A 3.1 GB/s, 8 Kb, ZERO PRECHARGE, PIPELINED, HIGHLY STABLE 2-PORT 8T SRAM DESIGN IN 65 nm

2013 ◽  
Vol 22 (08) ◽  
pp. 1350069 ◽  
Author(s):  
ABHIJIT SIL ◽  
KRISHNA PRASAD BALUSU ◽  
CHANDRA SEKHAR GURRAM ◽  
MAGDY BAYOUMI
Keyword(s):  
High Speed ◽  
Data Transfer ◽  
Supply Voltage ◽  
Access Time ◽  
Pipeline Architecture ◽  
Noise Margin ◽  
Sram Cell ◽  
Sram Design ◽  
Cell Current ◽  
Stability Issues

As the supply voltage is reducing with feature size, SRAM cell design is going through severe stability issues. The issue becomes worse due to increased variability in below sub-100 nm technology. In this paper, we present a highly stable 2-port 8T SRAM cell for high speed application in 65 nm technology. The proposed design provides high stability under simultaneous read/write disturbed access without reducing the I cell . The cell characteristic is extensively examined under random variation. The dynamic read noise margin is improved by 95% over conventional dual port SRAM. The zero-precharge sensing and virtual ground scheme reduce read path leakage current by 95% over conventional high precharge 2-port SRAM cell. The cell current is improved by 52% over conventional design. Finally, an 8 Kb bit-interleaved 2-stage pipelined SRAM architecture is presented using proposed cell. The 2-stage pipeline architecture provides data transfer bandwidth of 3.1 GB/s. Area-efficient 2-stage decoder layout helps to avoid pseudo read problem in unselected cells without sacrificing memory access time.

scholarly journals Leakage Immune Modified Pass Transistor Based 8T SRAM Cell in Subthreshold Region

2015 ◽  
Vol 2015 ◽  
pp. 1-10 ◽  
Author(s):  
Priya Gupta ◽  
Anu Gupta ◽  
Abhijit Asati
Keyword(s):  
Supply Voltage ◽  
Access Time ◽  
Power Supply Voltage ◽  
Subthreshold Region ◽  
Technology Node ◽  
Noise Margin ◽  
Sram Cell ◽  
Margin Distribution ◽  
Cell Stability ◽  
Pass Transistor

The paper presents a novel 8T SRAM cell with access pass gates replaced with modified PMOS pass transistor logic. In comparison to 6T SRAM cell, the proposed cell achieves 3.5x higher read SNM and 2.4x higher write SNM with 16.6% improved SINM (static current noise margin) distribution at the expense of 7x lower WTI (write trip current) at 0.4 V power supply voltage, while maintaining similar stability in hold mode. The proposed 8T SRAM cell shows improvements in terms of 7.735x narrower spread in average standby power, 2.61x less in averageTWA(write access time), and 1.07x less in averageTRA(read access time) at supply voltage varying from 0.3 V to 0.5 V as compared to 6T SRAM equivalent at 45 nm technology node. Thus, comparative analysis shows that the proposed design has a significant improvement, thereby achieving high cell stability at 45 nm technology node.

scholarly journals Design of Low Power Memory Architecture using 10t Sram Array

2019 ◽  
Vol 8 (4) ◽  
pp. 10650-10653
Keyword(s):  
Low Power ◽  
Power Dissipation ◽  
Low Voltage ◽  
Supply Voltage ◽  
Random Access ◽  
Total Power ◽  
Access Time ◽  
Stable Operation ◽  
Sram Cell ◽  
Sram Design

The main aim of electronics is to design low power devices due to the prevalent usage of powered gadget. Ultra low voltage operation of memory cells has become a subject of a lot of interest because of its applications in terribly low energy computing. The stable operation of static random access memory (SRAM) is important for the success of low voltage SRAM and it is achieved by parameter variations of scaled technologies. The power consumption and access time of the SRAM is also a complex parameter due to the unavoidable switching activities of the number of transistors used for different blocks like, SRAM cell, access transistors, pre-charge circuit, sense amplifier and decoders. It has been shown that conventional 6T SRAM fail to achieve low power and delay operation. The proposed 10T SRAM design gives an approach towards the hold power dissipation. The designed circuit has 10 transistors out of that 2 transistors are used as sleep transistor. The sleep transistors are used as switches. Such as header and footer switches and the switches are turned on during active mode of operations and turned off during idle or standby mode of operations. The designed SRAM cell also has conducting pMOS circuit, which can reduces the total power dissipation. The SRAM cell is simulated by using Cadence tool. A supply voltage of 1.8V is used which makes it enough for low power applications. The power obtained as 761.7mW, which reduces 15% of conventional 6T SRAM design. The delay obtained as 125.6ns, which reduces 45% of conventional 6T SRAM.

scholarly journals A Low Leakage 9T SRAM Cell With Improve Stability in Sub-Threshold Region for IoT Applications

