scholarly journals Study on Performance of the Thermoelectric Cooling Device with Novel Subchannel Finned Heat Sink

Energies ◽  
2021 ◽  
Vol 15 (1) ◽  
pp. 145
Author(s):  
Gaoju Xia ◽  
Huadong Zhao ◽  
Jingshuang Zhang ◽  
Haonan Yang ◽  
Bo Feng ◽  
...  
Keyword(s):  
Wind Speed ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Peltier Effect ◽  
Refrigeration System ◽  
Cold Side ◽  
Cooling Device ◽  
Thermoelectric Refrigeration ◽  
New Type

The thermoelectric refrigeration system is an application of the Peltier effect, and good refrigeration performance is dependent on effective heat dissipation performance. To enhance the cooling performance of the thermoelectric system, this paper designs a new type of finned heat sink, which does not change the overall size of the thermoelectric system. The performance of the refrigeration system under the new fin is tested by experiments under various conditions. During the experiment, the cooling wind speed, the temperature of the hot and cold side of the TEC, the power consumption of the fan, and other parameters were directly recorded through the measuring instrument. The results show that the use of new finned heat sinks can improve the COP of the thermoelectric refrigeration system. Within the scope of the study, the thermal resistance of the new fins can be reduced by , and the system COP value can be increased by . In addition, increasing the cooling wind speed can further reduce the cold side temperature. Within the research range, the lowest temperature can reach , but the power consumed by the fan is of that of the conventional fin heat sink refrigeration device.

scholarly journals Design and Manufacturing of Thermoelectric Mini Portable Refrigerator using Autodesk Fusion 360 and Additive Manufacturing

2020 ◽  
Vol 8 (5) ◽  
pp. 3441-3447
Keyword(s):  
Heat Load ◽  
Thermoelectric Module ◽  
Heat Sinks ◽  
Peltier Effect ◽  
Cold Side ◽  
Thermoelectric Refrigeration ◽  
Design And Manufacturing ◽  
Minimum Power Consumption ◽  
Cooling Function ◽  
Vapour Compression

The objective of this project is to develop portable thermoelectric refrigeration whose casing is designed using Autodesk Fusion 360 and manufactured by 3D printing. This refrigerator consists of thermoelectric module as cooling generator along with insulated cabin, thermostat and charging unit. Thermoelectric elements perform the same cooling function as Freon-based vapour compression or absorption refrigerators. The design of the refrigeration is based on the principle of thermoelectric module (i.e. Peltier effect) to create a hot side and a cold side. The cold side of the thermoelectric module is used for refrigeration purposes. On the other hand, the heat from the hot side of the module is rejected to the surroundings with the help of heat sinks and fan. Based on the heat load calculations, the thermoelectric module is selected. The system is fabricated and experimentally tested for the time taken to cool to the required temperature. The results showed that the system can maintain the temperature of approximately 10 °C with minimum power consumption of 64 Watt.

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

2015 ◽  
Author(s):  
Kazuma Obata ◽  
Takashi Fukue ◽  
Koichi Hirose ◽  
Mamoru Kikuchi ◽  
Yasuhiko Ueda ◽  
...  
Keyword(s):  
Electric Vehicles ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Vortex Generator ◽  
Heat Sinks ◽  
Vortex Generators ◽  
Water Cooling ◽  
Power Devices ◽  
Cooling Device ◽  
Flow Passage

This study describes a possibility of an improvement of water cooling devices for high-power electronic devices such as inverters for electric vehicles by using a combination of micro heat sinks and miniature vortex generators. Power devices such as IGBT (Insulated Gate Bipolar Transistor) are widely used for controlling an operation of electronic vehicles and hybrid vehicles. Due to the improvement of the performance of the power devices, the heat dissipation density from these devices becomes higher. The water cooling is the commonest method for dissipating heat from the inverter of the electronic vehicles. Therefore the improvement of the water cooling technology is significantly needed in order to manage the increase of the heat dissipation density. We are now trying to develop a high-performance water cooling device for dissipating the high heat flux from the inverters in the electric vehicles by using a combination of a fine miniature heat sink and a miniature vortex generator. The combination of the miniature heat sink and the vortex generator may increase heat transfer performance of the heat exchanger while inhibiting an increase of pressure drop by generating a swirling turbulent flow in a clearance between the heat sink fins. In this study, the water cooling performance in the narrow flow passage, which simulates the flow passage in the water cooling device, with the miniature heat sink and the miniature vortex generators was investigated by using 3-dimentional CFD analysis. From the analysis, we conclude that the combination of the miniature heat sink and the vortex generator was effective for the heat transfer enhancement in the narrow flow passage of the water cooling device while inhibiting the generation of the pressure drop when we can use the combination with the appropriate manner.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

