scholarly journals Design And Analysis Of RHBD Memory Cells And 4x4 RHBD 10T Memory Cell Architecture

2019 ◽  
Vol 8 (10) ◽  
pp. 4232-4237
Keyword(s):  
Supply Voltage ◽  
Memory Cell ◽  
Cmos Technology ◽  
Soft Error ◽  
Cmos Process ◽  
Memory Cells ◽  
Process Technology ◽  
Aerospace Applications ◽  
Cadence Tool ◽  
Layout Area

CMOS technology plays an important role in the modern electronics world. CMOS technology also plays significant role in aerospace applications. To store data, memories are widely used as the medium in aerospace applications. SRAM cells are the memories made by the CMOS technology. The most vital issues faced by memories are due to single event upsets (SEUs) which are induced by radiation particles. The SEU’s due to increase in densities and SEU’s. There is a decrease in critical charge and supply voltage in CMOS process technology. There is a need for a technique which can to tolerate these SEU’s in such aerospace applications. Which are in the environment of complex celestial radiation? The technique which is considered for such environment is radiation-hardened by design (RHBD) with soft error robustness. This paper aims at is proposing an area efficient and high reliable RHBD memory cell for the above said application using 45nm technology in Cadence Tool. Depending on power, write/read time, the layout area of 14T, 12T and 10T RHBD memory cells and their performance on power for read/write operations are observed. A comparative study is also done on these memory cells based the parameters considered.

scholarly journals DIGITAL CONTROLLED OSCILLATOR (DCO) FOR ALL DIGITAL PHASE-LOCKED LOOP (ADPLL) – A REVIEW

2019 ◽  
Vol 82 (1) ◽  
Author(s):  
Florence Choong ◽  
Mamun Ibne Reaz ◽  
Mohamad Ibrahim Kamaruzzaman ◽  
Md. Torikul Islam Badal ◽  
Araf Farayez ◽  
...  
Keyword(s):  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Phase Locked Loop ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Process Technology ◽  
Chip Area ◽  
Digital Phase ◽  
Low Power Dissipation

Digital controlled oscillator (DCO) is becoming an attractive replacement over the voltage control oscillator (VCO) with the advances of digital intensive research on all-digital phase locked-loop (ADPLL) in complementary metal-oxide semiconductor (CMOS) process technology. This paper presents a review of various CMOS DCO schemes implemented in ADPLL and relationship between the DCO parameters with ADPLL performance. The DCO architecture evaluated through its power consumption, speed, chip area, frequency range, supply voltage, portability and resolution. It can be concluded that even though there are various schemes of DCO that have been implemented for ADPLL, the selection of the DCO is frequently based on the ADPLL applications and the complexity of the scheme. The demand for the low power dissipation and high resolution DCO in CMOS technology shall remain a challenging and active area of research for years to come. Thus, this review shall work as a guideline for the researchers who wish to work on all digital PLL.

scholarly journals A Novel Cross-Latch Shift Register Scheme for Low Power Applications

2020 ◽  
Vol 11 (1) ◽  
pp. 129
Author(s):  
Po-Yu Kuo ◽  
Ming-Hwa Sheu ◽  
Chang-Ming Tsai ◽  
Ming-Yan Tsai ◽  
Jin-Fa Lin
Keyword(s):  
Power Consumption ◽  
Supply Voltage ◽  
Electrical Power ◽  
Average Power ◽  
Leakage Power ◽  
Shift Register ◽  
Cmos Process ◽  
Average Power Consumption ◽  
Simulation Results ◽  
Layout Area

The conventional shift register consists of master and slave (MS) latches with each latch receiving the data from the previous stage. Therefore, the same data are stored in two latches separately. It leads to consuming more electrical power and occupying more layout area, which is not satisfactory to most circuit designers. To solve this issue, a novel cross-latch shift register (CLSR) scheme is proposed. It significantly reduced the number of transistors needed for a 256-bit shifter register by 48.33% as compared with the conventional MS latch design. To further verify its functions, this CLSR was implemented by using TSMC 40 nm CMOS process standard technology. The simulation results reveal that the proposed CLSR reduced the average power consumption by 36%, cut the leakage power by 60.53%, and eliminated layout area by 34.76% at a supply voltage of 0.9 V with an operating frequency of 250 MHz, as compared with the MS latch.

scholarly journals A 350-GHz Coupled Stack Oscillator with −0.8 dBm Output Power in 65-nm Bulk CMOS Process

Electronics ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 1214
Author(s):  
Thanh Dat Nguyen ◽  
Jong-Phil Hong
Keyword(s):  
Output Power ◽  
Supply Voltage ◽  
Second Harmonic ◽  
Power Level ◽  
Cmos Technology ◽  
Negative Resistance ◽  
Output Power Level ◽  
Cmos Process ◽  
Frequency Selective ◽  
Oscillation Frequencies

