Failure Types & Analysis In Cu Process Development of Design-Rule 0.18μm CPU

2001 ◽  
Author(s):  
DongKwon Jeong ◽  
JuHyeon Ahn ◽  
SangIn Lee ◽  
JooHyuk Chung ◽  
ByungLyul Park ◽  
...  
Keyword(s):  
Process Improvement ◽  
Process Development ◽  
Metal Corrosion ◽  
Pass Rate ◽  
Design Rule ◽  
The Novel ◽  
Corrosion Loss ◽  
Barrier Metal ◽  
Development State ◽  
Failure Types

Abstract This paper presents the problems, the solutions, and the development state of the novel 0.18 μm Cu Metal Process through failure analysis of the Alpha CPU under development at Samsung Electronics. The presented problems include : “Via Bottom Lifting” induced by the Cu Via void, “Via Bottom dissociation” due to the IMD stress, “Via side dissociation” due to the poor formation of the Barrier Metal, “Via short/not-open failure” due to the IMD lifting, and Cu metal Corrosion/Loss. The analysis was carried out on the Via Contact Test Chain Patterns, using the “Electron (ION) Charge Up” method. After carefully analyzing each of the failure types, process improvement efforts followed. As a result, the pass rate of the via contact Rc was brought up from a mere 20% to 95%, and the device speed higher than 1.1 GHz was achieved, which surpasses the target speed of 1 GHz.

A Qualitative Comparison of the Covex Respirator with Face Shield Versus the N95 Respirator

2020 ◽  
Author(s):  
Reid Mimmack ◽  
Elijah Germo ◽  
Garrett Augustine ◽  
Kumar Belani
Keyword(s):  
Filtration Efficiency ◽  
Current Medical ◽  
Pass Rate ◽  
World Health ◽  
Protective Equipment ◽  
The Novel ◽  
Qualitative Comparison ◽  
Medical Standard ◽  
Novel Coronavirus ◽  
Health Organization

Abstract In March 2020, the World Health Organization declared the novel coronavirus (COVID-19) outbreak a worldwide pandemic. The pandemic led to concerns of shortages regarding healthcare-related resources, including personal protective equipment (PPE), ventilators, and more. The uniquely designed COVEX respirator with face shield was engineered and manufactured by Augustine Surgical, Inc. to combat the PPE shortage. The novel COVEX mask is an “all-in-one” face shield and filter with a Viral Filtration Efficiency (VFE) greater than 99%. A standard respirator qualitative fit test was completed on the COVEX respirator as well as the current medical standard 3M N95 respirator. Fit test studies comparing the two masks yielded similar outcomes. The COVEX respirator had a qualitative fit test pass rate of 96.6% and the 3M N95 respirator had a pass rate of 93.3% (n=30). Participants also reported other variables comparing the comfort and fit of each mask, which is described further in the discussion. The COVEX respirator with face shield passed a standardized qualitative fit test at a rate similar to the current medical standard N95 respirator. Our results suggest that the COVEX mask may be a viable PPE option in the future.

Pembentukan Sistem Pembangunan Proses (Process Development System) Melalui Proses Penambahbaikan di Kilang Lampin Pakai Buang

2012 ◽  
Author(s):  
Mohamad Nasir Saludin ◽  
Mohamad Nizam Abu Talib
Keyword(s):  
Process Improvement ◽  
Preventive Maintenance ◽  
Process Development ◽  
Video Recording ◽  
Time Machine ◽  
Statistical Process ◽  
Development System ◽  
Production Processes ◽  
Maintenance Time

