Next Generation Chip Embedding Technology for High Efficient Mid Power Modules

2017 ◽  
Vol 2017 (1) ◽  
pp. 000737-000741
Author(s):  
Kay S. Essig ◽  
CT Chiu ◽  
Jarris Kuo ◽  
Phidia Chen ◽  
Jean-Marc Yannou
Keyword(s):  
Point Of View ◽  
Thermal Dissipation ◽  
Electrical Performance ◽  
Switching Frequency ◽  
Lead Frame ◽  
Next Generation ◽  
Beneficial Effects ◽  
Power Modules ◽  
High Switching Frequency ◽  
High Efficient

Abstract Embedding active dies into the substrate is fulfilling integration requirements for modern communication devices, and furthermore embedding was shown to have beneficial effects on electrical performance and thermal dissipation, especially for mid power modules (from a few hundred watts to 5kW) [1–3]. It comes with strong advantages as the power modules operate at higher frequencies (MHz range) and aim to apply smaller capacitors and inductors. This approach reduces the overall PCB size and weight from system point of view. These beneficial effects were observed especially for embedded power dies that were already mounted in a lead frame cavity when embedding [3]. In this paper we shall report the development of embedded technologies for power modules mounted in a lead frame cavity and compare electrical performance, thermal dissipation and reliability results with conventional PQFN packaging [3]. We shall also report electrical performance in various operation frequency ranges from a few kHz to MHz to address the benefit on high switching frequency power modules for SiC or GaN applications. We will also address if the EMI effect can be eliminated by using chip embedded technology instead of wire bonding connection from driver to gate pad of power MOSFET chip. We will conclude that the challenges of electrical performance and thermal dissipation required for today's power modules can successfully be overcome by next generation power modules based on lead frame chip embedding.

Higher Efficiency Power Module Solutions by Chip Embedding

2016 ◽  
Vol 2016 (1) ◽  
pp. 000402-000405
Author(s):  
Kay S Essig ◽  
CT Chiu ◽  
Jarris Kuo ◽  
Phidia Chen ◽  
Jean-Marc Yannou
Keyword(s):  
High Volume ◽  
Thermal Dissipation ◽  
Electrical Performance ◽  
Handheld Devices ◽  
Power Module ◽  
Beneficial Effects ◽  
Power Modules ◽  
Expected Benefits ◽  
Intelligent Power Module ◽  
High Level

Abstract The development in communication handheld devices has pushed the demand for packages with high level of functionality and complexity at the same time smaller package outline and decreased package thickness. Embedding active dies and/or passive components into the substrate is fulfilling these integration requirements, but embedding can have further beneficial effects (electrical performance, thermal dissipation, shielding) that deliver more benefit for embedding (1). Whereas embedding dies in substrates seems a simple concept, it can come with strong advantages as found in the described case for Power Modules in terms of electrical performance and thermal dissipation. In this paper we shall report the development of embedded technologies for Power Modules and compare electrical performance, thermal dissipation and reliability results with other Power Module package types. We shall report on an intelligent power module for server applications up to 1.5kW consisting of a driver IC and 2 MOSFETs using embedded die in substrate technology in high volume manufacturing. We will describe the development of next generation embedding technologies for Power Modules, their expected benefits and respective application targets together with simulation results. We conclude with a brief overview of the challenges that come with embedded packaging supply chain.

Evaluation of Low Cost, High Temperature Die and Substrate Attach Materials for Silicon Carbide (SiC) Power Modules

2018 ◽  
Vol 2018 (1) ◽  
pp. 000317-000325
Author(s):  
Sayan Seal ◽  
Brandon Passmore ◽  
Brice McPherson
Keyword(s):  
High Temperature ◽  
Room Temperature ◽  
Operating Conditions ◽  
Acoustic Microscopy ◽  
Switching Frequency ◽  
Power Devices ◽  
Formidable Challenge ◽  
Die Attach ◽  
Power Modules ◽  
High Switching Frequency

Abstract The performance of SiC power devices has demonstrated superior characteristics as compared to conventional Silicon (Si) devices. Some of the advantages of SiC power devices over Si include higher voltage blocking capability, low specific on-resistance, high switching frequency, high temperature operation, and high power density. Thus, SiC modules are capable of processing significant levels of power within much smaller volumes compared with its Si counterparts. These high thermal loads present a formidable challenge in integrating SiC devices in power modules. For example, known-good materials and processes for silicon power modules are not rated at the aggressive operating conditions associated with SiC devices. Two of the most critical interfaces in a power electronics module are the die-attach and substrate- attach. A degradation in these interfaces often results in potentially catastrophic electrical and thermal failure. Therefore, it is very important to thoroughly evaluate die-attach materials before implementing them in SiC power modules. This paper presents the methodology for the evaluation of die attach materials for SiC power modules. Preforms of a lead-free high-temperature attach material were used to perform a die and substrate attach process on a conventional power module platform. The initial attach quality was inspected using non- destructive methods consisting of acoustic microscopy and x-ray scanning. Die attach and substrate attach voiding of < 5% was obtained indicating a very good attach quality. Cross-sectioning techniques were used to validate the inspection methods. The initial attach strength was measured using pull tests and shear tests. The measurements were repeated at the rated temperature of the module to ensure that the properties did not degrade excessively at the service temperature. At the rated module temperature of 175 °C, the die bonding strength was found to be ~ 75 kg. This was only 25% lower than the strength at room temperature. In addition, the contact pull strength was measured to be > 90 kg at 175 °C, which was 25% lower than the value measured at room temperature. The effect of power cycling and thermal cycling on the quality and strength of the die and substrate attach layers was also investigated.

