Measurement of the Tangential Grinding Force Using the Slip of an Induction Motor—Construction of the Measurement System

2009 ◽  
Vol 76-78 ◽  
pp. 107-112
Author(s):  
Kazuki Kondo ◽  
Shin-Ichi Tooe
Keyword(s):  
Induction Motor ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Present System ◽  
Rotational Period ◽  
Grinding Forces ◽  
Rotary Encoder ◽  
Labview Software ◽  
Development Tools ◽  
New System

A new system for measuring a tangential grinding force using the slip of the rotational speed of an induction motor was developed. The motor slip is measured as the change in the rotational period for the induction motor. The system operates LabVIEW software on a personal computer, and a rotary encoder is connected with the motor spindle, which drives the axis of a grinding wheel. A signal of one pulse per rotation from the rotary encoder is input to the interface of the computer to measure the rotational period. LabVIEW has the flexibility of a programming language and operates within a graphic environment in compiling the signal, analyzing measurements, and displaying analysis results. Thus, the present system is simpler than previous development tools. This work conducts a grinding experiment using the developed system to verify the sensitivity and response in measuring the motor slip. As an example of application, semidry grinding is investigated by measuring tangential grinding forces. Hence, we demonstrate the effectiveness of the developed system for data processing in the analysis of grinding phenomena.

scholarly journals Experimental Study on Grinding Force of Zirconia Ceramics in Dry/Wet Grinding Environment

2018 ◽  
Vol 198 ◽  
pp. 02004
Author(s):  
Junping Zhang ◽  
Weidong Wang ◽  
Songhua Li ◽  
Han Tao
Keyword(s):  
Grinding Force ◽  
Grinding Wheel ◽  
Feed Speed ◽  
Zirconia Ceramics ◽  
Grinding Forces ◽  
Measuring Device ◽  
Linear Speed ◽  
Wet Grinding ◽  
Dry Grinding ◽  
Force Ratio

The impacts of different linear speed of grinding wheel, grinding depth and workpiece feed speed with or without grinding fluid on grinding force were studied by plane grinding machining of zirconia ceramics. The impacts of different machining environment and grinding parameter on normal and tangential grinding forceswere studied by testing the grinding force during grinding with a force measuring device. The studies showed that the normal and tangential grinding forces decrease with the increase of the linear speed of grinding wheel and increase with the improvement of grinding depth and workpiece feed speed. The grinding depth has the greatest impacts on the normal and tangential grinding forces in dry grinding environment; while in wet grinding environment, the grinding depth exerts the greatest impacts on the normal grinding force and the linear speed of grinding wheel imposes the greatest impacts on the tangential grinding force. In addition, it was found that the normal grinding force in dry grinding is minor than that in wet grinding, that the tangential grinding force in dry grinding is greater than that in wet grinding, and that the grinding force ratio in dry grinding is lower than that in wet grinding.

Development of Three-Dimensional Dynamometer for Wafer Grinder

2010 ◽  
Vol 126-128 ◽  
pp. 361-366 ◽  
Author(s):  
Xiang Long Zhu ◽  
Ren Ke Kang ◽  
Yong Qing Wang ◽  
Dong Ming Guo
Keyword(s):  
Three Dimensional ◽  
High Sensitivity ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Performance Parameters ◽  
Grinding Forces ◽  
Grinding Method ◽  
Static Performance ◽  
Good Repeatability

Grinding forces during grinding silicon wafer have great influences on the accuracy, surface quality and grinding yield of the wafer. It is necessary to develop an accurate and reliable grinding dynamometer for measuring and monitoring the grinding process of the large and thin wafer. In this work, a new 3D (three-dimensional) grinding dynamometer using piezoelectric sensors is designed and developed, which is used for a wafer grinder based on wafer rotating grinding method. The calibrating experiments of the 3D grinding dynamometer are carried out. The FEA and modal analysis are made and compared with the results of mode testing. Furthermore, the static performance parameters of the dynamometer are obtained from the loading experiment. The experiment results indicate that the 3D grinding dynamometer can measure axial, radial and tangential grinding force of grinding wheel with high sensitivity, good linearity, good repeatability and high natural frequency, and fully satisfied requirement for measuring and monitoring of the grinding force in wafer grinding process.