This paper presents a push-push coupled stack oscillator that achieves a high output power level at terahertz (THz) wave frequency. The proposed stack oscillator core adopts a frequency selective negative resistance topology to improve negative transconductance at the fundamental frequency and a transformer connected between gate and drain terminals of cross pair transistors to minimize the power loss at the second harmonic frequency. Next, the phases and the oscillation frequencies between the oscillator cores are locked by employing an inductor of frequency selective negative resistance topology. The proposed topology was implemented in a 65-nm bulk CMOS technology. The highest measured output power is −0.8 dBm at 353.2 GHz while dissipating 205 mW from a 2.8 V supply voltage.

A 2.3 mW Multi-Frequency Clock Generator with −137 dBc/Hz Phase Noise VCO in 180 nm Digital CMOS Technology

2019 ◽  
Vol 29 (08) ◽  
pp. 2050130 ◽  
Author(s):  
Jagdeep Kaur Sahani ◽  
Anil Singh ◽  
Alpana Agarwal
Keyword(s):  
Phase Noise ◽  
Supply Voltage ◽  
Dead Zone ◽  
Dynamic Logic ◽  
Cmos Technology ◽  
Control Voltage ◽  
Cmos Process ◽  
Voltage Controlled Oscillator ◽  
Cmos Inverter ◽  
Digital Cmos

A fast phase frequency detector (PFD) and low gain low phase noise voltage-controlled oscillator (VCO)-based phase-locked loop (PLL) design are presented in this paper. PLL works in the frequency range of 0.025–1.6[Formula: see text]GHz, targeting various SoC applications. The proposed PFD, designed using CMOS dynamic logic, is fast and improves the locking time, dead zone and blind zone in the PLL. The standard CMOS inverter gate-based pseudo differential VCO is used in the PLL. Also, CMOS inverter is used as variable capacitor to tune the frequency of VCO with control voltage. The proposed PLL is designed in a 180[Formula: see text]nm CMOS process with supply voltage of 1.8[Formula: see text]V. The phase noise of VCO is [Formula: see text][Formula: see text]dBc/Hz at an offset frequency of 100[Formula: see text]MHz. The reference clock of 25[Formula: see text]MHz synthesizes the output clock of 1.6[Formula: see text]GHz with rms jitter of 0.642[Formula: see text]ps.

scholarly journals A low quiescent current low dropout voltage regulator with self-compensation

2019 ◽  
Vol 8 (1) ◽  
pp. 65-73
Author(s):  
Chu-Liang Lee ◽  
Roslina Mohd Sidek ◽  
Nasri Sulaiman ◽  
Fakhrul Zaman Rokhani
Keyword(s):  
Supply Voltage ◽  
Drop Out ◽  
Voltage Regulator ◽  
Cmos Process ◽  
Process Technology ◽  
Worst Case ◽  
Unity Gain ◽  
Quiescent Current ◽  
Additional Current ◽  
Loop Stability

This paper proposed a low quiescent current low-dropout voltage regulator (LDO) with self-compensation loop stability. This LDO is designed for Silicon-on-Chip (SoC) application without off-chip compensation capacitor. Worst case loop stability phenomenon happen when LDO output load current (Iload) is zero. The second pole frequency decreased tremendously towards unity-gain frequency (UGF) and compromise loop stability. To prevent this, additional current is needed to keep the output in low impedance in order to maintain second pole frequency. As Iload slowly increases, the unneeded additional current can be further reduced. This paper presents a circuit which performed self-reduction on this current by sensing the Iload. On top of that, a self-compensation circuit technique is proposed where loop stability is selfattained when Iload reduced below 100μA. In this technique, unity-gain frequency (UGF) will be decreaed and move away from second pole in order to attain loop stability. The decreased of UGF is done by reducing the total gain while maintaining the dominant pole frequency. This technique has also further reduced the total quiescent current and improved the LDO’s efficiency. The proposed LDO exhibits low quiescent current 9.4μA and 17.7μA, at Iload zero and full load 100mA respectively. The supply voltage for this LDO is 1.2V with 200mV drop-out voltage. The design is validated using 0.13μm CMOS process technology.

scholarly journals A 0.3 V PNN Based 10T SRAM with Pulse Control Based Read-Assist and Write Data-Aware Schemes for Low Power Applications

