MEMS Accelerometer Design Optimization Using Genetic Algorithm

2013 ◽  
Vol 705 ◽  
pp. 288-294 ◽  
Author(s):  
V.S. Krushnasamy ◽  
A. Vimala Juliet
Keyword(s):  
Genetic Algorithm ◽  
Design Optimization ◽  
High Efficiency ◽  
Microelectromechanical Systems ◽  
Optimal Parameter ◽  
Low Cost ◽  
Complex Nature ◽  
Mems Accelerometer ◽  
Mems Technology ◽  
Parameter Values

MEMS (Microelectromechanical Systems) refers to the technology integrating electrical and mechanical components with feature size of 1~1000 microns. Due to its small size, low cost, low power consumption and high efficiency, MEMS technology has been widely used in many fields.In this paper,the design optimization of MEMS accelerometer is discussed.The main objective of this investigation is to find a optimum design of MEMS,which satisfies a set of given constraints. The accelerometer employs a double folded beam flexure system and the mass being displaced is the proof mass.Due to the complex nature of the problem,a genetic algorithm (GA) is developed for the optimization of MEMS.The GA attempts to minimize the die area and so the four optimal parameter values can be determined. MEMS accelerometers can be used in air-bag deployment systems in automobiles.The experimental results will show the optimal design of MEMS.

RF-MEMS Components and Networks for High-Performance Reconfigurable Telecommunication and Wireless Systems

2012 ◽  
Vol 81 ◽  
pp. 65-74 ◽  
Author(s):  
Jacopo Iannacci ◽  
Giuseppe Resta ◽  
Paola Farinelli ◽  
Roberto Sorrentino
Keyword(s):  
High Performance ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Low Cost ◽  
Impedance Matching ◽  
Phase Shifters ◽  
Rf Systems ◽  
Mems Technology ◽  
And Performance ◽  
Rf Performance

MEMS (MicroElectroMechanical-Systems) technology applied to the field of Radio Frequency systems (i.e. RF-MEMS) has emerged in the last 10-15 years as a valuable and viable solution to manufacture low-cost and very high-performance passive components, like variable capacitors, inductors and micro-relays, as well as complex networks, like tunable filters, reconfigurable impedance matching networks and phase shifters, and so on. The availability of such components and their integration within RF systems (e.g. radio transceivers, radars, satellites, etc.) enables boosting the characteristics and performance of telecommunication systems, addressing for instance a significant increase of their reconfigurability. The benefits resulting from the employment of RF-MEMS technology are paramount, being some of them the reduction of hardware redundancy and power consumption, along with the operability of the same RF system according to multiple standards. After framing more in detail the whole context of RF MEMS technology, this paper will provide a brief introduction on a typical RF-MEMS technology platform. Subsequently, some relevant examples of lumped RF MEMS passive elements and complex reconfigurable networks will be reported along with their measured RF performance and characteristics.

Mill Gear Box of Intelligent Diagnosis Based on Support Vector Machine Parameters Optimization

2014 ◽  
Vol 697 ◽  
pp. 239-243 ◽  
Author(s):  
Xiao Hui Liu ◽  
Yong Gang Xu ◽  
De Ying Guo ◽  
Fei Liu
Keyword(s):  
Genetic Algorithm ◽  
Support Vector Machine ◽  
Rolling Mill ◽  
Optimal Parameter ◽  
Structural Parameters ◽  
Parameters Optimization ◽  
Support Vector ◽  
Intelligent Diagnosis ◽  
Gear Box ◽  
Parameter Values

For mill gearbox fault detection problems, and puts forward combining support vector machine (SVM) and genetic algorithm, is applied to rolling mill gear box fault intelligent diagnosis methods. The choice of parameters of support vector machine (SVM) is a very important for the SVM performance evaluation factors. For the selection of structural parameters of support vector machine (SVM) with no theoretical support, select and difficult cases, in order to reduce the SVM in this respect, puts forward the genetic algorithm to optimize parameters, and the algorithm of the model is applied to rolling mill gear box in intelligent diagnosis, using the global searching property of genetic algorithm and support vector machine (SVM) of the optimal parameter values. Results showed that the suitable avoided into local solution optimization, the method to improve the diagnostic accuracy and is a very effective method of parameter optimization, and intelligent diagnosis for rolling mill gear box provides an effective method.

