scholarly journals Compact Low-Cost Filter for 5G Interference Reduction in UHF Broadcasting Band

Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 974
Author(s):  
Oscar Fernández ◽  
Tomás Fernández ◽  
Álvaro Gómez
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Ground Plane ◽  
Cutoff Frequency ◽  
Production Costs ◽  
Fine Tuning ◽  
Circuit Board ◽  
Ring Resonators ◽  
Microstrip Technology ◽  
Uhf Band

The allocation of part of the UHF band to 4G and 5G services has generated the appearance of channel interferences over the digital terrestrial television frequency band. In order to reduce these interferences, this work presents a novel and efficient band-stop filter implemented using microstrip technology. The filter, designed with rectangular split-ring resonators etched in the ground plane, provides a cutoff frequency above channel 48 (694 MHz), a high roll-off rate of 44 dB in 56 MHz and a rejection bandwidth of 250 MHz that covers the upper UHF band occupied by 4G and 5G with rejection levels close to 35 dB. The filter is manufactured entirely over a printed circuit board without lumped elements to reduce production costs, fine tuning after the assembly stage and maintenance. Moreover, it presents a compact subwavelength size of only 0.07 λ × 0.17 λ to facilitate installation, whether at the input of the TV terminal or integrated with the balun at the rooftop antenna.

scholarly journals Bandwidth Enhancement of UWB Microstrip Antenna with a Modified Ground Plane

2009 ◽  
Vol 2009 ◽  
pp. 1-7 ◽  
Author(s):  
N. Prombutr ◽  
P. Kirawanich ◽  
P. Akkaraekthalin
Keyword(s):  
Microstrip Antenna ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Ground Plane ◽  
Circuit Board ◽  
Resonant Frequencies ◽  
Bandwidth Enhancement ◽  
Rectangular Slot ◽  
Compact Size ◽  
Circular Patch Antenna

This article presents a bandwidth enhancing technique using a modified ground plane with diagonal edges, rectangular slot, and T-shape cut for the design of compact antennas. The proposed low-cost, compact-size circular patch antenna on 3 cm 5.1 cm printed circuit board (FR-4) is designed and validated through simulations and experiments. Results show that the T-shaped ground plane with the presence of the diagonal cuts at the top corners and the rectangular slots can increase the bandwidth. Return losses of 19 and 26 dB for the first and second resonant frequencies, respectively, can be achieved when the depth of the diagonal cut is 5 mm, the dimension of each rectangular slot is  mm, and the T-shaped size is  mm, providing a 28.67% wider bandwidth than FCC standard.

scholarly journals DESIGN OF ULTRAWIDEBAND MONOPOLE ANTENNA WITH MINIMUM GROUND PLANE EFFECT

2014 ◽  
pp. 87-90
Author(s):  
PRAVEEN K P ◽  
T MARY NEEBHA
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Impedance Matching ◽  
Ground Plane ◽  
Ultra Wideband ◽  
Circuit Board ◽  
Uwb Antenna ◽  
Printed Circuit ◽  
Feed Line ◽  
Simple Geometry

A Planar ultra wideband antenna design is analyzed for increased impedance matching in the Ultrawideband (UWB) range (3.1GHz to 10.6GHz). Also the effect of the ground plane is minimized by cutting slot on the ground plane. Impedance matching of Ultrawideband (UWB) antenna can be improved by introducing simple microstrip transitions between the 50-ohm feed line and the printed disc. In this paper a dual step feed is proposed between the feed line and radiator. It also offers a very simple geometry suitable for low cost fabrication and straightforward printed circuit board integration. Here triangle slot is provided on the ground plane in order to reduce the ground plane effect. The radiator used here is elliptical disc.

scholarly journals U-Slot Cut Rectangular Microstrip Antenna with a Large Ground Plane and a Thin Substrate

2021 ◽  
Vol 20 ◽  
pp. 12-17
Author(s):  
Eva Karla Garza-Resendiz ◽  
Mario Reyes-Ayala ◽  
Edgar Alejandro Andrade-Gonzalez ◽  
Hilario Terres-Peña
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Mobile Radiocommunication ◽  
Ground Plane ◽  
Microstrip Antennas ◽  
Circuit Board ◽  
Slot Antennas ◽  
Low Dielectric ◽  
Thick Substrate ◽  
Rectangular Microstrip Antenna

It is very well known that the Rectangular Microstrip Antennas (RMA) are narrowband, but it is possible to enhance its bandwidth by cutting slots inside the patch. Some slots variations have been used to improve this important feature in modern mobile radiocommunication systems. U-slot antennas are employed in broadband applications, but it is very important to consider the usage of a thick substrate with a low dielectric constant. In this paper, an U-slot RMA built in a The Printed Circuit Board (PCB) with a thin FR4 substrate for 800 MHz to 900 MHz is presented and analyzed. The PCB that is necessary to fabricate the antenna is very low cost and it is conformable in many mobile terminals. The antenna was simulated in HFSS and measured using return losses and its antenna patterns.