Design of Optimum Plate-Fin Natural Convective Heat Sinks

2003 ◽  
Vol 125 (2) ◽  
pp. 208-216 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Madhusudan Iyengar ◽  
Allan D. Kraus
Keyword(s):  
Nusselt Number ◽  
Specific Heat ◽  
Rectangular Plate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Heat Sinks ◽  
And Performance ◽  
Nusselt Number Correlation ◽  
The Impact

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

scholarly journals Mathematical modeling and numerical simulation of heat dissipation in led bulbs

2020 ◽  
Vol 24 (3 Part A) ◽  
pp. 1877-1884 ◽  
Author(s):  
Diego Alarcón ◽  
Eduardo. Balvís ◽  
Ricardo Bendaña ◽  
Alberto Conejero ◽  
de Fernández ◽  
...  
Keyword(s):  
Mathematical Modeling ◽  
Numerical Simulation ◽  
Numerical Simulations ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Contact ◽  
Heat Sinks ◽  
Experimental Measurements ◽  
Heating And Cooling ◽  
The Common

We present a detailed study of heating and cooling processes in LED luminaires with passive heat sinks. Our analysis is supported by numerical simulations as well as experimental measurements, carried on commercial systems used for outdoor lighting. We have focused our analysis on the common case of a single LED source in thermal contact with an aluminum passive heat sink, obtaining an excellent agreement with experimental measurements and the numerical simulations performed. Our results can be easily expanded, without loss of generality, to similar systems.

Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics

2020 ◽  
Author(s):  
Jin Yao Ho ◽  
Kai Choong Leong
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Volume Fraction ◽  
Solid Volume Fraction ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Base Temperature ◽  
Storage Unit ◽  
Cooling Of Electronics

Abstract A thermal energy storage unit filled with phase change material (PCM) can serve as a heat sink for the cooling of electronics with intermittent or periodic heat dissipation rates. The use of thermal conductive structures (TCS) is an effective method of improving the thermal performance of a PCM-based heat sink. In this paper, topology optimization is explored to develop a new class of TCS with a tree-like structure to enhance the thermal performance of a trapezoidal heat sink. The topology-optimized heat sink was then fabricated by Selective Laser Melting (SLM) using an aluminum alloy, AlSi10Mg, as the base powder. Experiments were performed to evaluate the thermal performance of the topology-optimized heat sink with the tree-like structure. In addition, a conventional longitudinal-fin heat sink of the same solid volume fraction (φ = 16.2%) and a heat sink without enhanced structure were also fabricated and experimentally investigated for comparison. Rubitherm RT-35HC paraffin wax was used as the PCM. Three different heat fluxes of 4.00 kW/m2, 5.08 kW/m2 and 7.24 kW/m2 were applied at the base of each specimen by a silicone rubber heater. The structure wall and the PCM temperatures were measured over time. Our results show that, for all heat rates tested, the topology-optimized heat sink was able to maintain a lower base temperature as compared to the fin-structure and the plain heat sinks. A thermal enhancement ratio (ε) is defined to evaluate the performance of the heat sinks with and without the use of PCM. From the experimental results, the highest ε value of 8.6 was achieved by the topology-optimized heat sink. These results indicate the better performance of the topology-optimized heat sink in dissipating heat as compared to the other specimens.

Thermal Analysis for Three-Dimensional Heat Spreader Integrated With Heat Sink

2003 ◽  
Author(s):  
Y. C. Wu ◽  
H. T. Chen ◽  
C. C. Lin ◽  
Y. H. Hung
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Heat Sources ◽  
Heat Spreader ◽  
Discrete Heat Sources ◽  
Thermal Analyzer ◽  
Parametric Studies ◽  
Overall Resistance

An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performances such as local temperature distributions and isotherms on heat spreader surfaces; and overall resistance of heat spreader/sink assembly are investigated. Besides, a series of parametric studies have been performed. The parameters and conditions explored include the size and heat dissipation rate of heat sources, size and material of heat spreaders and heat sinks, type of convection in heat sink, and contact conditions between heat spreader and heat sink. The superiority of the developed thermal analyzer through two sample cases having multi-discrete heat sources has finally been demonstrated.

