Experimental Analysis of a Vapor Chamber Applied to Thermal Management of Microelectronics

2015 ◽  
Vol 1120-1121 ◽  
pp. 1368-1372 ◽  
Author(s):  
Daniel Henrique de Souza Obata ◽  
Thiago Antonini Alves ◽  
Márcio Antonio Bazani ◽  
Amarildo Tabone Paschoalini
Keyword(s):  
Thermal Management ◽  
Integrated Circuit ◽  
Heat Sink ◽  
Power Dissipation ◽  
Pure Aluminum ◽  
Experimental Tests ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Airflow Velocity ◽  
Circuit Power

In this research, a vapor chamber embedded in the base of a heat sink was experimentally analyzed for the application in thermal management of microelectronics. The vapor chamber was produced by a copper and molybdenum alloy with length of 240 mm, width of 54 mm, thickness of 3 mm, and capillary structures composed by copper screen meshes. The working fluid used was de-ionized water. The pure aluminum heat sink was cooled by air forced convection and the evaporator vapor chamber was heated using an electrical resistor simulating integrated circuit power dissipation. The experimental tests were done in a suction type wind tunnel with open return for a heat load varying from 20 to 80 W and for an airflow velocity varying from 1 to 4 m/s. The experimental results showed that the considered vapor chamber worked successfully, maintaining low operating temperature.

Experimental investigation on the thermal performance of Si micro-heat pipe with different cross-sections

2017 ◽  
Vol 31 (30) ◽  
pp. 1750279 ◽  
Author(s):  
Mohammad Hamidnia ◽  
Yi Luo ◽  
Xiaodong Wang ◽  
Congming Li
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
Cross Sections ◽  
Integrated Circuit ◽  
Thermal Characteristics ◽  
Cost Savings ◽  
Working Fluid ◽  
Cross Sectional ◽  
Si Substrates ◽  
Silicon Based

Increasing component densities of the integrated circuit (IC) and packaging levels has led to thermal management problems. Si substrates with embedded micro-heat pipes (MHPs) couple good thermal characteristics and cost savings associated with IC batch processing. The thermal performance of MHP is intimately related to the cross-sectional geometry. Different cross-sections are designed in order to enhance the backflow of working fluid. In this experimental study, three different Si MHPs with same hydraulic diameter and various cross-sections are fabricated by micro-fabrication methods and tested under different conditions of fluid charge ratios. The results show that the trapezoidal MHP associated with rectangular artery which is charged with 40% of vapor chamber’s volume has the best thermal performance. This silicon-based MHP is a passive approach for thermal management, which could widen applications in the commercial electronics industry and LED lightings.

Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks

2009 ◽  
Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Structural Integrity ◽  
Heat Pipes ◽  
Electronic Cooling ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Trade Offs ◽  
Pipe Heat

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.

Thermal management of high-power LEDs based on integrated heat sink with vapor chamber

2017 ◽  
Vol 151 ◽  
pp. 1-10 ◽  
Author(s):  
Yong Tang ◽  
Lang Lin ◽  
Shiwei Zhang ◽  
Jian Zeng ◽  
Kairui Tang ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Heat Sink ◽  
Vapor Chamber

Electrical Characterization of 65 W Cubic Sonoreactor with Horizontally Stacked Transducers

2017 ◽  
Vol 42 (1) ◽  
pp. 149-153
Author(s):  
Pansak Kerdthongmee ◽  
Chat Pholnak ◽  
Chitnarong Sirisathitkul ◽  
Sorasak Danworaphong
Keyword(s):  
Lead Zirconate Titanate ◽  
Integrated Circuit ◽  
Heat Sink ◽  
Electrical Characterization ◽  
Acoustic Cavitation ◽  
Lead Zirconate ◽  
Maximum Temperature ◽  
Sonochemical Synthesis ◽  
Circuit Power

Abstract A sonoreactor was assembled with stacked lead zirconate titanate transducers. These transducers were attached on one side of a 10×10×10 cm3 chamber and driven by an integrated circuit power amplifier. The impedance of the reactor was analyzed in order to determine a matching inductance. The electrical frequency could be varied from 20 to 50 kHz and the electrical output power was adjustable up to 65 W. The highest power was obtained in the case of resonance at 31 kHz and the maximum temperature at the heat sink of the amplifier rose to 42.0° C. Both acoustic cavitation and mechanical effects could be utilized in this sonoreactor for a variety of purposes including sonochemical synthesis, ultrasonic cleaning and microbial cell disruption.