Multigrain Smoothed Particle Hydrodynamics and Hertzian Contact Modeling of the Grinding Force in Atherectomy

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Yihao Zheng ◽  
Yao Liu ◽  
Yang Liu ◽  
Albert J. Shih
Keyword(s):  
Smoothed Particle Hydrodynamics ◽  
Cutting Forces ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Hertz Contact ◽  
Grinding Forces ◽  
Calcified Plaque ◽  
Particle Hydrodynamics ◽  
Smoothed Particle ◽  
The Impact

This study investigated the grinding force in rotational atherectomy, a clinical procedure that uses a high-speed grinding wheel to remove hardened, calcified plaque inside the human arteries. The grinding force, wheel motion, and ground surface were measured based on a ring-shape bovine bone surrogate for the calcified plaque. At 135,000, 155,000, and 175,000 rpm wheel rotational speed, the grinding forces were 1.84, 1.92, and 2.22 N and the wheel orbital speeds were 6060, 6840, and 7800 rpm, respectively. The grinding wheel was observed to bounce on the wall of the bone surrogate, leaving discrete grinding marks. Based on this observation, we modeled the grinding force in two components: impact and cutting forces. The impact force between the grinding wheel and the bone surrogate was calculated by the Hertz contact model. A multigrain smoothed particle hydrodynamics (SPH) model was established to simulate the cutting force. The grinding wheel model was built according to the wheel surface topography scanned by a laser confocal microscope. The workpiece was modeled by kinematic-geometrical cutting. The simulation predicted a cutting force of 41, 51, and 99 mN at the three investigated wheel rotational speeds. The resultant grinding forces, combining the impact and cutting forces modeled by the Hertz contact and SPH simulation, matched with the experimental measurements with relative errors less than 10%.

scholarly journals Study of the Influence of Cutting Regime Parameters on Grinding Forces in Processing Tungsten Carbide Dk460uf

2014 ◽  
Vol 65 (1) ◽  
pp. 87-92
Author(s):  
Silvia Vulc
Keyword(s):  
Tungsten Carbide ◽  
Cutting Forces ◽  
Normal Component ◽  
Grinding Force ◽  
Tangential Component ◽  
Depth Of Cut ◽  
Grinding Wheel ◽  
Test Results ◽  
Tungsten Carbides ◽  
Grinding Forces

Abstract This paper presents a study on grinding tungsten carbide DK460UF, through experimental investigation using diamond grinding wheel with 54 μm grain size. Different sets of experiments were performed to study the effects of the independent grinding parameters such as grinding wheel speed, feed and depth of cut on cutting forces. Test results showed that the feed and depth of cut influence significantly the cutting forces. The research was lead to optimize the process parameters for reducing cutting forces. In this way, for different parameters of cutting regime, it were measured the values of the components of the grinding force, tangential component, Ft and normal component Fn. The results of the experiment showed that it is better to use great speeds and small feed rate and depth of cut in grinding tungsten carbides, such as DK460UF

scholarly journals Experimental Research on Material Removal Mechanism and Grinding Force of FeCoNiCrMo0.1 High Entropy Alloy (HEA)

2021 ◽  
Author(s):  
Ruchu Xu ◽  
Xuelong Wen ◽  
Yadong Gong ◽  
Xingchen Yu
Keyword(s):  
Material Removal ◽  
Grinding Force ◽  
Grinding Wheel ◽  
High Entropy Alloy ◽  
Force Model ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Grinding Forces ◽  
High Entropy ◽  
Cbn Grinding Wheel

Abstract High entropy alloy (HEA) is an advanced alloy material, which has a wide application prospect due to its excellent properties. However, the material removal mechanism and change rule of grinding force of HEA in the grinding process have seldom been studied. The main work of this paper is that the material removal mechanism of the FeCoNiCrMo0.1 HEA is obtained by analyzing grinding debris and subsurface microstructure after grinding, the theoretical grinding force model of HEAs in plane grinding process is established on the basis of the force of a single abrasive grain, and the experimental verification is performed. According to the experimental results, the influences of different grinding parameters on grinding force are discussed, the influences of different types of grinding wheels on grinding force are analyzed, and the grinding forces generated by grinding different FeCoNiCr HEAs are compared. The results indicate that the material removal mechanism of FeCoNiCrMo0.1 HEA is the plastic removal. With the increase of grinding speed and the decrease of grinding depth and feed speed, both normal and tangential grinding forces decrease. Under the same grinding parameters, the grinding force produced by electroplated CBN grinding wheel is greater, followed by resin-bonded CBN grinding wheel and vitrified CBN grinding wheel. The grinding force produced by grinding FeCoNiCrAl0.1 HEA is lower than that produced by grinding FeCoNiCrMo0.1 HEA under the same grinding conditions. The calculated value of grinding force model is consistent with the experimental value, which can scientifically reflect the variation law of HEA grinding force.

Wear of a Brazed Diamond Grinding Wheel with Diamond Grits Covered with Brazing Alloy

2009 ◽  
Vol 76-78 ◽  
pp. 125-130 ◽  
Author(s):  
Guo Qin Huang ◽  
Hei Jie Chen ◽  
Hui Huang ◽  
Xi Peng Xu
Keyword(s):  
Thin Layer ◽  
Fracture Resistance ◽  
Diamond Wheel ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Vacuum Furnace ◽  
Grinding Forces ◽  
Wear Performance ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding

The wear of a brazed diamond wheel with diamond grits covered with brazing alloy was investigated in comparison with a traditional brazed wheel whose grits were without covering. The two wheels were brazed in vacuum furnace and grits on one of them were overlaid with a thin layer of brazing alloy. The wear of the two wheels was tested through grinding of granite, during which grinding forces were measured and the wear states of diamond grits were observed. It is shown that grits covered with brazing alloy exhibited stronger self-sharpening ability and fracture resistance. Therefore, the wheel with covered diamonds performed lower grinding force and better wear performance.