MEMS Based Metal Plated Silicon Package for High Power LED

2006 ◽  
Vol 326-328 ◽  
pp. 309-312 ◽  
Author(s):  
Sung Jun Lee ◽  
Ji Hyun Park ◽  
Chang Hyun Lim ◽  
Won Kyu Jeong ◽  
Seog Moon Choi ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Power Dissipation ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Low Cost ◽  
Wafer Level ◽  
High Power Led ◽  
Key Factor ◽  
Mems Technology

By the development of high power LED for solid states lighting, the requirement for driving current has increased critically, thereby increasing power dissipation. Heat flux corresponds to power dissipation is mainly generated in p-n junction of LED, so the effective removal of heat is the key factor for long lifetime of LED chip. In this study, we newly proposed the silicon package for high power LED using MEMS technology and estimated its heat dissipation characteristic. Our silicon package structure is composed of base and reflector cup. The role of base is that settle LED chip at desired position and supply electrical interconnection for LED operation, and finally transfer the heat from junction region to outside. For improved heat transfer, we introduced the heat conductive metal plated trench structure at the opposite side of LED attached side. The depth and the diameter of trench were 150 and 100um, respectively. Copper with high thermal conductivity than silicon was filled in trench by electroplating and the thickness of copper was about 100um. Reflector cup was formed by anisotropic wet etching and then, silicon package platform could be fabricated by eutectic bonding between base and reflector cup. The thermal resistance of silicon package was about 6 to 7K/W from junction to case, and also, thermal resistance reduction of 0.64K/W was done by metal plated trench. This result could be comparable to that of other high power LED package. Our silicon package platform is easy to be expanded into array and wafer level package. So, it is suitable for future high efficiency and low cost package.

scholarly journals Design of freeform geometries in a MEMS accelerometer with a mechanical motion preamplifier based on a genetic algorithm

2020 ◽  
Vol 6 (1) ◽  
Author(s):  
Chen Wang ◽  
Xiaoxiao Song ◽  
Weidong Fang ◽  
Fang Chen ◽  
Ioannis Zeimpekis ◽  
...  
Keyword(s):  
Genetic Algorithm ◽  
Degrees Of Freedom ◽  
Microelectromechanical Systems ◽  
Computation Time ◽  
High Sensitivity ◽  
Mems Devices ◽  
Mechanical Motion ◽  
Parameter Mismatch ◽  
Mems Accelerometer ◽  
Large Bandwidth

AbstractThis paper describes a novel, semiautomated design methodology based on a genetic algorithm (GA) using freeform geometries for microelectromechanical systems (MEMS) devices. The proposed method can design MEMS devices comprising freeform geometries and optimize such MEMS devices to provide high sensitivity, large bandwidth, and large fabrication tolerances. The proposed method does not require much computation time or memory. The use of freeform geometries allows more degrees of freedom in the design process, improving the diversity and performance of MEMS devices. A MEMS accelerometer comprising a mechanical motion amplifier is presented to demonstrate the effectiveness of the design approach. Experimental results show an improvement in the product of sensitivity and bandwidth by 100% and a sensitivity improvement by 141% compared to the case of a device designed with conventional orthogonal shapes. Furthermore, excellent immunities to fabrication tolerance and parameter mismatch are achieved.

scholarly journals High-Efficiency Wavelet Compressive Fusion for Improving MEMS Array Performance

Sensors ◽  
2020 ◽  
Vol 20 (6) ◽  
pp. 1662 ◽  
Author(s):  
Siyuan Liang ◽  
Weilong Zhu ◽  
Feng Zhao ◽  
Congyi Wang
Keyword(s):  
Real Time ◽  
High Efficiency ◽  
Microelectromechanical Systems ◽  
Inertial Sensor ◽  
Low Cost ◽  
Rapid Development ◽  
Experimental Results ◽  
Zero Bias ◽  
Real Time Processing ◽  
Application Range