CFD Optimization of Design for IGBT Air-Cooled Heat Sink

2012 ◽  
Vol 562-564 ◽  
pp. 755-758 ◽  
Author(s):  
Bo Xu ◽  
Xin Chun Lin ◽  
Li Peng
Keyword(s):  
Thermal Management ◽  
Parameter Optimization ◽  
Heat Sink ◽  
Power Dissipation ◽  
Junction Temperature ◽  
Insulated Gate Bipolar Transistor ◽  
Complex Design ◽  
Heat Parameter ◽  
Cfd Optimization ◽  
Current Systems

Power dissipation problems for Insulated Gate Bipolar Transistor (IGBT) are requiring increasingly complex design solutions. While designs that are more efficient make thermal management possible, current systems still require CFD methods for dissipating heat. Parameter optimization of the air-cooled heat sink is carried out to cool a three-chip, 2400w IGBT plate. The parameters are compared using maximum junction temperature and fan efficiency.

High-Flux Thermal Management With Supercritical Fluids

2016 ◽  
Vol 138 (12) ◽  
Author(s):  
Brian M. Fronk ◽  
Alexander S. Rattner
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Electronics Cooling ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Management Approach ◽  
High Heat Flux ◽  
Two Phase ◽  
Pump Design

A novel thermal management approach is explored, which uses supercritical carbon dioxide (sCO2) as a working fluid to manage extreme heat fluxes in electronics cooling applications. In the pseudocritical region, sCO2 has extremely high volumetric thermal capacity, which can enable operation with low pumping requirements, and without the potential for two-phase critical heat flux (CHF) and flow instabilities. A model of a representative microchannel heat sink is evaluated with single-phase liquid water and FC-72, two-phase boiling R-134a, and sCO2. For a fixed pumping power, sCO2 is found to yield lower heat-sink wall temperatures than liquid coolants. Practical engineering challenges for supercritical thermal management systems are discussed, including the limits of predictive heat transfer models, narrow operating temperature ranges, high working pressures, and pump design criteria. Based on these findings, sCO2 is a promising candidate working fluid for cooling high heat flux electronics, but additional thermal transport research and engineering are needed before practical systems can be realized.

Heat Sink Performance Improvement by Way of Nanofluids

2016 ◽  
Author(s):  
J. L. Zúñiga-Cerroblanco ◽  
C. Ulises Gonzalez-Valle ◽  
Daniel Lorenzini-Gutierrez ◽  
Abel Hernandez-Guerrero ◽  
Jaime Cervantes de Gortari
Keyword(s):  
Integrated Circuit ◽  
Heat Sink ◽  
Volume Fraction ◽  
Particle Volume Fraction ◽  
Working Fluid ◽  
Field Pattern ◽  
Air Cooling ◽  
Base Temperature ◽  
Material Base ◽  
Particle Volume

The new generation of integrated-circuit chips demands novel cooling techniques for enhancing device performance. Air-cooling techniques are not sufficient anymore to reach the necessary dissipation for these devices while liquid-cooling techniques have proved to be an efficient solution. The addition of nanoparticles to conventional cooling fluid changes its thermo-physical properties based on the type of the particle material, base fluid, particle volume fraction and size, pumping power, etc. The present study proposes a flow field pattern for a nanofluid-cooled heat sink in order to improve the heat transfer and the flow distribution based on a new design. Al2O3 - water nanofluid is the working fluid. The results show the comparison between the simple conventional use of water and the use of a nanofluid, by way of implementing critical factors for performance evaluation: thermal resistance, temperature uniformity, highest base temperature, and pressure drop. The analysis enables to determine that the heat sink thermal performance is definitely improved by the use of a nanofluid.

scholarly journals Numerical Optimization of a Microchannel Geometry for Nanofluid Flow and Heat Dissipation Assessment

2021 ◽  
Vol 11 (5) ◽  
pp. 2440
Author(s):  
Inês M. Gonçalves ◽  
César Rocha ◽  
Reinaldo R. Souza ◽  
Gonçalo Coutinho ◽  
Jose E. Pereira ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Jet Impingement ◽  
Experimental Tests ◽  
Heat Sinks ◽  
Working Fluid ◽  
Optimized Design ◽  
Nanofluid Flow ◽  
Microchannel Heat Sinks