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

scholarly journals A Study on the Radiated Susceptibility of Printed Circuit Boards and the Effects of Via Fencing

Electronics ◽  
2021 ◽  
Vol 10 (5) ◽  
pp. 539
Author(s):  
Ryan P. Tortorich ◽  
William Morell ◽  
Elizabeth Reiner ◽  
William Bouillon ◽  
Jin-Woo Choi
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Ground Plane ◽  
Circuit Board ◽  
Electronic Systems ◽  
Coupling Mechanism ◽  
Electromagnetic Modeling ◽  
Printed Circuit ◽  
Edge Radiation ◽  
Area Of Concern

Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) environments, there is growing interest in understanding how electronic systems are affected by such environments. Backdoor coupling in particular is an area of concern for all electronics, but there is limited understanding about the mechanisms behind backdoor coupling. In this work, we present a study on printed circuit board (PCB) backdoor coupling and the effects of via fencing. Existing work focuses on ideal stackups and indicates that edge radiation is significantly reduced by via fencing. In this study, both full wave electromagnetic modeling and experimental verification are used to investigate both ideal and practical PCB stackups. In the ideal scenario, we find that via fencing substantially reduces coupling, which is consistent with prior work on emissions. In the practical scenario, we incorporate component footprints and traces which naturally introduce openings in the top ground plane. Both simulation and experimental data indicate that via fencing in the practical scenario does not substantially mitigate coupling, suggesting that PCB edge coupling is not the dominant coupling mechanism, even at varying angles of incidence and polarization.

EFFECT OF HYDROTHERMAL TIME ON THE GROWTH OF ZnO NANORODS

2020 ◽  
pp. 84-91
Author(s):  
Hanh
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Cell Structure ◽  
Zno Nanorods ◽  
Zinc Nitrate ◽  
Circuit Board ◽  
Nitrate Hexahydrate ◽  
Hydrothermal Time ◽  
One Step ◽  
Surface Morphologies

In this work, ZnO nanorods (NRs) were successfully grown on printed circuit board substrates (PCBs) by utilizing a one-step, seedless, low-cost hydrothermal method. It was shown that by implementing a galvanic cell structure in an aqueous solution of 80 mM of zinc nitrate hexahydrate and hexamethylenetetramine, ZnO NRs can directly grow on the PCBs substrate without the assistance of a seed layer. The effect of hydrothermal time on the surface morphologies, and the crystallinity of the as-grown ZnO nanorods (NRs) was also investigated. The as-grown ZnO NRs also exhibited a significant enhancement in vertical growth and their crystallinity with 5 hour growth.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

scholarly journals A Microfabricated Bandpass Filter with Coarse-Tuning and Fine-Tuning Ability Based on IPD Process and PCB Artwork

Micromachines ◽  
2022 ◽  
Vol 13 (1) ◽  
pp. 123
Author(s):  
Junzhe Shen ◽  
Tian Qiang ◽  
Minjia Gao ◽  
Yangchuan Ma ◽  
Junge Liang ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Bandpass Filter ◽  
Fine Tuning ◽  
Circuit Board ◽  
Center Frequency ◽  
Spiral Inductor ◽  
Chip Area ◽  
Transmission Zero ◽  
Capacitance Variation ◽  
Zero Frequency

In this paper, a bandpass filter (BPF) was developed utilizing GaAs-based integrated passive device technology which comprises an asymmetrical spiral inductor and an interleaved array capacitor, possessing two tuning modes: coarse-tuning and fine-tuning. By altering the number of layers and radius of the GaAs substrate metal spheres, capacitance variation from 0.071 to 0.106 pF for coarse-tuning, and of 0.0015 pF for fine-tuning, can be achieved. Five air bridges were employed in the asymmetrical spiral inductor to save space, contributing to a compact chip area of 0.015λ0 × 0.018λ0. The BPF chip was installed on the printed circuit board artwork with Au bonding wire and attached to a die sink. Measured results demonstrate an insertion loss of 0.38 dB and a return loss of 21.5 dB at the center frequency of 2.147 GHz. Furthermore, under coarse-tuning mode, variation in the center frequency from 1.956 to 2.147 GHz and transmission zero frequency from 4.721 to 5.225 GHz can be achieved. Under fine-tuning mode, the minimum tuning value and the average tuning value of the proposed BPF can be accurate to 1.0 MHz and 4.7 MHz for the center frequency and 1.0 MHz and 12.8 MHz for the transmission zero frequency, respectively.

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