300mm Large Scale eWLB(embedded Wafer Level BGA) : Cost Effective Solution with Performance

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001046-001070
Author(s):  
Seung Wook Yoon ◽  
Yaojian Lin ◽  
Pandi C. Marimuthu ◽  
Yeong J. Lee
Keyword(s):  
Large Scale ◽  
Low Cost ◽  
Cost Effective ◽  
Batch Process ◽  
Dielectric Materials ◽  
Design Parameters ◽  
Wafer Level ◽  
Molding Compound ◽  
Package Size ◽  
Chip Size

Demand for Wafer Level Package (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. The increasing demand for new and more advanced electronic products with smaller form factor, superior functionality and performance is driving the integration of functionality into the third dimension. There are some restrictions in possible applications for fan-in WLPs since global chip trends tend toward smaller chip areas with an increasing number of interconnects. The shrinkage of the pitches and pads at the chip to package interface is happening much faster than the shrinkage at the package to board interface. This interconnection gap requires fan-out packaging, where the package size is larger than the chip size in order to provide a sufficient area to accommodate the 2nd level interconnects. eWLB is a type of fan-out WLP that has the potential to realize any number of interconnects with standard pitches at any shrink stage of the wafer node technology. 200mm eWLB is in HVM from industry last three years and there was need to move 300mm for scaling-up and low-cost solutions. This paper will highlight some of the recent advancements in large scale 300mm eWLB development. Compared to 200mm case, 300mm has more warpage and process issues due to its area increase. Thermo-mechanical simulation shows 100~150% more warpage with 300mm compared to 200mm. So various design parameters were studied to optimized warpage, such as dielectric materials and thickness, molding compound thickness etc. This paper presents study of process optimization for 300mm eWLB and mechanical characterization, reliability data including component/board level, challenges encountered and overcome, and future steps of scalability for higher throughput and manufacturability.

SiP(System in Package) Solutions with Wafer Level Packaging Technology

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 002226-002253 ◽  
Author(s):  
In Soo Kang ◽  
Jong Heon (Jay) Kim
Keyword(s):  
Embedded System ◽  
High Performance ◽  
Low Cost ◽  
Wafer Level ◽  
Molding Compound ◽  
Wafer Level Packaging ◽  
Ic Packaging ◽  
Chip Size ◽  
Bonding Technology ◽  
Small Form Factor

In mobile application, the WLP technology has been developing to make whole package size almost same as chip size. However, the I/O per chip unit area has increased so that it gets difficult to realize ideal pad pitch for better reliability. Recently, to achieve the thin and small size, high performance and low cost semiconductor package, Embedding Die and Fanout Technologies have been suggested and developed based on wafer level processing. In this work, as a solution of system in package, wafer level embedded package and fanout technology will be reviewed. Firstly, Wafer level embedded System in Package (WL-eSiP) which has daughter chip (small chip) embedded inside mother chip (bigger chip) without any special substrate has been suggested and developed. To realize wafer level embedded system in package (WL-eSiP), wafer level based new processes like wafer level molding for underfilling and encapsulation by molding compound without any special substrate have been applied and developed, including high aspect ratio Cu bumping, mold thinning and chip-to-wafer flipchip bonding. Secondly, Fan-out Package is considered as alternative package structure which means merged package structure of WLCSP (wafer level chip size package) and PCB process. We can make IC packaging widen area for SIP(System in Package) or 3D package. In addition, TSV and IPD are key enabling technology to meet market demands because TSV interconnection can provide wider bandwidth and high transmission speed due to vertical one compared to wire bonding technology and IPD can provide higher performance, more area saving to be assembled and small form factor compared to discrete passive components.