In this study, a numerical approach was carried out to analyze the effects of different geometries of microchannel heat sinks on the forced convective heat transfer in single-phase flow. The simulations were performed using the commercially available software COMSOLMultiphysics 5.6® (Burlington, MA, USA) and its results were compared with those obtained from experimental tests performed in microchannel heat sinks of polydimethylsiloxane (PDMS). Distilled water was used as the working fluid under the laminar fluid flow regime, with a maximum Reynolds number of 293. Three sets of geometries were investigated: rectangular, triangular and circular. The different configurations were characterized based on the flow orientation, type of collector and number of parallel channels. The main results show that the rectangular shaped collector was the one that led to a greater uniformity in the distribution of the heat transfer in the microchannels. Similar results were also obtained for the circular shape. For the triangular geometry, however, a disturbance in the jet impingement was observed, leading to the least uniformity. The increase in the number of channels also enhanced the uniformity of the flow distribution and, consequently, improved the heat transfer performance, which must be considered to optimize new microchannel heat sink designs. The achieved optimized design for a heat sink, with microchannels for nanofluid flow and a higher heat dissipation rate, comprised a rectangular collector with eight microchannels and vertical placement of the inlet and outlet.

scholarly journals THERMAL PERFORMANCE OF THERMOSYPHON FOR DIFFERENT WORKING FLUIDS

2016 ◽  
Vol 15 (1) ◽  
pp. 03 ◽  
Author(s):  
G. M. Russo ◽  
L. Krambeck ◽  
F. B. Nishida ◽  
P. H. D. Santos ◽  
T. Antonini Alves
Keyword(s):  
Thermal Performance ◽  
Power Dissipation ◽  
Experimental Tests ◽  
Thermal Control ◽  
Working Fluid ◽  
Vertical Position ◽  
Outer Diameter ◽  
Working Fluids ◽  
Acetone Water ◽  
Inner Diameter

In this paper, an experimental investigation was performed of the thermal performance of different working fluids in thermosyphons that can be used in thermal control of electronic equipment. The working fluids were considered acetone, water, ethanol, and methanol. The thermosyphon are manufactured of copper with an outer diameter of 9.45 mm, an inner diameter of 7.75 mm, a total length of 200 mm, whereas an evaporator of 80 mm length, an adiabatic region of 20 mm in length and a condenser of 100 mm in length. They were loaded with 1.39 ml of the working fluid, corresponding to a filling ratio of 40% of the evaporator volume. Experimental tests were performed in a vertical position considering thermal loads between 5W and 25W. The thermosyphons operated satisfactorily in all the tests. The operating temperature distribution as a function of time and the heat resistance behavior as a function of power dissipation have been presented for each analyzed working fluid. These results indicated that acetone is the working fluid that has the best thermal performance.

Modular Heat Sinks for Enhanced Thermal Management of Electronics

2020 ◽  
Author(s):  
Muhammad Jahidul Hoque ◽  
Alperen Günay ◽  
Andrew Stillwell ◽  
Yashraj Gurumukhi ◽  
Robert Pilawa-Podgurski ◽  
...  
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Power Density ◽  
Heat Sink ◽  
Power Dissipation ◽  
Heat Sinks ◽  
Thermal Interface Material ◽  
Specific Power ◽  
Electrical Potential Difference ◽  
Electrical Isolation

Abstract Power electronics are vital for the generation, conversion, transmission, and distribution of electrical energy. Improving the efficiency, power density, and reliability of power electronics is an important challenge that can be addressed with electro-thermal co-design and optimization. Current thermal management approaches utilize metallic heat sinks, resulting in parasitic load generation due to different potentials between electronic components on the printed circuit board (PCB). To enable electrical isolation, a thermal interface material (TIM) or gap pad is placed between the PCB and heat sink, resulting in poor heat transfer. Here, we develop an approach to eliminate TIMs and gap pads through modularization of metallic heat sinks. The use of smaller modular heat sinks (MHSs) strategically placed on high power dissipation areas of the PCB enables elimination of electrical potential difference, and removal of electrical isolation materials, resulting in better cooling performance due to direct contact between devices and the heat sink. By studying a gallium nitride (GaN) 2kW DC-DC power converter as a test platform for electro-thermal co-design using the modular approach, and benchmarking performance with a commercial off-the-shelf heat sink design, we showed identical power dissipation rates with a 54% reduction in heat sink volume and a 8°C reduction in maximum GaN device temperature. In addition to thermal performance improvement, the MHS design showed a 73% increase in specific power density with a 22% increase in volumetric power density.

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