scholarly journals Exploration of the deposition limits of microcrystalline silicon

2005 ◽  
Vol 77 (2) ◽  
pp. 379-389 ◽  
Author(s):  
D. Mataras
Keyword(s):  
Deposition Rate ◽  
Process Parameters ◽  
Microcrystalline Silicon ◽  
Optimum Pressure ◽  
Deposition Rates ◽  
Electron Population ◽  
Hydrogenated Silicon ◽  
Radical Generation ◽  
Deposition Substrate ◽  
Crystalline Growth

The effect of various process parameters on the deposition rate of microcrystalline hydrogenated silicon is presented. The various pathways leading to high deposition rates involve the optimization of a combination of parameters, while maintaining the crystalline character of the film and avoiding the presence of particles. The deposition rate increases in conditions that enhance and at the same time “cool down” the electron population. Such conditions are: moderately higher frequencies, higher pressures, and the presence of larger molecules (like disilane) even in small quantities. There is an optimum pressure, determined by primary dissociation, for a certain silane fraction. In addition, silane fraction and power density must also increase up to the limit of transition to amorphous growth and before attachment becomes too important. In all of these cases, there is a need for optimizing the distance of the deposition substrate to the source of radical generation, especially at higher pressures, to further increase the already important contribution of higher silicon radicals. It is shown that similar deposition rates can be obtained via radical fluxes with very different compositions. In every case, there is a need for sufficient H atom fluxes to ensure crystalline growth.

Use of A GAS Jet Technique to Prepare Microcrystalline Silicon Based Solar Cells at High I-Layer Deposition Rates

1999 ◽  
Vol 557 ◽  
Author(s):  
S.J. Jones ◽  
R. Crucet ◽  
X. Deng ◽  
J. Doehler ◽  
R. Kopf ◽  
...  
Keyword(s):  
Solar Cells ◽  
Peak Power ◽  
Light Exposure ◽  
Red Light ◽  
Gas Jet ◽  
Scale Production ◽  
Microcrystalline Silicon ◽  
Deposition Rates ◽  
Layer Deposition ◽  
Power Outputs

AbstractUsing a Gas Jet thin film deposition technique, microcrystalline silicon (μc-Si) materials were prepared at rates as high as 15-20 Å/s. The technique involves the use of a gas jet flow that is subjected to a high intensity microwave source. The quality of the material has been optimized through the variation of a number of deposition conditions including the substrate temperature, the gas flows, and the applied microwave power. The best films were made using deposition rates near 16 Å/s. These materials have been used as i-layers for red light absorbing, nip single-junction solar cells. Using a 610nm cutoff filter which only allows red light to strike the device, pre-light soaked currents as high as 10 mA/cm2 and 2.2-2.3% red-light pre-light soaked peak power outputs have been obtained for cells with i-layer thicknesses near 1 micron. This compares with currents of 10-11 mA/cm2 and 4% initial red-light peak power outputs obtained for high efficiency amorphous silicon germanium alloy (a-SiGe:H) devices. The AM1.5 white light efficiencies for these microcrystalline cells are 5.9-6.0%. While the efficiencies for the a-SiGe:H cells degrade by 15-20% after long term light exposure, the efficiencies for the microcrystalline cells before and after prolonged light exposure are similar, within measurement error. Considering these results, the Gas Jet deposition method is a promising technique for the deposition of μc-Si solar cells due to the ability to achieve reasonable stable efficiencies for cells at i-layer deposition rates (16 Å/s) which make large-scale production economically feasible.

Microcrystalline Silicon Growth: Deposition Rate Limiting Factors

1998 ◽  
Vol 507 ◽  
Author(s):  
S. Hamma ◽  
D. Colliquet ◽  
P. Rocai Cabarrocas
Keyword(s):  
Deposition Rate ◽  
Hydrogen Plasma ◽  
Limiting Factors ◽  
Layer By Layer ◽  
Microcrystalline Silicon ◽  
Glass Substrates ◽  
Hydrogen Dilution ◽  
Corning Glass ◽  
Silicon Growth

ABSTRACTMicrocrystalline silicon films were deposited on corning glass substrates both by the standard hydrogen dilution and the layer-by-layer (LBL) technique. In-situ UV-visible spectroscopic ellipsometry measurements were performed to analyze the evolution of the composition of the films.The change of the hydrogen plasma conditions by increasing the pressure in the LBL process leads to a faster kinetic of crystallization and to an increase of the deposition rate by a factor of two. The increase of the pressure and the decrease of the inter-electrode distance allowed to increase the deposition rate from 0.26 to 3 Å/s in the hydrogen dilution technique. Interestingly enough, the crystalline fraction of the films remains higher than 50%. However, as the deposition rate increases the growth process results in a slower kinetic of crystallization with a long range evolution of the film composition (up to 0.5 νm).

