A speed-optimized, low-noise APD with 0.18 μm CMOS technology for the VLC applications

2020 ◽  
Vol 34 (29) ◽  
pp. 2050321
Author(s):  
Wei Wang ◽  
Hong-An Zeng ◽  
Fang Wang ◽  
Guanyu Wang ◽  
Yingtao Xie ◽  
...  
Keyword(s):  
Dark Current ◽  
Complementary Metal Oxide Semiconductor ◽  
Visible Light Communication ◽  
Cmos Technology ◽  
Low Noise ◽  
Oxide Semiconductor ◽  
Excess Noise ◽  
Avalanche Breakdown ◽  
Cmos Process ◽  
Noise Characteristics

A new avalanche photodiode device applied to a visible light communication (VLC) system is designed using a standard 0.18 [Formula: see text]m complementary metal oxide semiconductor process. Compared to regular CMOS APD devices, the proposed device adds a [Formula: see text]-well layer above the deep [Formula: see text]-well/[Formula: see text]-substrate structure, and an [Formula: see text]/[Formula: see text] layer is deposited upon it. The [Formula: see text]/[Formula: see text] layer acts as an avalanche breakdown layer of the device, and an STI structure is used to prevent the edge break prematurely. The simulation results shows that the avalanche breakdown voltage is as low as 9.9 V, dark current is below [Formula: see text] A under −9.5 V bias voltage, and the 3 dB bandwidth is of 5.9 GHz. It is due to the use of the 0.18 [Formula: see text]m CMOS process-specific STI protection ring and short-circuits the connection of the deep [Formula: see text]-well/[Formula: see text]-substrate, and the dark current is reduced to be lower than two orders of magnitude compared to regular CMOS APD. Gain and noise characteristics are accurately calculated from Hayat dead-space model applied to this CMOS APD. So, this device’s gain and excess noise factor are 20 and 2.5, respectively.

A Study on Scalability and Variation of CMOS Low Noise Amplifier in Advance CMOS Technology Processes

2016 ◽  
Vol 833 ◽  
pp. 135-139
Author(s):  
Dayang Nur Salmi Dharmiza Awang Salleh ◽  
Rohana Sapawi
Keyword(s):  
Complementary Metal Oxide Semiconductor ◽  
Rf Circuits ◽  
Cmos Technology ◽  
Low Noise ◽  
Low Noise Amplifier ◽  
Oxide Semiconductor ◽  
Technology Scaling ◽  
Wireless Applications ◽  
Noise Amplifier ◽  
Technology Processes

Recent technology requires multistandard Radio Frequency (RF) chips for multipurpose wireless applications. In RF circuits, a low-noise amplifier (LNA) plays the key role in determining the receiver’s performance. With CMOS technology scaling, various designs has been adopted to study circuit’s characteristic and variation. In this paper, we present the results of scalable wideband LNA design based on complementary metal oxide semiconductor (CMOS), with its variance study. The design was fabricated in 180nm, 90nm, 65nm and 40nm CMOS technology.

scholarly journals DIGITAL CONTROLLED OSCILLATOR (DCO) FOR ALL DIGITAL PHASE-LOCKED LOOP (ADPLL) – A REVIEW

2019 ◽  
Vol 82 (1) ◽  
Author(s):  
Florence Choong ◽  
Mamun Ibne Reaz ◽  
Mohamad Ibrahim Kamaruzzaman ◽  
Md. Torikul Islam Badal ◽  
Araf Farayez ◽  
...  
Keyword(s):  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Phase Locked Loop ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Process Technology ◽  
Chip Area ◽  
Digital Phase ◽  
Low Power Dissipation

Digital controlled oscillator (DCO) is becoming an attractive replacement over the voltage control oscillator (VCO) with the advances of digital intensive research on all-digital phase locked-loop (ADPLL) in complementary metal-oxide semiconductor (CMOS) process technology. This paper presents a review of various CMOS DCO schemes implemented in ADPLL and relationship between the DCO parameters with ADPLL performance. The DCO architecture evaluated through its power consumption, speed, chip area, frequency range, supply voltage, portability and resolution. It can be concluded that even though there are various schemes of DCO that have been implemented for ADPLL, the selection of the DCO is frequently based on the ADPLL applications and the complexity of the scheme. The demand for the low power dissipation and high resolution DCO in CMOS technology shall remain a challenging and active area of research for years to come. Thus, this review shall work as a guideline for the researchers who wish to work on all digital PLL.

scholarly journals A 2.6 GS/s 8-Bit Time-Interleaved SAR ADC in 55 nm CMOS Technology

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 305 ◽  
Author(s):  
Dong Wang ◽  
Xiaoge Zhu ◽  
Xuan Guo ◽  
Jian Luan ◽  
Lei Zhou ◽  
...  
Keyword(s):  
High Speed ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Sar Adc ◽  
Oxide Semiconductor ◽  
Power Measurement ◽  
Cmos Process ◽  
Analog To Digital ◽  
Full Speed ◽  
Time Interleaved

