Low-Power Digital Part Design for a LF RFID tag in a Double-Poly 180 nm CMOS Process

Author(s):  
Kirill D. Liubavin ◽  
Igor V. Ermakov ◽  
Alexander Y. Losevskoy ◽  
Andrey V. Nuykin ◽  
Alexander S. Strakhov
Keyword(s):  
Rfid Tag ◽  
Electronics ◽  
2016 ◽  
Vol 5 (4) ◽  
pp. 92 ◽  
Author(s):  
Mohammad Badal ◽  
Mamun Reaz ◽  
Zinah Jalil ◽  
Mohammad Bhuiyan

Power dissipation of CMOS IC is a key factor in low power applications especially in RFID tag memories. Generally, tag memories like electrically erasable programmable read-only memory (EEPROM) require an internal clock generator to regulate the internal voltage level properly. In EEPROM, oscillator circuit can generate any periodic clock signal for frequency translation. Among different types of oscillators, a current starved ring oscillator (CSRO) is described in this research due to its very low current biasing source, which in turn restrict the current flows to reduce the overall power dissipation. The designed CSRO is limited to three stages to reduce the power dissipation to meet the specs. The simulated output shows that, the improved CSRO dissipates only 4.9 mW under the power supply voltage (VDD) 1.2 V in Silterra 130 nm CMOS process. Moreover, this designed oscillator has the lowest phase noise -119.38 dBc/Hz compared to other research works. In addition, the designed CSRO is able to reduce the overall chip area, which is only 0.00114 mm2. Therefore, this proposed low power and low phase noise CSRO will be able to regulate the voltage level successfully for low power RFID tag EEPROM.


Author(s):  
Kirill Liubavin ◽  
Alexander Losevskoy ◽  
Igor Ermakov

The results of the development of a digital part for the low-frequency RFID tag and the results of power saving methods study in 180 nm, 90 nm and 45 nm CMOS processes are presented. Using of the presented methods allows to reduce the power consumption and area of the digital part by 400 % and by 50 %, respectively. For the target 180 nm CMOS process the maximum dynamic power is less than 1 μW, and the occupied area is 0.042 mm2.


2014 ◽  
Vol 513-517 ◽  
pp. 2938-2942
Author(s):  
Wei Lv ◽  
Xin An Wang ◽  
Ji Ting Su

This paper presents a novel low-power digital baseband for UHF RFID tag. The design is complied with a modified ISO 18000-6C protocol. In order to reduce the peak power, module-reuse and other advanced low power techniques are applied. And a novel baseband architecture is discussed, which fulfills the protocol functions and reduces power consumption. The whole tag chip, including digital baseband, RF/analog frontend and memory, has been taped out using TSMC 0.18um CMOS process. The chip area is 89234 um2 excluding test pads. Its power consumption is 11.63uw under 1.1v power supply.


2010 ◽  
Vol E93-C (6) ◽  
pp. 785-795
Author(s):  
Sung-Jin KIM ◽  
Minchang CHO ◽  
SeongHwan CHO
Keyword(s):  
Rfid Tag ◽  

2017 ◽  
Vol MCSP2017 (01) ◽  
pp. 7-10 ◽  
Author(s):  
Subhashree Rath ◽  
Siba Kumar Panda

Static random access memory (SRAM) is an important component of embedded cache memory of handheld digital devices. SRAM has become major data storage device due to its large storage density and less time to access. Exponential growth of low power digital devices has raised the demand of low voltage low power SRAM. This paper presents design and implementation of 6T SRAM cell in 180 nm, 90 nm and 45 nm standard CMOS process technology. The simulation has been done in Cadence Virtuoso environment. The performance analysis of SRAM cell has been evaluated in terms of delay, power and static noise margin (SNM).


Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 889
Author(s):  
Xiaoying Deng ◽  
Peiqi Tan

An ultra-low-power K-band LC-VCO (voltage-controlled oscillator) with a wide tuning range is proposed in this paper. Based on the current-reuse topology, a dynamic back-gate-biasing technique is utilized to reduce power consumption and increase tuning range. With this technique, small dimension cross-coupled pairs are allowed, reducing parasitic capacitors and power consumption. Implemented in SMIC 55 nm 1P7M CMOS process, the proposed VCO achieves a frequency tuning range of 19.1% from 22.2 GHz to 26.9 GHz, consuming only 1.9 mW–2.1 mW from 1.2 V supply and occupying a core area of 0.043 mm2. The phase noise ranges from −107.1 dBC/HZ to −101.9 dBc/Hz at 1 MHz offset over the whole tuning range, while the total harmonic distortion (THD) and output power achieve −40.6 dB and −2.9 dBm, respectively.


Electronics ◽  
2021 ◽  
Vol 10 (7) ◽  
pp. 805
Author(s):  
Shi Zuo ◽  
Jianzhong Zhao ◽  
Yumei Zhou

This article presents a low power digital controlled oscillator (DCO) with an ultra low power duty cycle correction (DCC) scheme. The DCO with the complementary cross-coupled topology uses the controllable tail resistor to improve the tail current efficiency. A robust duty cycle correction (DCC) scheme is introduced to replace self-biased inverters to save power further. The proposed DCO is implemented in a Semiconductor Manufacturing International Corporation (SMIC) 40 nm CMOS process. The measured phase noise at room temperature is −115 dBc/Hz at 1 MHz offset with a dissipation of 210 μμW at an oscillating frequency of 2.12 GHz, and the resulin figure-of-merit is s −189 dBc/Hz.


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