With the rapid development of microelectromechanical systems (MEMS) technology, low-cost MEMS inertial devices have been widely used for inertial navigation. However, their application range is greatly limited in some fields with high precision requirements because of their low precision and high noise. In this paper, to improve the performance of MEMS inertial devices, we propose a highly efficient optimal estimation algorithm for MEMS arrays based on wavelet compressive fusion (WCF). First, the algorithm uses the compression property of the multiscale wavelet transform to compress the original signal, fusing the compressive data based on the support. Second, threshold processing is performed on the fused wavelet coefficients. The simulation result demonstrates that the proposed algorithm performs well on the output of the inertial sensor array. Then, a ten-gyro array system is designed for collecting practical data, and the frequency of the embedded processor in our verification environment is 800 MHz. The experimental results show that, under the normal working conditions of the MEMS array system, the 100 ms input array data require an approximately 75 ms processing delay when employing the WCF algorithm to support real-time processing. Additionally, the zero-bias instability, angle random walk, and rate slope of the gyroscope are improved by 8.0, 8.0, and 9.5 dB, respectively, as compared with the original device. The experimental results demonstrate that the WCF algorithm has outstanding real-time performance and can effectively improve the accuracy of low-cost MEMS inertial devices.

MEMS Accelerometer Mini-Array (MAMA): A Low-Cost Implementation for Earthquake Early Warning Enhancement

2019 ◽  
Vol 35 (1) ◽  
pp. 21-38 ◽  
Author(s):  
Ran N. Nof ◽  
Angela I. Chung ◽  
Horst Rademacher ◽  
Lori Dengler ◽  
Richard M. Allen
Keyword(s):  
Early Warning ◽  
Microelectromechanical Systems ◽  
Low Cost ◽  
Early Warning Systems ◽  
Earthquake Early Warning ◽  
Mems Accelerometer ◽  
Minimum Number ◽  
Back Azimuth ◽  
Time Required ◽  
Prohibitive Cost

Earthquake Early Warning Systems (EEWS) are often challenged when the earthquakes occur outside the seismic network or where the station density is sparse. In these situations, poor locations and large alert delays are more common because of the limited azimuthal coverage and the time required for the wavefield to reach the minimum number of seismic stations to issue an alert. Seismic arrays can be used to derive the directivity of the wavefield and obtain better location. However, they are uncommon because of the prohibitive cost of the sensors. Here, we propose the development of an array-based approach using mini-arrays of low-cost Microelectromechanical Systems (MEMS) accelerometers and show how they can be used to improve EEWS. In this paper, we demonstrate this approach using data from two MEMS Accelerometer Mini-Arrays (MAMA) deployed at University of California Berkeley and Humboldt State University. We use a new low-cost ( <U.S. $150) Data Acquisition Unit and solve for the back azimuth of seven events with magnitudes ranging from Mw 2.7 to 5.1 at distances of 5 km to 106 km.

scholarly journals A novel bottom-left packing genetic algorithm for analog module placement

2003 ◽  
Vol 1 ◽  
pp. 191-196 ◽  
Author(s):  
L. Zhang ◽  
U. Kleine
Keyword(s):  
Genetic Algorithm ◽  
Integrated Circuits ◽  
Cost Function ◽  
Bin Packing ◽  
Optimal Parameter ◽  
Packing Problem ◽  
Fractional Factorial ◽  
Genetic Encoding ◽  
The Cost ◽  
Parameter Values

Abstract. This paper presents a novel genetic algorithm for analog module placement. It is based on a generalization of the two-dimensional bin packing problem. The genetic encoding and operators assures that all constraints of the problem are always satisfied. Thus the potential problems of adding penalty terms to the cost function are eliminated, so that the search configuration space decreases drastically. The dedicated cost function covers the special requirements of analog integrated circuits. A fractional factorial experiment was conducted using an orthogonal array to study the algorithm parameters. A meta-GA was applied to determine the optimal parameter values. The algorithm has been tested with several local benchmark circuits. The experimental results show this promising algorithm makes the better performance than simulated annealing approach with the satisfactory results comparable to manual placement.

scholarly journals Parameter Optimization of Vibrating and Comb-Brushing Harvesting of Lycium barbarum L. Based on FEM and RSM

Horticulturae ◽  
2021 ◽  
Vol 7 (9) ◽  
pp. 286
Author(s):  
Jian Zhao ◽  
Te Ma ◽  
Tetsuya Inagaki ◽  
Yun Chen ◽  
Guangrui Hu ◽  
...  
Keyword(s):  
Field Experiments ◽  
High Efficiency ◽  
Optimal Parameter ◽  
Ripe Fruit ◽  
Lycium Barbarum ◽  
Unripe Fruit ◽  
Rotating Speed ◽  
Damage Rate ◽  
Materials Used ◽  
Parameter Values