Sensors ◽  
2021 ◽  
Vol 21 (19) ◽  
pp. 6591
Author(s):  
Ming-Hwa Sheu ◽  
Chang-Ming Tsai ◽  
Ming-Yan Tsai ◽  
Shih-Chang Hsia ◽  
S. M. Salahuddin Morsalin ◽  
...  
Keyword(s):  
Low Power ◽  
Supply Voltage ◽  
Random Access ◽  
Average Energy ◽  
Cmos Process ◽  
Pulse Control ◽  
Power Performance ◽  
Process Technology ◽  
Low Leakage ◽  
Noise Margin

An innovative and stable PNN based 10-transistor (10T) static random-access memory (SRAM) architecture has been designed for low-power bit-cell operation and sub-threshold voltage applications. The proposed design belongs to the following features: (a) pulse control based read-assist circuit offers a dynamic read decoupling approach for eliminating the read interference; (b) we have utilized the write data-aware techniques to cut off the pull-down path; and (c) additional write current has enhanced the write capability during the operation. The proposed design not only solves the half-selected problems and increases the read static noise margin (RSNM) but also provides low leakage power performance. The designed architecture of 1-Kb SRAM macros (32 rows × 32 columns) has been implemented based on the TSMC-40 nm GP CMOS process technology. At 300 mV supply voltage and 10 MHz operating frequency, the read and write power consumption is 4.15 μW and 3.82 μW, while the average energy consumption is only 0.39 pJ.

scholarly journals A New CMOS Controllable Impedance Multiplier with Large Multiplication Factor

2017 ◽  
Vol 2017 ◽  
pp. 1-6 ◽  
Author(s):  
Munir A. Al-Absi
Keyword(s):  
Cmos Technology ◽  
Cmos Process ◽  
Multiplication Factor ◽  
Process Technology ◽  
Subthreshold Region ◽  
Low Pass ◽  
Simulation Results ◽  
High Pass

This paper presents a new compact controllable impedance multiplier using CMOS technology. The design is based on the use of the translinear principle using MOSFETs in subthreshold region. The value of the impedance will be controlled using the bias currents only. The impedance can be scaled up and down as required. The functionality of the proposed design was confirmed by simulation using BSIM3V3 MOS model in Tanner Tspice 0.18 μm TSMC CMOS process technology. Simulation results indicate that the proposed design is functioning properly with a tunable multiplication factor from 0.1- to 100-fold. Applications of the proposed multiplier in the design of low pass and high pass filters are also included.

High-Swing, High-Resolution, Low-Power, Low-Area Voltage-Mode LTA/WTA Circuits

2015 ◽  
Vol 24 (07) ◽  
pp. 1550103 ◽  
Author(s):  
Mohammad Soleimani ◽  
Siroos Toofan ◽  
Mostafa Yargholi
Keyword(s):  
High Resolution ◽  
Low Power ◽  
Power Dissipation ◽  
Supply Voltage ◽  
Rank Order ◽  
Active Area ◽  
Total Power ◽  
Common Source ◽  
Cmos Process ◽  
Process Technology

In this paper, a general architecture for analog implementation of loser/winner-take-all (LTA/WTA) and other rank order circuits is presented. This architecture is composed of a differential amplifier with merged n-inputs and a merged common-source with active load (MCSAL) circuit to choose the desired input. The advantages of the proposed structure are simplicity, very high resolution, very low supply voltage requirements, very low output resistor, low power dissipation, low active area and simple expansion for multiple inputs by adding only three transistors for each extra input. The post-layout simulation results of proposed circuits are presented by HSPICE software in 0.35-μm CMOS process technology. The total power dissipation of proposed circuits is about 110-μW. Also, the total active area is about 550-μm2 for five-input proposed circuits, and would be negligibly increased for each extra input.

A Low-Cost Low-Power Capacitive Humidity Sensor in CMOS Technology

2014 ◽  
Vol 556-562 ◽  
pp. 1842-1846
Author(s):  
Fang Ming Deng ◽  
Yi Gang He
Keyword(s):  
Humidity Sensor ◽  
Supply Voltage ◽  
Low Cost ◽  
Cmos Technology ◽  
Cmos Process ◽  
Sensing Element ◽  
Digital Conversion ◽  
Sensor Interface ◽  
Delta Sigma ◽  
Capacitive Humidity Sensor

This paper presents a capacitive humidity sensor in CMOS technology. The humidity sensor element is implemented in standard CMOS technology without any further post-processing, which results in low fabrication cost. The sensor interface is based on a delta-sigma converter and can be easily reconfigured to compensate for process variation of the sensing element. The proposed humidity sensor is fabricated in 0.16μm standard CMOS process and the chip occupies 0.25mm2. The measurement result shows that this humidity sensor acquires a resolution of 0.1%RH in the range of 20%RH to 90%RH. The interface achieves a 12.5-bits capacitance-to-digital conversion and consumes only 9.6μW power at 1.2V supply voltage.

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