thrust for alternative devices leads to FinFET. FinFET is emerging as one of the suitable alternatives for CMOS and in the region of memory circuits. Design/methodology/approach In this paper, a new 11 T SRAM cell using FinFET technology has been proposed, the basic component of the cell is the 6 T SRAM cell with 4 NMOS access transistors to improve the stability and also makes it a dual port memory cell. The proposed cell uses a header scheme in which one extra PMOS transistor is used which is biased at different voltages to improve the read and write stability thus, helps in reducing the leakage power and active power. Findings The cell shows improvement in RSNM (read static noise margin) with LP8T by 2.39× at sub-threshold voltage 2.68× with D6T SRAM cell, 5.5× with TG8T. The WSNM (write static noise margin) and HM (hold margin) of the SRAM cell at 0.9 V is 306 mV and 384  mV. It shows improvement at sub-threshold operation also. The leakage power is reduced by 0.125× with LP8T, 0.022× with D6T SRAM cell, TG8T and SE8T. The impact of process variation on cell stability is also discussed. Research limitations/implications The FinFet has been used in place of CMOS even though the FinFet has been not been a matured technology; therefore, pdk files have been used. Practical implications SRAM cell has been designed which has good stability and reduced leakage by which we can make an array and which can be used as SRAM array. Social implications The cell can be used for SRAM memory for low power consumptions. Originality/value The work has been done by implementing various leakage techniques to design a stable and improved SRAM cell. The advantage of this work is that the cell has been working for low voltage without degrading the stability factor.

DESIGN AND ANALYSIS OF A NOVEL LOW PDP FULL ADDER CELL

2011 ◽  
Vol 20 (03) ◽  
pp. 439-445 ◽  
Author(s):  
M. H. GHADIRY ◽  
ABU KHARI A'AIN ◽  
M. NADI S.
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
High Performance ◽  
Full Adder ◽  
Cmos Technology ◽  
Accurate Analysis ◽  
And Performance ◽  
Full Swing ◽  
Driving Capability

This paper, presents a new full-swing low power high performance full adder circuit in CMOS technology. It benefits from a full swing XOR-XNOR module with no feedback transistors, which decreases delay and power consumption. In addition, high driving capability of COUT module and low PDP design of SUM module contribute to more PDP reduction in cascaded mode. In order to have accurate analysis, the new circuit along with several well-known full adders from literature have been modeled and compared with CADENCE. Comparison consists of power consumption, performance, PDP, and area. Results show that there are improvements in both power consumption and performance. This design trades area with low PDP.

scholarly journals Comparative Analysis of 6T, 7T, 8T, 9T, and 10T Realistic CNTFET Based SRAM

2017 ◽  
Vol 2017 ◽  
pp. 1-9 ◽  
Author(s):  
Shital Joshi ◽  
Umar Alabawi
Keyword(s):  
Power Consumption ◽  
Performance Metrics ◽  
Cmos Technology ◽  
Fundamental Limits ◽  
Technology Scaling ◽  
Electronic Application ◽  
Digital Devices ◽  
Noise Margin ◽  
Sram Cell ◽  
Static Noise

CMOS technology below 10 nm faces fundamental limits which restricts its applicability for future electronic application mainly in terms of size, power consumption, and speed. In digital electronics, memory components play a very significant role. SRAM, due to its unique ability to retain data, is one of the most popular memory elements used in most of the digital devices. With aggressive technology scaling, the design of SRAM is seriously challenged in terms of delay, noise margin, and stability. This paper compares the performance of various CNTFET based SRAM cell topologies like 6T, 7T, 8T, 9T, and 10T cell with respect to static noise margin (SNM), write margin (WM), read delay, and power consumption. To consider the nonidealities of CNTFET, variations in tube diameter and effect of metallic tubes are considered for various structures with respect to various performance metrics like SNM, WM, read delay, and power consumption.

scholarly journals Ultra Low Power Process Tolerant 10T (PT10T) SRAM with Improved Read/Write Ability for Internet of Things (IoT) Applications

2017 ◽  
Author(s):  
Pooran Singh ◽  
Santosh Vishvakarma
Keyword(s):  
Internet Of Things ◽  
Power Consumption ◽  
Low Power ◽  
Leakage Power ◽  
Static Noise Margin ◽  
Ultra Low Power ◽  
Iot Applications ◽  
Noise Margin ◽  
Standby Mode ◽  
Static Noise