2021 ◽  
Author(s):  
Harekrishna Kumar ◽  
V.K Tomar
Keyword(s):  
Power Dissipation ◽  
Supply Voltage ◽  
Random Access ◽  
Mean Value ◽  
Access Time ◽  
Threshold Region ◽  
Low Leakage ◽  
Noise Margin ◽  
Sram Cell ◽  
Forward Body Bias

Abstract This paper presents a single-ended read and differential write half select free 9T static random access memory (SRAM) cell operates in the sub-threshold region. Proposed 9T SRAM cell shows a reasonable reduction in read and write power dissipation by a factor of 1.41× and 2.1× respectively as of conventional 6T (Conv.6T) SRAM cell. The stacking of transistors at core latch network minimizes the leakage power of the cell. The read static noise margin (RSNM) and write margin (WM) are upgraded by 2.16× and 2.06× respectively as of Conv.6T cell. A forward body bias technique is utilized in read path which results to decreases in read access time by a factor of 2.72× as of standard 6T SRAM cell. The mean value of Ion/Ioff ratio of the proposed cell is improved by 2.92× as compared to the Conv.6T SRAM cell. It is attributed to a reduction in bit-line leakage current. To achieve more soundness in characteristics of the proposed 9T SRAM cell, process variation effect on RSNM, power dissipation, and read current is calculated through Monte Carlo (MC) simulation at 5000 points. The obtained results are compared with reference SRAM cells at 0.3V supply voltage.

scholarly journals A Low Power 6T-Auto Awake Mode-SRAM Design for high speed storage application

2019 ◽  
Vol 8 (9) ◽  
pp. 204-208
Keyword(s):  
Low Power ◽  
High Speed ◽  
Random Access ◽  
Digital World ◽  
Noise Margin ◽  
Sram Cell ◽  
Sram Design ◽  
Static Ram ◽  
Power Application ◽  
Reduced Power Consumption

In the digital world, Static Random Access Memory (SRAM) is one of the efficient core component for electronics design, it consumes huge amount of power and die area. In this research, the SRAM design analysis in terms of read margin, write margin and Static Noise Margin (SNM) for low power application is considered. In SRAM memory, both read and write operation affect by noise margin. So, read and write noise margins are considered as the significant challenges in designing SRAM cell. In this research, robust 6T-SRAM cell is designed to decrease the power utilization. The Auto Awake Mode is developed to control the entire 6T-SRAM cell design. The proposed 6T-SRAM- Auto Awake Mode (6T-SRAM-AAM) was implemented to reduce power utilization of understand and write down operation inside the 20 nm FinFET library. The experimental results showed the proposed 6T-SRAM-AAM design reduced power consumption of read & write operation up to 25% to 33.33% compared to existing Static RAM cells design

Design and Analysis of SRAM Cell using Negative Bit-Line Write Assist Technique and Separate Read Port for High-Speed Applications

2021 ◽  
pp. 2150270
Author(s):  
Jitendra Kumar Mishra ◽  
Lakshmi Likhitha Mankali ◽  
Kavindra Kandpal ◽  
Prasanna Kumar Misra ◽  
Manish Goswami
Keyword(s):  
Power Dissipation ◽  
High Speed ◽  
Random Access ◽  
Random Access Memory ◽  
Access Memory ◽  
Static Noise Margin ◽  
Semiconductor Memory ◽  
Noise Margin ◽  
Sram Cell ◽  
Static Noise

The present day electronic gadgets have semiconductor memory devices to store data. The static random access memory (SRAM) is a volatile memory, often preferred over dynamic random access memory (DRAM) due to higher speed and lower power dissipation. However, at scaling down of technology node, the leakage current in SRAM often increases and degrades its performance. To address this, the voltage scaling is preferred which subsequently affects the stability and delay of SRAM. This paper therefore presents a negative bit-line (NBL) write assist circuit which is used for enhancing the write ability while a separate (isolated) read buffer circuit is used for improving the read stability. In addition to this, the proposed design uses a tail (stack) transistor to decrease the overall static power dissipation and also to maintain the hold stability. The comparison of the proposed design has been done with state-of-the-art work in terms of write static noise margin (WSNM), write delay, read static noise margin (RSNM) and other parameters. It has been observed that there is an improvement of 48%, 11%, 19% and 32.4% in WSNM while reduction of 33%, 39%, 48% and 22% in write delay as compared to the conventional 6T SRAM cell, NBL, [Formula: see text] collapse and 9T UV SRAM, respectively.

