scholarly journals Study of the Influence of Cutting Regime Parameters on Grinding Forces in Processing Tungsten Carbide Dk460uf

2014 ◽  
Vol 65 (1) ◽  
pp. 87-92
Author(s):  
Silvia Vulc

Abstract This paper presents a study on grinding tungsten carbide DK460UF, through experimental investigation using diamond grinding wheel with 54 μm grain size. Different sets of experiments were performed to study the effects of the independent grinding parameters such as grinding wheel speed, feed and depth of cut on cutting forces. Test results showed that the feed and depth of cut influence significantly the cutting forces. The research was lead to optimize the process parameters for reducing cutting forces. In this way, for different parameters of cutting regime, it were measured the values of the components of the grinding force, tangential component, Ft and normal component Fn. The results of the experiment showed that it is better to use great speeds and small feed rate and depth of cut in grinding tungsten carbides, such as DK460UF

2020 ◽  
Vol 2020 ◽  
pp. 1-12
Author(s):  
Amon Gasagara ◽  
Wuyin Jin ◽  
Angelique Uwimbabazi

This article presents a new model of the flat surface grinding process vibration conditions. The study establishes a particular analysis and comparison between the influence of the normal and tangential components of grinding forces on the vibration conditions of the process. The bifurcation diagrams are used to examine the process vibration conditions for the depth of cut and the cutting speed as the bifurcation parameters. The workpiece is considered to be rigid and the grinding wheel is modeled as a nonlinear two-degrees-of-freedom mass-spring-damper oscillator. To verify the model, experiments are carried out to analyze in the frequency domain the normal and tangential dynamic grinding forces. The results of the process model simulation show that the vibration condition is more affected by the normal component than the tangential component of the grinding forces. The results of the tested experimental conditions indicate that the cutting speed of 30 m/s can permit grinding at the depth of cut up to 0.02 mm without sacrificing the process of vibration behavior.


Author(s):  
Yihao Zheng ◽  
Yao Liu ◽  
Yang Liu ◽  
Albert J. Shih

This study investigated the grinding force in rotational atherectomy, a clinical procedure that uses a high-speed grinding wheel to remove hardened, calcified plaque inside the human arteries. The grinding force, wheel motion, and ground surface were measured based on a ring-shape bovine bone surrogate for the calcified plaque. At 135,000, 155,000, and 175,000 rpm wheel rotational speed, the grinding forces were 1.84, 1.92, and 2.22 N and the wheel orbital speeds were 6060, 6840, and 7800 rpm, respectively. The grinding wheel was observed to bounce on the wall of the bone surrogate, leaving discrete grinding marks. Based on this observation, we modeled the grinding force in two components: impact and cutting forces. The impact force between the grinding wheel and the bone surrogate was calculated by the Hertz contact model. A multigrain smoothed particle hydrodynamics (SPH) model was established to simulate the cutting force. The grinding wheel model was built according to the wheel surface topography scanned by a laser confocal microscope. The workpiece was modeled by kinematic-geometrical cutting. The simulation predicted a cutting force of 41, 51, and 99 mN at the three investigated wheel rotational speeds. The resultant grinding forces, combining the impact and cutting forces modeled by the Hertz contact and SPH simulation, matched with the experimental measurements with relative errors less than 10%.


2018 ◽  
Vol 198 ◽  
pp. 02004
Author(s):  
Junping Zhang ◽  
Weidong Wang ◽  
Songhua Li ◽  
Han Tao

The impacts of different linear speed of grinding wheel, grinding depth and workpiece feed speed with or without grinding fluid on grinding force were studied by plane grinding machining of zirconia ceramics. The impacts of different machining environment and grinding parameter on normal and tangential grinding forceswere studied by testing the grinding force during grinding with a force measuring device. The studies showed that the normal and tangential grinding forces decrease with the increase of the linear speed of grinding wheel and increase with the improvement of grinding depth and workpiece feed speed. The grinding depth has the greatest impacts on the normal and tangential grinding forces in dry grinding environment; while in wet grinding environment, the grinding depth exerts the greatest impacts on the normal grinding force and the linear speed of grinding wheel imposes the greatest impacts on the tangential grinding force. In addition, it was found that the normal grinding force in dry grinding is minor than that in wet grinding, that the tangential grinding force in dry grinding is greater than that in wet grinding, and that the grinding force ratio in dry grinding is lower than that in wet grinding.


2010 ◽  
Vol 126-128 ◽  
pp. 361-366 ◽  
Author(s):  
Xiang Long Zhu ◽  
Ren Ke Kang ◽  
Yong Qing Wang ◽  
Dong Ming Guo

Grinding forces during grinding silicon wafer have great influences on the accuracy, surface quality and grinding yield of the wafer. It is necessary to develop an accurate and reliable grinding dynamometer for measuring and monitoring the grinding process of the large and thin wafer. In this work, a new 3D (three-dimensional) grinding dynamometer using piezoelectric sensors is designed and developed, which is used for a wafer grinder based on wafer rotating grinding method. The calibrating experiments of the 3D grinding dynamometer are carried out. The FEA and modal analysis are made and compared with the results of mode testing. Furthermore, the static performance parameters of the dynamometer are obtained from the loading experiment. The experiment results indicate that the 3D grinding dynamometer can measure axial, radial and tangential grinding force of grinding wheel with high sensitivity, good linearity, good repeatability and high natural frequency, and fully satisfied requirement for measuring and monitoring of the grinding force in wafer grinding process.