Impact of Deposition Rate on the Structural and Magnetic Properties of Sputtered Ni/Cu Multilayer Thin Films

2017 ◽  
Vol 73 (1) ◽  
pp. 85-90 ◽  
Author(s):  
Ali Karpuz ◽  
Salih Colmekci ◽  
Hakan Kockar ◽  
Hilal Kuru ◽  
Mehmet Uckun
Keyword(s):  
Thin Films ◽  
Magnetic Properties ◽  
Deposition Rate ◽  
High Rate ◽  
Cubic Phase ◽  
High Deposition Rate ◽  
Multilayer Thin Films ◽  
Face Centered Cubic ◽  
Deposition Rates ◽  
Cu Films

AbstractThe structural and corresponding magnetic properties of Ni/Cu films sputtered at low and high deposition rates were investigated as there is a limited number of related studies in this field. 5[Ni(10 nm)/Cu(30 nm)] multilayer thin films were deposited using two DC sputtering sources at low (0.02 nm/s) and high (0.10 nm/s) deposition rates of Ni layers. A face centered cubic phase was detected for both films. The surface of the film sputtered at the low deposition rate has a lot of micro-grains distributed uniformly and with sizes from 0.1 to 0.4 μm. Also, it has a vertical acicular morphology. At high deposition rate, the number of micro-grains considerably decreased, and some of their sizes increased up to 1 μm. The surface of the Ni/Cu multilayer deposited at the low rate has a relatively more grainy and rugged structure, whereas the surface of the film deposited at the high rate has a relatively larger lateral size of surface grains with a relatively fine morphology. Saturation magnetisation, Ms, values were 90 and 138 emu/cm3 for deposition rates of 0.02 and 0.10 nm/s, respectively. Remanence, Mr, values were also found to be 48 and 71 emu/cm3 for the low and high deposition rates, respectively. The coercivity, Hc, values were 46 and 65 Oe for the low and high Ni deposition rates, respectively. The changes in the film surfaces provoked the changes in the Hc values. The Ms, Mr, and Hc values of the 5[Ni(10 nm)/Cu(30 nm)] films can be adjusted considering the surface morphologies and film contents caused by the different Ni deposition rates.

Microcrystalline Silicon for Solar Cells at High Deposition Rates by Hot Wire Cvd

2002 ◽  
Vol 715 ◽  
Author(s):  
R. E. I. Schropp ◽  
Y. Xu ◽  
E. Iwaniczko ◽  
G. A. Zaharias ◽  
A. H. Mahan
Keyword(s):  
Solar Cells ◽  
Substrate Temperature ◽  
Volume Fraction ◽  
Silicon Layer ◽  
Hot Wire ◽  
Crystalline Volume Fraction ◽  
Microcrystalline Silicon ◽  
Deposition Rates ◽  
Deposition Parameters ◽  
Si Films