SSistem Pembangunan Proses (Process Development System) merupakan satu pendekatan kejuruteraan sistematik terkini untuk menganalisis masalah dan menambahbaik kualiti produk atau proses. Kajian ini hanya memfokuskan kepada masalah proses pengeluaran dan penambahbaikan ke atas proses pengeluaran lampin pakai buang (diaper). Kajian ini dilakukan ke atas salah satu mesin (Mesin Technipro) pembuat lampin pakai buang. Kombinasi kawalan proses statistik dan pendekatan lain seperti Kepner Tregoe, Poka Yoke, SMED, zero setting, centerlining, F1 Pit Shop dan rakaman video digunakan untuk melakukan penambahbaikan. Ukuran masa perjalanan mesin, masa mesin berhenti akibat mengalami kerosakan, masa penyelenggaraan mesin, peratus kecekapan mesin, peratus produk yang dihasilkan dalam sejam, peratus masa lengah mesin dan peratus kecacatan yang terhasil digunakan bagi membandingkan hasil dari proses penambahbaikan yang dijalankan. Kajian ini telah berjaya membangunkan dan mereka bentuk sistem pembangunan proses bagi memperbaiki proses-proses yang sedia ada. Kata kunci: Sistem Pembangunan Proses, proses penambahbaikan, lampin pakai buang Process Development System is a systematic engineering approach to analyze problems and improve the processes and product quality. This study focuses on the problem of diaper production processes and its improvements. For the case study, one dedicated machine (Technopro Machine) is selected. Combination of Statistical Process Control and other approaches like Kepner Tregoe concept, Poka Yoke concept, SMED concept, zero setting, centerlining, F1 Pit Stop concept, and video recording are used in the improvement process. The machine running time, machine downtime, preventive maintenance time, machine efficiency percentage, and product produced per hour are used to monitor the efficiency of the improved processes. This study is successful in developing and designing the Process Development System to improve the existing processes. Keywords: Process Development System, process improvement, diaper

Mechanism Study of Contact Corrosion in Unpatterned Metal Wafer

1996 ◽  
Author(s):  
C.-H. Chang ◽  
Y.-S. Huang ◽  
H.-W. Chang
Keyword(s):  
Resistance Mechanism ◽  
Metal Corrosion ◽  
Mechanism Study ◽  
Chain Reaction ◽  
Influence Of Water ◽  
New Type ◽  
Metal Materials ◽  
Barrier Metal ◽  
Metal Etching ◽  
Wafer Edge

Abstract A new type metal corrosion, which occurred at contact hole of unpatterned metal wafer, is presented. This type of corrosion is strongly related to wafer queue time from metal sputtering to metal etching, it is thought to be due to chain reaction of chlorine from environmental results., fluorine from wafer edge and moisture desorbed by undermetal dielectric (ILD). Moreover, all corrosion sites accompany with poor metal stepcoverage that is caused by either large seams in W plug or rough ILD surface. Experimental results are presented which show the influence of water desorbed by different ILD materials, capability of water barrier with different barrier metal materials and post W etchback (WEB) thermal treatment on corrosion resistance. Mechanism are proposed to explain the formation of corrosion on unpatterned metal.

Simulation and Ergonomics Approach for Service & Manufacturing Process Improvement

2012 ◽  
Vol 502 ◽  
pp. 121-125 ◽  
Author(s):  
A. Sánchez-Lite ◽  
M. García-García
Keyword(s):  
Process Improvement ◽  
Process Design ◽  
Human Factor ◽  
Process Development ◽  
3D Design ◽  
Simulation Tools ◽  
Work Related ◽  
Work Related Musculoskeletal Disorders ◽  
And Control ◽  
Detection Evaluation

The human factor is a key variable in the efficiency of the product-process development system. The ability to be able to predict the influence of this factor in the process is a significant challenge in manufacturing engineering, as well as the consequences that the process designed has on this factor. All ergonomic considerations have traditionally been evaluated without using 3D product design. Nowadays, 3D process design technologies and simulation tools allow us the opportunity from the earliest stages of the design process. They can also be used to improve current processes in order to increase human comfort, productivity and safety. This paper describes a methodology using 3D design and simulation tools to improve industrial and service processes. This methodology has as an objective the detection, evaluation and control of work-related musculoskeletal disorders (WMSDs).