1988 ◽  
Vol 110 (1) ◽  
pp. 25-31 ◽  
Author(s):  
K. Brach ◽  
D. M. Pai ◽  
E. Ratterman ◽  
M. C. Shaw

Grinding forces and energy play an important role in all abrasive machining operations. While specific grinding energy may be obtained from workpiece dynamometer values or by measuring spindle power, care must be exercised in converting dynamometer reading into power consumed. This is particularly true for operations involving a large ratio of wheel depth of cut to wheel diameter or when the radial force on the wheel is large relative to the tangential component. Interpretation of workpiece dynamometer results are discussed and several specific examples are considered including the diamond sawing of granite and the creep feed grinding of metal.


2008 ◽  
Vol 375-376 ◽  
pp. 258-262 ◽  
Author(s):  
Guo Fu Gao ◽  
Bo Zhao ◽  
Dao Hui Xiang ◽  
Qing Hua Kong

Nano-ceramics possessed ascendant mechanical property and physical characteristics contrast with traditional engineering ceramics, and its machining with ultrasonic assistance has been considered one of the most efficient methods. In the present paper a novel ultrasonic grinding vibration device has been developed and the theoretical model of grinding force has been created for ultrasonic vibration grinding. The influences of grinding parameters on grinding forces were tested with self-designd acoustic system based on local resonance. According to the test data, the effect of depth of cut and wheel velocity on the grinding force with/without ultrasonic assistance was analyzed. Both in common and ultrasonic grinding the normal grinding force and tangential grinding force descend against the wheel velocity, while ascend along with the depth of cut. In any case the grinding force in ultrasonic grinding was not more that that in common grinding.


2013 ◽  
Vol 457-458 ◽  
pp. 172-176
Author(s):  
Zong Fu Guo ◽  
Xiao Min Sheng ◽  
Gui Zhi Xie ◽  
De Zhen Yin ◽  
Wen Xin Li

This paper via investigate the process of 9SiCr alloy steel in high efficiency deep grinding to find the rule between grinding wheel speed vs depth of cut ap and speed of table vw with the grinding force and the surface quality. Intend to develop a suitable method of the grinding process of 9SiCr alloy steel in high efficiency deep grinding, to obtain high removal rate and good surface quality.


Author(s):  
Nguyen Hong Son ◽  
Do Duc Trung

In this paper, the analysis on the effects of cutting parameters on surface roughness of workpieces in surface grinding has been conducted. Experimental SUJ2 steel grinding process is made with CBN grinding wheel. The tests is made on an APSG-820/2A surface grinder. The Box- Behnken method has been used to design experiments. Minitab 16 statistical software has been used to analyze ANOVA test results. The results show that the feed-rate has the greatest effect on surface roughness, followed by the least effects of velocity of workpiece, depth of cut on surface roughness. The interaction between velocity of workpiece and depth of cut has the greatest effect on surface roughness, followed by the effects of the interaction between the feed-rate and depth of cut, the interaction between velocity of workpiece and the feed-rate has insignificant effects on surface roughness. This study also shows the value range of some cutting parameters for processing surface of workpiece with small roughness. Finally, a regression model of surface roughness has been established in this study.


2021 ◽  
Vol 11 (9) ◽  
pp. 3888
Author(s):  
Renke Kang ◽  
Jinting Liu ◽  
Zhigang Dong ◽  
Feifei Zheng ◽  
Yan Bao ◽  
...  

Cutting force is one of the most important factors in the ultrasonically assisted grinding (UAG) of hard and brittle materials. Many theoretical and experimental studies show that UAG can effectively reduce cutting forces. The existing models for UAG mostly assume an ideal grinding wheel with abrasives in both the end and lateral faces to accomplish material removal, whereas the important role of the transition fillet surface is ignored. In this study, a theoretical cutting force model is presented to predict cutting forces with the consideration of the diamond abrasives in the end face, the lateral face, and the transition fillet surface of the grinding tool. This study analyzed and calculated the vibration amplitudes and the cutting forces in both the normal and tangential directions. It discusses the influences of the input parameters (rotation speed, feed rate, amplitude, depth and radius of transition fillet) on cutting forces. The study demonstrates that the fillet radius is an important factor affecting the grinding force. With an increase in fillet radius from 0.2 to 1.2 mm, the grinding force increases by 139.6% in the axial direction and decreases by 70% in the feed direction. The error of the proposed cutting force model is 10.3%, and the experimental results verify the correctness of the force model.


2009 ◽  
Vol 76-78 ◽  
pp. 107-112
Author(s):  
Kazuki Kondo ◽  
Shin-Ichi Tooe

A new system for measuring a tangential grinding force using the slip of the rotational speed of an induction motor was developed. The motor slip is measured as the change in the rotational period for the induction motor. The system operates LabVIEW software on a personal computer, and a rotary encoder is connected with the motor spindle, which drives the axis of a grinding wheel. A signal of one pulse per rotation from the rotary encoder is input to the interface of the computer to measure the rotational period. LabVIEW has the flexibility of a programming language and operates within a graphic environment in compiling the signal, analyzing measurements, and displaying analysis results. Thus, the present system is simpler than previous development tools. This work conducts a grinding experiment using the developed system to verify the sensitivity and response in measuring the motor slip. As an example of application, semidry grinding is investigated by measuring tangential grinding forces. Hence, we demonstrate the effectiveness of the developed system for data processing in the analysis of grinding phenomena.


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