AbstractWe have explored which deposition parameters in Hot Wire CVD have the largest impact on the quality of microcrystalline silicon (μc-Si) made at deposition rates (Rd) < 10 Å/s for use in thin film solar cells. Among all parameters, the filament temperature (Tfil) appears to be crucial for making device quality films. Using two filaments and a filament-substrate spacing of 3.2 cm, μc-Si films, using seed layers, can be deposited at high Tfil (∼2000°C) with a crystalline volume fraction < 70-80 % at Rd's < 30 Å/s. Although the photoresponse of these layers is high (< 100), they appear not to be suitable for incorporation into solar cells, due to their porous nature. n-i-p cells fabricated on stainless steel with these i-layers suffer from large resistive effects or barriers, most likely due to the oxidation of interconnected pores in the silicon layer. The porosity is evident from FTIR measurements showing a large oxygen concentration at ∼1050 cm-1, and is correlated with the 2100 cm-1 signature of most of the Si-H stretching bonds. Using a Tfil of 1750°C, however, the films are more compact, as seen from the absence of the 2100 cm-1 SiH mode and the disappearance of the FTIR Si-O signal, while the high crystalline volume fraction (< 70-80 %) is maintained. Using this Tfil and a substrate temperature of 400°C, we obtain an efficiency of 4.9 % for cells with a Ag/ZnO back reflector, with an i-layer thickness of only ∼0.7 μm. High values for the quantum efficiency extend to very long wavelengths, with values of 33 % at 800 nm and 15 % at 900 nm, which are unequalled by a-SiGe:H alloys. Further, by varying the substrate temperature to enable deposition near the microcrystalline to amorphous transition (‘edge’) and incorporating variations in H2 dilution during deposition of the bulk, efficiencies of 6.0 % have been obtained. The Rd's of these i-layers are 8-10 Å/s, and are the highest to date obtained with HWCVD for microcrystalline layers used in cells with efficiencies of ∼6 %.

Relation between Growth Precursors and Film Properties for Plasma Deposition of a-Si:H at Rates up to 100 Å/s

2000 ◽  
Vol 609 ◽  
Author(s):  
W.M.M. Kessels ◽  
A.H.M. Smets ◽  
J.P.M. Hoefnagels ◽  
M.G.H. Boogaarts ◽  
D.C. Schram ◽  
...  
Keyword(s):  
Substrate Temperature ◽  
Deposition Rate ◽  
Surface Reaction ◽  
Film Growth ◽  
Plasma Deposition ◽  
Reaction Probability ◽  
Film Properties ◽  
Deposition Rates ◽  
Minor Contribution ◽  
A Minor

ABSTRACTFrom investigations on the SiH3 and SiH radical density and the surface reaction probability in a remote Ar-H2-SiH4 plasma, it is unambiguously demonstrated that the a-Si:H film quality improves significantly with increasing contribution of SiH3 and decreasing contribution of very reactive (poly)silane radicals. Device quality a-Si:H is obtained at deposition rates up to 100 Å/s for conditions where film growth is governed by SiH3 (contribution ∼90%) and where SiH has only a minor contribution (∼2%). Furthermore, for SiH3 dominated film growth the effect of the deposition rate on the a-Si:H film properties with respect to the substrate temperature is discussed.

Effect of the Substrate Temperature on the Transition from Amorphous to Microcrystalline Silicon with High Hydrogen Dilution

2013 ◽  
Vol 773 ◽  
pp. 520-523
Author(s):  
Ming Liang Zhang ◽  
Hui Dong Yang ◽  
Kai Zhao Yang
Keyword(s):  
Substrate Temperature ◽  
Volume Fraction ◽  
Chemical Vapor ◽  
Silicon Films ◽  
Microcrystalline Silicon ◽  
High Hydrogen ◽  
Hydrogenated Silicon ◽  
Glass Substrates ◽  
Amorphous Hydrogenated Silicon ◽  
The Stability

Transition films of amorphous hydrogenated silicon (a-Si:H) to microcrystalline silicon (μc-Si:H) have attracted much attention due to the stability, high overall quality for solar cells configuration. Hydrogenated amorphous and microcrystalline silicon films were deposited on glass substrates by a conventional plasma enhanced chemical vapor deposition (PEVCD) varying the substrate temperature from 275 to 350 °C. A silane concentration of 4% and a total flow rate of 100 sccm were used at a gas pressure of 267 Pa. The film thicknesses of the prepared samples were between 700 and 900 nm estimated from the optical transmission spectra. The deposition rates were between 0.2 and 0.3 nm/s. The phase composition of the deposited silicon films were investigated by Raman spectroscopy. The transition from amorphous to microcrystalline silicon was found at the higher temperatures. The crystallization process of the amorphous silicon can be affected by the substrate temperature. A narrow structural transition region was observed from the changes of the crystalline volume fraction. The dark electrical conductivity of the silicon films increased as the substrate temperature increasing.

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