scholarly journals The importance of the laboratory to the pharmaceutical business

2000 ◽  
Vol 22 (2) ◽  
pp. 47-52 ◽  
Author(s):  
Juanita M. Hawkins
Keyword(s):  
Quality Control ◽  
Quality Assurance ◽  
Customer Satisfaction ◽  
Process Improvement ◽  
Cycle Time ◽  
Development Process ◽  
Process Development ◽  
Laboratory Practice ◽  
General Business

Understanding the contributions that the laboratory can make in product/process development, process improvement, market surveil lance and general business is key to the pharmaceutical business today. Poor laboratory practice yields compliance issues, increased cost, increased cycle time and delayed product introductions. This paper covers key areas of customer satisfaction, the role of quality control and quality assurance laboratories, measures of account ability and progress, and an example of how laboratory robotics can help meet important goals.

scholarly journals ECO-FRIENDLY PROCESSES FOR BIODIESEL PRODUCTION FROM NON-EDIBLE OILS

2013 ◽  
Vol 3 (1) ◽  
Author(s):  
Ivana Banković-Ilić ◽  
Olivera Stamenković ◽  
Vlada Veljković
Keyword(s):  
Vegetable Oils ◽  
Heterogeneous Catalysts ◽  
Process Development ◽  
Edible Oils ◽  
Continuous Process ◽  
Biodiesel Production ◽  
Waste Materials ◽  
The Novel ◽  
Economic Aspects ◽  
Biodiesel Synthesis

At present, edible vegetable oils are most often used feedstocks for industrial biodiesel production. In this paper, the various non-edible oils and usually used processes for biodiesel production are analyzed from the ecological and economic aspects. The aim of the paper is to present the possibilities for improving the biodiesel synthesis by employing the heterogeneous catalysts, the novel catalysts obtained from waste materials and continuous process development, especially taking into account their impact on the environment. Key words:alcoholysis, biodiesel, non-edible oils.

scholarly journals Study for plasma etching of dielectric film in semiconductor device manufacturing. Review of ASET research project

2002 ◽  
Vol 74 (3) ◽  
pp. 381-395 ◽  
Author(s):  
Makoto Sekine
Keyword(s):  
Plasma Etching ◽  
Semiconductor Device ◽  
Process Development ◽  
Reaction Model ◽  
Design Rule ◽  
Plasma Etch ◽  
Electron Collisions ◽  
Ion Energy ◽  
Etched Surface ◽  
Polymer Thickness

Conventional developments were conducted in a very empirical way, such as a trial and error with many speculations using qualitative data. This approach requires more and more resources and time for the development of future devices with a design rule below 100 nm in the system on a chip (SOC) era. It is necessary to establish a systematic methodology for process development and qualification. ASET Plasma Laboratory had been found to research a basis for the systematic development of the plasma etching technology. Fluorocarbon (CF) plasma for the etching of high-aspect-ratio contact holes in SiO2 was investigated intensively in the 5-year program that finished in March 2001. They introduced 5 plasma sources that can etch 0.1-mm contact holes on a 200-mm wafer in production, and state-of-the-art diagnostics tools for the plasma and etched surface. The SiO2 etch mechanism was revealed from the etch species generation to the reaction in a deep hole. The number of electron collisions to fluorocarbon gas molecule is proposed as an important parameter to control the gas dissociation and etch species flux to the surface. An etch reaction model was also proposed using the estimated-surface-reaction probability that is a function of ion energy and CF polymer thickness that reduces the net ion energy to the reaction layer. The CF polymer thickness was determined by a balance equation of generation term (radical fluxes) and loss terms (etching by ions, radicals, and out-flux oxygen from SiO2). A program was developed and successfully predicts the etch rates of Si-containing materials, including organic dielectrics. Requirements for the next-generation plasma etch tools are also discussed.

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