This paper presents an eight-channel time-interleaved (TI) 2.6 GS/s 8-bit successive approximation register (SAR) analog-to-digital converter (ADC) prototype in a 55-nm complementary metal-oxide-semiconductor (CMOS) process. The channel-selection-embedded bootstrap switch is adopted to perform sampling times synchronization using the full-speed master clock to suppress the time skew between channels. Based on the segmented pre-quantization and bypass switching scheme, double alternate comparators clocked asynchronously with background offset calibration are utilized in sub-channel SAR ADC to achieve high speed and low power. Measurement results show that the signal-to-noise-and-distortion ratio (SNDR) of the ADC is above 38.2 dB up to 500 MHz input frequency and above 31.8 dB across the entire first Nyquist zone. The differential non-linearity (DNL) and integral non-linearity (INL) are +0.93/−0.85 LSB and +0.71/−0.91 LSB, respectively. The ADC consumes 60 mW from a 1.2 V supply, occupies an area of 400 μm × 550 μm, and exhibits a figure-of-merit (FoM) of 348 fJ/conversion-step.

scholarly journals Modeling, Simulation Methods and Characterization of Photon Detection Probability in CMOS-SPAD

Sensors ◽  
2021 ◽  
Vol 21 (17) ◽  
pp. 5860
Author(s):  
Aymeric Panglosse ◽  
Philippe Martin-Gonthier ◽  
Olivier Marcelot ◽  
Cédric Virmontois ◽  
Olivier Saint-Pé ◽  
...  
Keyword(s):  
Detection Probability ◽  
Computer Aided Design ◽  
Single Photon ◽  
Complementary Metal Oxide Semiconductor ◽  
Simulation Method ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Doping Profile ◽  
Cmos Process ◽  
Photon Detection

Single-Photon Avalanche Diodes (SPAD) in Complementary Metal-Oxide Semiconductor (CMOS) technology are potential candidates for future “Light Detection and Ranging” (Lidar) space systems. Among the SPAD performance parameters, the Photon Detection Probability (PDP) is one of the principal parameters. Indeed, this parameter is used to evaluate the SPAD sensitivity, which directly affects the laser power or the telescope diameter of space-borne Lidars. In this work, we developed a model and a simulation method to predict accurately the PDP of CMOS SPAD, based on a combination of measurements to acquire the CMOS process doping profile, Technology Computer-Aided Design (TCAD) simulations, and a Matlab routine. We compare our simulation results with a SPAD designed and processed in CMOS 180 nm technology. Our results show good agreement between PDP predictions and measurements, with a mean error around 18.5%, for wavelength between 450 and 950 nm and for a typical range of excess voltages between 15 and 30% of the breakdown voltage. Due to our SPAD architecture, the high field region is not entirely insulated from the substrate, a comparison between simulations performed with and without the substrate contribution indicates that PDP can be simulated without this latter with a moderate loss of precision, around 4.5 percentage points.

scholarly journals A 5-nV/√Hz Chopper Negative-R Stabilization Preamplifier for Audio Applications

Micromachines ◽  
2020 ◽  
Vol 11 (5) ◽  
pp. 478
Author(s):  
Jamel Nebhen ◽  
Khaled Alnowaiser ◽  
Stephane Meillere
Keyword(s):  
Supply Voltage ◽  
Signal To Noise Ratio ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Low Noise ◽  
Oxide Semiconductor ◽  
Chopper Stabilization ◽  
Main Amplifier ◽  
Measurement Results ◽  
Low Noise Preamplifier

This paper presents a low-noise and low-power audio preamplifier. The proposed low-noise preamplifier employs a delay-time chopper stabilization (CHS) technique and a negative-R circuit, both in the auxiliary amplifier to cancel the non-idealities of the main amplifier. The proposed technique makes it possible to mitigate the preamplifier 1/f noise and thermal noise and improve its linearity. The low-noise preamplifier is implemented in 65 nm complementary metal-oxide semiconductor (CMOS) technology. The supply voltage is 1.2 V, while the power consumption is 159 µW, and the core area is 192 µm2. The proposed circuit of the preamplifier was fabricated and measured. From the measurement results over a signal bandwidth of 20 kHz, it achieves a signal-to-noise ratio (SNR) of 80 dB, an equivalent-input referred noise of 5 nV/√Hz and a noise efficiency factor (NEF) of 1.9 within the frequency range from 1 Hz to 20 kHz.

Fabrication of microbridges in standard complementary metal oxide semiconductor technology

1989 ◽  
Vol 67 (4) ◽  
pp. 184-189 ◽  
Author(s):  
M. Parameswaran ◽  
Lj. Ristic ◽  
A. C. Dhaded ◽  
H. P. Baltes ◽  
W. Allegretto ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Integrated Circuit ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Layout Design ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Digital Cmos ◽  
Sensor Applications

Complementary metal oxide semiconductor (CMOS) technology is one of the leading fabrication technologies of the semiconductor integrated-circuit industry. We have discovered features inherent in the standard CMOS fabrication process that lend themselves to the manufacturing of micromechanical structures for sensor applications. In this paper we present an unconventional layout design methodology that allows us to exploit the standard CMOS process for producing microbridges. Two types of microbridges, bare polysilicon microbridges and sandwiched oxide microbridges, have been manufactured by first implementing a special layout design in an industrial digital CMOS process, followed by a postprocessing etching step.