The Application of Heat Pipe Heat Sink for High Power LED Lamps

2014 ◽  
Vol 602-605 ◽  
pp. 2713-2716 ◽  
Author(s):  
Xin Rui Ding ◽  
Yu Ji Li ◽  
Zong Tao Li ◽  
Yong Tang ◽  
Bin Hai Yu ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Practical Significance ◽  
Heat Accumulation ◽  
Element Analysis ◽  
High Power Led

LED has been regarded as the next generation lighting source. As for high power LED lamps, heat accumulation will cause a series of problems. Therefore, thermal management is very important for designing a high power LED lamp. Three types of heat sinks are designed by using the finite element analysis (FEA) method for an 180W high power LED lamp. Then the optimized heat sinks are developed and experiments are performed to demonstrate the simulated results. At the same time, the thermal performances with different working angles are investigated experimentally. The heat sink with heat pipe has a better heat dissipation performance than the conventional heat sink under the same input power. The working angles of the lamps greatly influence the thermal performance of each heat sink. For the same heat sink, the temperature varies with different install directions and working angles. Finally, the heat sink with the best thermal performance is recommended. The results have practical significance in designing high power LED lamps.

Effect of Synthetic Jets Over Natural Convection Heat Sinks

2008 ◽  
Author(s):  
Mehmet Arik ◽  
Yogen Utturkar ◽  
Murat Ozmusul
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Synthetic Jet ◽  
Synthetic Jets ◽  
Operating Conditions ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Allowable Limit

In moderate power electronics applications, the most preferred way of thermal management is natural convection to air with or without heat sinks. Though the use of heat sinks is fairly adequate for modest heat dissipation needs, it suffers from some serious performance limitations. Firstly, a large volume of the heat sink is required to keep the junction temperature at an allowable limit. This need arises because of the low convective film coefficients due to close spacing. In the present computational and experimental study, we propose a synthetic jet embedded heat sink to enhance the performance levels beyond two times within the same volume of a regular passive heat sink. Synthetic jets are meso-scale devices producing high velocity periodic jet streams at high velocities. As a result, by carefully positioning of these jets in the thermal real estate, the heat transfer over the surfaces can be dramatically augmented. This increase in the heat transfer rate is able to compensate for the loss of fin area happening due to the embedding of the jet within the heat sink volume, thus causing an overall increase in the heat dissipation. Heat transfer enhancements of 2.2 times over baseline natural convection cooled heat sinks are measured. Thermal resistances are compared for a range of jet operating conditions and found to be less than 0.9 K/W. Local temperatures obtained from experimental and computational agreed within ± 5%.

scholarly journals Effect Of Position and Design Parameters of a Fan-Cooled Cold Side Heat Sink of a Thermoelectric Cooling-Module on The Performance of a Hybrid Refrigerator

2021 ◽  
Vol 85 (2) ◽  
pp. 66-79
Author(s):  
Yasser Abdulrazak Alghanima ◽  
Osama Mesalhy ◽  
Ahmed Farouk Abdel Gawad
Keyword(s):  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Design Parameters ◽  
Vapor Compression ◽  
Thermoelectric Cooling ◽  
Cold Side ◽  
Peltier Module ◽  
Cooling Module ◽  
Good Agreement

This paper presents a CFD and experimental study of the thermal behavior of the thermoelectric-compartment in a hybrid household-refrigerator that combines thermoelectric and vapor-compression technologies. The hybrid refrigerator has three compartments. One of them is driven by a thermoelectric cooling system, which was made of one Peltier module and two fan-cooled heat sinks mounted on the hot and cold sides. The simulation results were compared with experimental measurements and showed a good agreement. The performance of the thermoelectric refrigerator was tested with changing the pushing direction. Two pushing directions for the fan were examined. In the first one (direction-I), the fan was fixed such that it sucked the air beside the cold heat sink. While in the second direction (direction-II), the fan was assumed to be flipped to push the air over the cold-side heat sink. The results showed that the second fan direction (direction-II) is more effective for heat transfer mechanism between the cold-side heat sink and the inside air of the thermoelectric-compartment.

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