scholarly journals Determination of the charge and discharge modes duration effect on the LiFePO4 cells resource in the electric power source

2021 ◽  
Vol 2061 (1) ◽  
pp. 012006
Author(s):  
N I Schurov ◽  
S I Dedov
Keyword(s):  
Electric Vehicle ◽  
Primary Source ◽  
Operating Mode ◽  
Point Of View ◽  
Battery Life ◽  
Switching Frequency ◽  
High Switching Frequency ◽  
Duration Effect ◽  
Battery Cells

Abstract The paper is devoted to the determination of the resource of LiFePO4 battery cells when they are used as a primary source of energy in an electric vehicle. The analysis of the WLTC driving cycle from the point of view of the currents arising in the battery of an electric vehicle was carried out, its main parameters were revealed, such as: the duration and magnitude of the charge and discharge currents and the duration of the pause. The results of experiments on determining the resource of an 18650 cell at various load cycles are presented. It was found that cells loaded with a low current with a high switching frequency of the operating mode are subject to the greatest degradation. The lowest degradation rate was observed in cells loaded with low current with short-term charging modes. The result obtained will make it possible to more accurately determine the remaining life of the battery cells. Also, the data can be used to improve the algorithms of the BMS in order to extend the battery life.

scholarly journals PMSM Servo-Drive Fed by SiC MOSFETs Based VSI

2018 ◽  
Vol 3 (1) ◽  
pp. 35-45
Author(s):  
Tomasz Tarczewski ◽  
Michal Skiwski ◽  
Lech M. Grzesiak ◽  
Marek Zieliński
Keyword(s):  
Position Control ◽  
Experimental Tests ◽  
Current Control ◽  
Switching Frequency ◽  
Servo Drive ◽  
Power Switching ◽  
High Switching Frequency ◽  
High Efficient ◽  
Control Schemes ◽  
Efficient Power

Abstract The article presents modern PMSM servo-drive with SiC MOSFETs power devices and microprocessor with ARM Cortex core. The high switching frequency is obtained due to the application of high efficient power switching components and powerful microprocessor. It allows to achieve good dynamical properties of current control loop, proper disturbance compensation and silent operation of servo-drive. Experimental tests results obtained for two different control schemes (i.e., cascade control structure and state feedback position control) are presented.

scholarly journals Active Damping in Series Connected Power Modules with Continuous Output Voltage

2021 ◽  
Vol 6 (1) ◽  
pp. 314-335
Author(s):  
Sabrina Ulmer ◽  
Gernot Schullerus ◽  
Ertugrul Sönmez
Keyword(s):  
Output Voltage ◽  
Active Damping ◽  
Switching Frequency ◽  
High Electron ◽  
Power Modules ◽  
Continuous Output ◽  
High Switching Frequency ◽  
In Series ◽  
Lc Filter ◽  
Output Filter

Abstract This paper presents a modular and scalable power electronics concept for motor control with continuous output voltage. In contrast to multilevel concepts, modules with continuous output voltage are connected in series. The continuous output voltage of each module is obtained by using gallium nitride (GaN) high electron motility transistor (HEMT)s as switches inside the modules with a switching frequency in the range between 500 kHz and 1 MHz. Due to this high switching frequency a LC filter is integrated into the module resulting in a continuous output voltage. A main topic of the paper is the active damping of this LC output filter for each module and the analysis of the series connection of the damping behaviour. The results are illustrated with simulations and measurements.

scholarly journals Insulation Life Span of Low-Voltage Electric Motors—A Survey

Energies ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1738
Author(s):  
Vanessa Neves Höpner ◽  
Volmir Eugênio Wilhelm
Keyword(s):  
Life Span ◽  
Electric Motor ◽  
Low Voltage ◽  
Frequency Converter ◽  
Rate Of Change ◽  
High Rate ◽  
Switching Frequency ◽  
Electric Motors ◽  
Frequency Converters ◽  
High Switching Frequency

The use of static frequency converters, which have a high switching frequency, generates voltage pulses with a high rate of change over time. In combination with cable and motor impedance, this generates repetitive overvoltage at the motor terminals, influencing the occurrence of partial discharges between conductors, causing degradation of the insulation of electric motors. Understanding the effects resulting from the frequency converter–electric motor interaction is essential for developing and implementing insulation systems with characteristics that support the most diverse applications, have an operating life under economically viable conditions, and promote energy efficiency. With this objective, a search was carried out in three recognized databases. Duplicate articles were eliminated, resulting in 1069 articles, which were systematically categorized and reviewed, resulting in 481 articles discussing the causes of degradation in the insulation of electric motors powered by frequency converters. A bibliographic portfolio was built and evaluated, with 230 articles that present results on the factors that can be used in estimating the life span of electric motor insulation. In this structure, the historical evolution of the collected information, the authors who conducted the most research on the theme, and the relevance of the knowledge presented in the works were considered.

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