An ultra-low power (ULP), power gated static random access memory (SRAM) is presented for Internet of Things (IoT) applications, which operates in sub-threshold voltage ranges from 300mV to 500mV. The proposed SRAM has tendency to operate in low supply voltages with high static and dynamic noise margins. The IoT application involves battery enabled low leakage memory architecture in subthreshold regime which has low power consumption. Therefore, to improve power consumption along with better cell stability, a power gated 10T SRAM is presented. The proposed cell uses a power gated p-MOS transistor to reduce the leakage power or static power in standby mode. Moreover, due to the schmitt triggering and read decoupling of 10T SRAM the static and dynamic behavior in read, write and standby mode has shown enhanced tolerance at different process, voltage and temperature (PVT) conditions. The proposed SRAM shows better results in terms of leakage power, read static noise margin (RSNM), write static noise margin (WSNM), write-ability or write trip point (WTP), read-write energy and dynamic read margin (DRM). Further, these parameters are observed at 8-Kilo bit (Kb) and compared with already existing SRAM architectures. It is observed that the leakage power is reduced by 1/81×, 1/75× of the conventional 6T (C6T) SRAM and read decoupled 8T (RD8T) SRAM, respectively at 300mV VDD. On the contrary, RSNM, WSNM, WTP and DRM values are improved by 3×, 2×, 11.11% and 31.8% as compared to C6T SRAM, respectively. Similarly, proposed 10T has 1.48×, 25% and 9.75% better RSNM, WSNM and WTP values as compared to RD8T SRAM, respectively at 300mV VDD.

scholarly journals Multi-Vdd Design for Content Addressable Memories (CAM): A Power-Delay Optimization Analysis

2018 ◽  
Vol 8 (3) ◽  
pp. 25 ◽  
Author(s):  
Siddhartha Joshi ◽  
Dawei Li ◽  
Seda Ogrenci-Memik ◽  
Grzegorz Deptuch ◽  
James Hoff ◽  
...  
Keyword(s):  
Power Consumption ◽  
Simulation Analysis ◽  
Cmos Technology ◽  
Power Measurement ◽  
Test Chip ◽  
Voltage Range ◽  
Content Addressable Memory ◽  
Noise Margin ◽  
Low Power Cmos ◽  
And Performance

In this paper, we characterize the interplay between power consumption and performance of a matchline-based Content Addressable Memory and then propose the use of a multi-Vdd design to save power and increase post-fabrication tunability. Exploration of the power consumption behavior of a CAM chip shows the drastically different behavior among the components and suggests the use of different and independent power supplies. The complete design, simulation and testing of a multi-Vdd CAM chip along with an exploration of the multi-Vdd design space are presented. Our analysis has been applied to simulated models on two different technology nodes (130 nm and 45 nm), followed by experiments on a 246-kb test chip fabricated in 130 nm Global Foundries Low Power CMOS technology. The proposed design, operating at an optimal operating point in a triple-Vdd configuration, increases the power-delay operation range by 2.4 times and consumes 25.3% less dynamic power when compared to a conventional single-Vdd design operating over the same voltage range with equivalent noise margin. Our multi-Vdd design also helps save 51.3% standby power. Measurement results from the test chip combined with the simulation analysis at the two nodes validate our thesis.

Low Power High Performance Full Adder Design Using Gate Diffusion Input Techniques

2020 ◽  
Vol 17 (4) ◽  
pp. 1595-1599
Author(s):  
N. Suresh ◽  
K. Subba Rao ◽  
R. Vassoudevan
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Integrated Circuit ◽  
High Performance ◽  
Large Scale ◽  
Digital Signal ◽  
Full Adder ◽  
Cmos Technology ◽  
Digital Circuit ◽  
Essential Components

Very Large Scale Integrated (VLSI) technology for a widespread use of high performance portable integrated circuit (IC) devices such as MP3, PDA, mobile phones is increasing rapidly. Most of the VLSI applications, such as digital signal processing, image processing and microprocessors, extensively use arithmetic operations. In this research novel low power full adder architecture has been proposed for various applications which uses the advanced adder and multiplier designs. A full-adder is one of the essential components in digital circuit design; many improvements have been made to reduce the architecture of a full adder. In this research modified full adder using GDI technique is proposed to achieve low power consumption. By using GDI cell, the transistor count is greatly reduced, thereby reducing the power consumption and propagation delay while maintaining the low complexity of the logic design. The parameters in terms of Power, Delay, and Surface area are investigated by comparison of the proposed GDI technology with an optimized 90 nm CMOS technology.

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