The current mechanical harvesting methods of Lycium barbarum L. are labor intensive and cause too much damage, but vibrating and comb-brushing harvesting can increase the efficiency while minimizing the damage. However, optimizing the main factors and their parameter values of vibrating and comb-brushing harvesting is challenging. To achieve the high-efficiency and low-damage harvesting of L. barbarum, firstly, the mechanical models of the materials used in the experiments were established based on the physical tests. Then, the vibrating and comb-brushing harvesting simulations were conducted based on FEM to acquire the ranges of the parameter values. The effects of the rotating speed, material, and amplitude on the harvesting rate of ripe fruit and harvesting rate of unripe fruit, as well as the damage rate of ripe fruit were determined based on RSM. Finally, the optimized parameters were obtained and verified using the field experiments. The field experiments showed that the harvesting rate of ripe fruit was 85.8%, the harvesting rate of unripe fruit was 10.5%, and the damage rate of ripe fruit was 9.7%. The findings provided the optimal parameter values, which were a design basis for the vibrating and comb-brushing harvesters of L. barbarum.

scholarly journals Analisis Sistem Pengukuran Getaran Mems Accelerometer ADXL345

2019 ◽  
Vol 9 (02) ◽  
pp. 63-67
Author(s):  
Indra Feriadi ◽  
Fajar Aswin ◽  
M Iqbal Nugraha
Keyword(s):  
Measurement System ◽  
Low Cost ◽  
Measurement Data ◽  
Micro Electro Mechanical System ◽  
Vibration Measurement ◽  
Measurement Technology ◽  
Mems Accelerometer ◽  
Analysis Technique ◽  
Develop Approach ◽  
Mems Technology

Vibration measurement technology using conventional sensors such as piezoelectric (PZT) Accelerometer is still expensive. Currently, many low-cost vibration measuring devices have been developed by using Micro Electro Mechanical System (MEMS) technology. This study aims to analyze the results of vibration measurement system MEMS Accelerometer ADXL345 with PZT Accelerometer. This research applies design and develop approach with comparative data analysis technique, that is comparing data of result of measurement of MEMS Accelerometer ADXL345 to PZT Accelerometer Vibroport80. The construction comprises the ADXL345 sensor connected to the Arduino Mega 2560 microcontroller operated by Widows operating system and programming language Arduino IDE 1.08. Testing of measurements at Bearing speeds of 500, 1000, and 1500 RPM with length of time measurements at 5, 10, and 20 seconds respectively. The analysis of the test results shows that the MEMS Accelerometer ADXL345 of vibration measurement system can measure, process and display vibration measurement data larger 3% than PZT Accelerometer and can provide the best measurement accuracy at 20 seconds measurement length of time.

scholarly journals Review of Recent Development of MEMS Speakers

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1257
Author(s):  
Haoran Wang ◽  
Yifei Ma ◽  
Qincheng Zheng ◽  
Ke Cao ◽  
Yao Lu ◽  
...  
Keyword(s):  
Microelectromechanical Systems ◽  
Low Cost ◽  
Portable Electronics ◽  
Hearing Instruments ◽  
Potential Applications ◽  
Transduction Mechanisms ◽  
Mems Technology ◽  
Small Footprint ◽  
The Internet Of Things ◽  
Made In

Facilitated by microelectromechanical systems (MEMS) technology, MEMS speakers or microspeakers have been rapidly developed during the past decade to meet the requirements of the flourishing audio market. With advantages of a small footprint, low cost, and easy assembly, MEMS speakers are drawing extensive attention for potential applications in hearing instruments, portable electronics, and the Internet of Things (IoT). MEMS speakers based on different transduction mechanisms, including piezoelectric, electrodynamic, electrostatic, and thermoacoustic actuation, have been developed and significant progresses have been made in commercialization in the last few years. In this article, the principle and modeling of each MEMS speaker type is briefly introduced first. Then, the development of MEMS speakers is reviewed with key specifications of state-of-the-art MEMS speakers summarized. The advantages and challenges of all four types of MEMS speakers are compared and discussed. New approaches to improve sound pressure levels (SPLs) of MEMS speakers are also proposed. Finally, the remaining challenges and outlook of MEMS speakers are given.

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