A Read-Static-Noise-Margin-Free SRAM Cell for Low-VDD and High-Speed Applications

2006 ◽  
Vol 41 (1) ◽  
pp. 113-121 ◽  
Author(s):  
K. Takeda ◽  
Y. Hagihara ◽  
Y. Aimoto ◽  
M. Nomura ◽  
Y. Nakazawa ◽  
...  
Keyword(s):  
High Speed ◽  
Static Noise Margin ◽  
Noise Margin ◽  
Sram Cell ◽  
Static Noise

scholarly journals A Technique for Designing Variation Resilient Subthreshold Sram Cell

2013 ◽  
Vol 14 (1) ◽  
Author(s):  
Aminul Islam
Keyword(s):  
Process Variations ◽  
Access Time ◽  
Static Noise Margin ◽  
Design Metrics ◽  
Random Dopant Fluctuation ◽  
Noise Margin ◽  
Sram Cell ◽  
Transmission Gates ◽  
The Cost ◽  
Static Noise

This paper presents a technique for designing a variability aware subthreshold SRAM cell. The architecture of the proposed cell is similar to the standard read-decoupled 8-transistor (RD8T) SRAM cell with the exception that the access FETS are replaced with transmission gates (TGs). In this work, various design metrics are assessed and compared with RD8T SRAM cell. The proposed design offers 2.14× and 1.75× improvement in TRA (read access time) and TWA (write access time) respectively compared with RD8T. It proves its robustness against process variations by featuring narrower spread in TRA distribution (2.35×) and TWA distribution (3.79×) compared with RD8T. The proposed bitcell offers 1.16× higher read current (IREAD) and 1.64× lower bitline leakage current (ILEAK) respectively compared with RD8T. It also shows its robustness by offering 1.34× (1.58×) tighter spread in IREAD (ILEAK) compared with RD8T. It exhibits 1.42× larger IREAD to ILEAK ratio. It shows 2.2× higher frequency @ 250 mV with read bitline capacitance of 10 fF. Besides, the proposed bitcell achieves same read stability and write-ability as that of RD8T at the cost of 3 extra transistors. The leakage power of the proposed design is close to that of RD8T.   ABSTRAK: Kertas kerja ini membentangkan teknik merekabentuk sel bawah ambang SRAM yang bolehubah. Senibina sel yang dicadangkan adalah sama dengan sel SRAM 8-transistor (RD8T) “pisahan-bacaan” piawai kecuali FET akses  digantikan dengan sel pintu transmisi (TGs). Di dalam kajian ini, beberapa metrik rekabentuk dinilai dan dibandingkan dengan sel RD8T SRAM. Rekabentuk yang dicadangkan menawarkan  peningkatan 2.14× dan 1.75×  dalam TRA (masa akses baca) dan TWA (masa akses tulis) berbanding dengan RD8T. Ia membuktikan kekukuhan variasi proses dengan menampilkan tebaran yang lebih sempit dalam pengagihan TRA (2.35 ×) dan pengagihan TWA (3.79 ×) berbanding dengan RD8T. Sel-Bit yang dicadangkan mempunyai arus baca 1.16 × lebih tinggi  (IREAD) dan arus bocor bitline 1.64 × lebih rendah (ILEAK) berbanding dengan RD8T. Ia juga membuktikan kekukuhan dengan menawarkan 1.34 × (1.58 ×) penyebaran sempit di IREAD (ILEAK) berbanding dengan RD8T dan nisbah IREAD / ILEAK 1.42 × lebih besar. Ia menunjukkan kekerapan 2.2 × lebih tinggi pada 250 mV dengan kemuatan membaca bitline sebanyak 10 fF. Selain itu, sel bit yang dicadangkan mencapai kestabilan membaca dan keupayaan menulis yang sama seperti RD8T dengan kos tambahan 3 transistor. Kebocoran kuasa  rekabentuk yang dicadangkan hampir sama dengan RD8T. KEYWORDS: variability; robust, subthreshold; random dopant fluctuation (RDF); read static noise margin (RSNM); write static noise margin (WSNM).

scholarly journals VARIABILITY ANALYSIS OF 6T AND 7T SRAM CELL IN SUB-45NM TECHNOLOGY

2011 ◽  
Vol 12 (1) ◽  
pp. 13-30 ◽  
Author(s):  
Aminul Islam ◽  
Mohd. Hasan
Keyword(s):  
Random Access ◽  
Memory Cell ◽  
Static Random Access Memory ◽  
Access Time ◽  
Access Memory ◽  
Static Noise Margin ◽  
Noise Margin ◽  
Sram Cell ◽  
Pvt Variations ◽  
Static Noise

This paper analyses standard 6T and 7T SRAM (static random access memory) cell in light of process, voltage and temperature (PVT) variations to verify their functionality and robustness. The 7T SRAM cell consumes higher hold power due to its extra cell area required for its functionality constraint. It shows 60% improvement in static noise margin (SNM), 71.4% improvement in read static noise margin (RSNM) and 50% improvement in write static noise margin (WSNM). The 6T cell outperforms 7T cell in terms of read access time (TRA) by 13.1%. The write access time (TWA) of 7T cell for writing "1" is 16.6 x longer than that of 6T cell. The 6T cell proves it robustness against PVT variations by exhibiting narrower spread in TRA (by 1.2 x) and Twa (by 3.4x). The 7T cell offers 65.6% saving in read power (RPWR) and 89% saving in write power (WPWR). The RPWR variability indicates that 6T ell is more robust against process variation by 3.9x. The 7T cell shows 1.3x wider write power (WPWR) variability indicating 6T cell's robustness against PVT variations. All the results are based on HSPICE simulation using 32 nm CMOS Berkeley Predictive Technology Model (BPTM).

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