Theoretical Model of Grinding Force in Quick-Point Grinding

2009 ◽  
Vol 626-627 ◽  
pp. 75-80 ◽  
Author(s):  
Jian Qiu ◽  
Ya Dong Gong ◽  
Yue Ming Liu ◽  
J. Cheng
Keyword(s):  
Material Removal ◽  
Tangential Velocity ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Equivalent Diameter ◽  
Grinding Forces ◽  
Cutting Depth ◽  
Force Ratio ◽  
Grinding Mechanism ◽  
Material Removal Mode

Separating the workpiece velocity on the plane of grinding wheel, it is helpful to analyze Quick-point grinding mechanism. There are some relations among wheel’s deflective angle, workpiece feed velocity and tangential velocity. In this research, the resultant workpiece speed, grinding contact zone and material removal mode is analyzed. And a model is established which is helpful to analyze the tendency of component grinding forces and force ratio. It is found the grinding force is influenced by the factors such as cutting depth, wheel velocity, grinding angle as well as equivalent diameter, respectively. Finally, a theoretical basis for actual processing is provided.

Grinding force modeling and experimental verification of rail grinding

2020 ◽  
Vol 234 (8) ◽  
pp. 1254-1264
Author(s):  
Hao-Hao Ding ◽  
Yong-Chao Han ◽  
Kun Zhou ◽  
Yun-Hua Huang ◽  
Lu-Bing Shi ◽  
...  
Keyword(s):  
Grinding Force ◽  
Least Square ◽  
Experimental Results ◽  
Grinding Wheel ◽  
Grinding Wheels ◽  
Grinding Forces ◽  
Grinding Processes ◽  
Force Modeling ◽  
Friction Testing ◽  
Rail Grinding

Many factors could affect the grinding force during rail grinding processes. Therefore, the grinding force modeling is necessary for predicting the grinding forces under different rail grinding parameter conditions. In this study, 3D models of grinding wheels were constructed based on the surface topographies of real grinding wheels. By means of simulation of rail grinding processes using the DEFORM-3D, the influences of grinding parameters on the grinding forces were explored. Furthermore, in order to verify the simulation results, rail grinding experiments were conducted using a rail grinding friction testing apparatus. Both simulation and experimental results showed that the grinding force increased with the grinding pressure and the granularity of grinding wheel and decreased with the rotational speed of the grinding wheel. A correction factor ks of 0.894 was obtained using the least square method to reduce the error between the simulation and experimental results from 10.22 to 4.42%.

An Experimental Study on Grinding of SiC/Al Composites

2011 ◽  
Vol 188 ◽  
pp. 90-93 ◽  
Author(s):  
Li Fu Xu ◽  
Li Zhou ◽  
Xiao Lin Yu ◽  
Shu Tao Huang
Keyword(s):  
Experimental Study ◽  
Surface Roughness ◽  
Surface Morphology ◽  
Ground Surface ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Feed Speed ◽  
Grinding Forces ◽  
Grinding Parameters ◽  
Sic Particles

In this paper, grinding experiments on the machining of SiCp/Al composites using SiC grinding wheel have been carried out. The effect of the grinding parameters on the grinding forces, surface morphology and surface roughness were evaluated. The results indicate that the grinding depth has more significant effect on the grinding force than that of feed speed, and there are many fracture or crushed SiC particles on the ground surface. Therefore, the SiC wheels can be used for rough grinding of SiCp/Al composites.

scholarly journals Study on the Effect of Grinding Pressure on Material Removal Behavior Performed on a Self-Designed Passive Grinding Simulator

2021 ◽  
Vol 11 (9) ◽  
pp. 4128
Author(s):  
Peng-Zhan Liu ◽  
Wen-Jun Zou ◽  
Jin Peng ◽  
Xu-Dong Song ◽  
Fu-Ren Xiao
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Service Life ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Grinding Efficiency

Passive grinding is a new rail grinding strategy. In this work, the influence of grinding pressure on the removal behaviors of rail material in passive grinding was investigated by using a self-designed passive grinding simulator. Meanwhile, the surface morphology of the rail and grinding wheel were observed, and the grinding force and temperature were measured during the experiment. Results show that the increase of grinding pressure leads to the rise of rail removal rate, i.e., grinding efficiency, surface roughness, residual stress, grinding force and grinding temperature. Inversely, the enhancement of grinding pressure and grinding force will reduce the grinding ratio, which indicates that service life of grinding wheel decreases. The debris presents dissimilar morphology under different grinding pressure, which reflects the distinction in grinding process. Therefore, for rail passive grinding, the appropriate grinding pressure should be selected to balance the grinding quality and the use of grinding wheel.

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