A Novel Structure of Thermopile Infrared Detector with High Responsivity Based on CMOS Process

2012 ◽  
Vol 271-272 ◽  
pp. 381-385
Author(s):  
Lei Sun ◽  
Wei Bing Wang ◽  
Xiao Yong Fang
Keyword(s):  
Infrared Detector ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Consumer Products ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Ir Detector ◽  
Additional Material ◽  
High Responsivity ◽  
Novel Structure

Superscript textThermopile-type Infrared detector is more and more popular in many fields, including infrared spectroscopy, radiometry, security systems and many consumer products. This paper reports a novel n-poly/p-poly thermopile suspension structure with four pairs of thermopiles that compatible with Complementary Metal-Oxide Semiconductor (CMOS) technology and its fill factor is larger than 90%. No additional material is needed to enhance infrared absorption since the passivation layer provided by the CMOS process is sufficient for certain infrared spectral bands. With the selected material parameters the optimal structure parameters are obtained after simulation. Through the theoretic calculation, this novel IR detector has good properties of high responsivity (larger than 1000V/W) and detectivity (larger than 1×108cm Hz1/2W-1) and low response time (shorter than 30ms).

scholarly journals Research on High-Resolution Miniaturized MEMS Accelerometer Interface ASIC

Sensors ◽  
2020 ◽  
Vol 20 (24) ◽  
pp. 7280
Author(s):  
Xiangyu Li ◽  
Yangong Zheng ◽  
Xiangyan Kong ◽  
Yupeng Liu ◽  
Danling Tang
Keyword(s):  
High Precision ◽  
Closed Loop ◽  
Low Noise ◽  
Oxide Semiconductor ◽  
High Signal ◽  
Cmos Process ◽  
Frequency Noise ◽  
Interface Circuit ◽  
Noise Characteristics ◽  
Mems Accelerometers

High-precision microelectromechanical system (MEMS) accelerometers have wide application in the military and civil fields. The closed-loop microaccelerometer interface circuit with switched capacitor topology has a high signal-to-noise ratio, wide bandwidth, good linearity, and easy implementation in complementary metal oxide semiconductor (CMOS) process. Aiming at the urgent need for high-precision MEMS accelerometers in geophones, we carried out relevant research on high-performance closed-loop application specific integrated circuit (ASIC) chips. According to the characteristics of the performance parameters and output signal of MEMS accelerometers used in geophones, a high-precision closed-loop interface ASIC chip based on electrostatic time-multiplexing feedback technology and proportion integration differentiation (PID) feedback control technology was designed and implemented. The interface circuit consisted of a low-noise charge-sensitive amplifier (CSA), a sampling and holding circuit, and a PID feedback circuit. We analyzed and optimized the noise characteristics of the interface circuit and used a capacitance compensation array method to eliminate misalignment of the sensitive element. The correlated double sampling (CDS) technology was used to eliminate low-frequency noise and offset of the interface circuit. The layout design and engineering batch chip were fabricated by a standard 0.35 μm CMOS process. The active area of the chip was 3.2 mm × 3 mm. We tested the performance of the accelerometer system with the following conditions: power dissipation of 7.7 mW with a 5 V power supply and noise density less than 0.5 μg/Hz1/2. The accelerometers had a sensitivity of 1.2 V/g and an input range of ±1.2 g. The nonlinearity was 0.15%, and the bias instability was about 50 μg.

A Charge Amplifier Based Complementary Metal–Oxide–Semiconductor Analog Front End for Piezoelectric Microphones in Hearing Aid Devices

2019 ◽  
Vol 15 (3) ◽  
pp. 315-322
Author(s):  
Manu Chilukuri ◽  
Sungyong Jung ◽  
Hoon-Ju Chung
Keyword(s):  
Hearing Aid ◽  
Complementary Metal Oxide Semiconductor ◽  
Low Noise ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Charge Amplifier ◽  
Front End ◽  
Analog Front End ◽  
A Charge ◽  
Cascode Current Mirror

In this paper, a low noise and low power analog front end for piezoelectric microphones used in hearing aid devices is presented. It consists of a Charge Amplifier, followed by a Variable Gain Amplifier and an Analog-to-Digital Converter. At the core of charge amplifier a two stage opamp with modified cascode current mirror is designed which achieves a gain of 93 dB and phase margin of 62°. Designed analog front end achieves an input referred noise of 0.12 μVrms and SNR of 74 dB. It consumes power of 430 μW from 1.8 V supply and occupies an area of 1.2 mm × 0.22 mm. Proposed circuit is designed and fabricated in 0.18 μm CMOS process. Designed circuit is interfaced with a sensor model of piezoelectric microphone, which mimics Ormia ochracea's auditory system, and its performance is successfully verified against simulation results.

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