Development of All-Plastic Microvalve Array for Multiplexed Immunoassay

2014 ◽  
Author(s):  
Shancy Augustine ◽  
Pan Gu ◽  
Xiangjun Zheng ◽  
Toshikazu Nishida ◽  
Z. Hugh Fan
Keyword(s):  
Large Scale ◽  
Low Cost ◽  
Simultaneous Detection ◽  
Cost Effective ◽  
Negative Control ◽  
Sensitive Material ◽  
Detection Scheme ◽  
Power Battery ◽  
Multiple Analytes ◽  
Multiplexed Immunoassay

There is a need for low-cost immunoassays that measure the presence and concentration of multiple harmful agents in one device. Currently, comparable immunoassays employ a one-analyte-per-test format that is time consuming and not cost effective for the requirement of detecting multiple analytes in a single sample. For instance, if a spectrum of harmful agents, including E. coli O157, cholera toxin, and Salmonella typhimurium, should be simultaneously monitored in foods and drinking water, then a one-analyte-per-test would be inefficient. This work demonstrates a platform capable of simultaneous detection of multiple analytes in a single, low-cost, microvalve array-enabled multiplexed immunoassay. This multiplexed immunoassay platform is demonstrated in a prototype COC (cyclic olefin copolymer) device with a 2×3 array in which 6 analytes can be detected simultaneously. In order to contain and regulate the flow of reagents in the multichannel device, an array of microfluidic valves actuated by a thermally expandable material and microfabricated resistors have been developed to direct the flow to the necessary assay sites. The microvalve-based immunoassay is shown to be reliable, easy to operate, and compatible with large-scale integration. The all-plastic microvalves use paraffin wax as the thermally sensitive material which drastically reduces power consumption by latching upon closing so that pulsed power is required only to close and latch the microvalve until it is necessary to re-open the valve. The multiplexed detection scheme has been demonstrated by using three proteins, C reactive protein (CRP) and transferrin, both of which are biomarkers associated with traumatic brain injury (TBI) as well as bovine serum albumin (BSA) as the negative control. Since there are no external bulky pneumatic accessories required to operate/latch the microvalves in the device, this compact, thermally actuated and latching microvalve-enabled multiplexed immunoassay has the potential to realize a portable, low power, battery operated microfluidic device for biological assays.

Performance of rapid diagnostic tests for HCV infection in serum or plasma

2021 ◽  
Author(s):  
Stéphane Chevaliez ◽  
Françoise Roudot-Thoraval ◽  
Christophe Hézode ◽  
Jean-Michel Pawlotsky ◽  
Richard Njouom
Keyword(s):  
Hepatitis C ◽  
Diagnostic Tests ◽  
Large Scale ◽  
Low Cost ◽  
Antibody Test ◽  
Cost Effective ◽  
Rapid Diagnostic Tests ◽  
Treatment Programs ◽  
Clinical Sensitivity ◽  
Cost Treatment

Aim: HCV diagnosis will become the bottleneck in eliminating hepatitis C. Simple, accurate and cost-effective testing strategies are urgently needed to improve hepatitis C screening and diagnosis. Materials & methods: Performance of seven rapid diagnostic tests (RDT) have been assessed in a large series (n = 498) of serum or plasma specimens collected in France and in Cameroon. Results: Specificity varied from 96.1 to 100%. The clinical sensitivity, compared with immunoassays as the reference, was high for all seven RDT (97.2–100%). The Multisure HCV antibody assay and OraQuick HCV rapid antibody test reached sensitivity ≥99%. Conclusion: A number of RDT may be suitable for WHO prequalification and may be implemented in the framework of large-scale low-cost treatment programs to achieve the WHO viral hepatitis objectives by 2030.

Through Silicon Via Technology: Cost effective Cu-TSV Interconnects by EMC3D and Technical Challenges with Cu-TSV

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000425-000445
Author(s):  
Paul Siblerud ◽  
Rozalia Beica ◽  
Bioh Kim ◽  
Erik Young
Keyword(s):  
Low Cost ◽  
Cost Effective ◽  
High Yield ◽  
Integrated Process ◽  
Wafer Level ◽  
Through Silicon Via ◽  
Wafer Level Packaging ◽  
Current State ◽  
Future Technologies ◽  
Ic Technology

The development of IC technology is driven by the need to increase performance and functionality while reducing size, power and cost. The continuous pressure to meet those requirements has created innovative, small, cost-effective 3-D packaging technologies. 3-D packaging can offer significant advantages in performance, functionality and form factor for future technologies. Breakthrough in wafer level packaging using through silicon via technology has proven to be technologically beneficial. Integration of several key and challenging process steps with a high yield and low cost is key to the general adoption of the technology. This paper will outline the breakthroughs in cost associated with an iTSV or Via-Mid structure in a integrated process flow. Key process technologies enabling 3-D chip:Via formationInsulator, barrier and seed depositionCopper filling (plating),CMPWafer thinningDie to Wafer/chip alignment, bonding and dicing This presentation will investigate these techniques that require interdisciplinary coordination and integration that previously have not been practiced. We will review the current state of 3-D interconnects and the of a cost effective Via-first TSV integrated process.

Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid Boards

2013 ◽  
Vol 2013 (1) ◽  
pp. 000039-000044
Author(s):  
Gary Gu ◽  
Jon Chadwick ◽  
Daniel Jin
Keyword(s):  
Solder Joint ◽  
Parametric Design ◽  
Low Cost ◽  
Wafer Level ◽  
Solder Joint Reliability ◽  
Conformal Coating ◽  
Joint Reliability ◽  
Chip Size ◽  
The Right ◽  
Elastic Plastic Materials

Applications of Wafer Level Packages (WLPs) have shown tremendous growth in the rapid developing smartphones and other portable electronic devices. The technology trends lead to smaller chip size, low cost, and more integrated functions, but also face higher reliability requirements due to the reduced number of solder bumps as well as smaller bump size and height. New assembly technologies such as flexible phone board and conformal coating also brought up new thermo-mechanical reliability challenges. Based on 3D finite element modeling, the current studies focus on solder joint reliability of WLPs and compared between flex based and traditional rigid based WLP assemblies. Conformal coated and underfilled WLPs as well as some bump parameters are also studied. The parametric studies were carried out in ANSYS and all models were created by using APDL (ANSYS Parametric Design Language) scripts. Each simulation starts from stress free status set at solder reflow temperature and were subjected to thermal cyclic load between −40 and +125°C with ramp and dwell time. Creep strain was considered for solder alloys and kinematic plastic hardening was considered for other elastic-plastic materials. The solder fatigue life is estimated by using modified Coffin-Manson equation and was compared with available thermal cycling test data. The results show that underfill is still the most effective option and conformal coating can play an important role if the right material is selected. Bump parameters such as height, which have certain effects on the solder reliability on WLP-on-Rigid, have limited impact on WLP-on-Flex assembly.

Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration

2010 ◽  
Vol 2010 (1) ◽  
pp. 000548-000553
Author(s):  
Zhaozhi Li ◽  
Brian J. Lewis ◽  
Paul N. Houston ◽  
Daniel F. Baldwin ◽  
Eugene A. Stout ◽  
...  
Keyword(s):  
Flip Chip ◽  
Low Cost ◽  
Three Dimensional ◽  
Cost Effective ◽  
Market Demand ◽  
Wafer Level ◽  
Packaging Technology ◽  
Fine Pitch ◽  
3D Packaging ◽  
Assembly Technique

Three Dimensional (3D) Packaging has become an industry obsession as the market demand continues to grow toward higher packaging densities and smaller form factor. In the meanwhile, the 3D die-to-wafer (D2W) packaging structure is gaining popularity due to its high manufacturing throughput and low cost per package. In this paper, the development of the assembly process for a 3D die-to-wafer packaging technology, that leverages the wafer level assembly technique and flip chip process, is introduced. Research efforts were focused on the high-density flip chip wafer level assembly techniques, as well as the challenges, innovations and solutions associated with this type of 3D packaging technology. Processing challenges and innovations addressed include flip chip fluxing methods for very fine-pitch and small bump sizes; wafer level flip chip assembly program creation and yield improvements; and set up of the Pb-free reflow profile for the assembled wafer. 100% yield was achieved on the test vehicle wafer that has totally 1,876 flip chip dies assembled on it. This work has demonstrated that the flip chip 3D die-to-wafer packaging architecture can be processed with robust yield and high manufacturing throughput, and thus to be a cost effective, rapid time to market alternative to emerging 3D wafer level integration methodologies.

scholarly journals Fabrication of Multiscale-Structure Wafer-Level Microlens Array Mold

2019 ◽  
Vol 9 (3) ◽  
pp. 487 ◽  
Author(s):  
Shuping Xie ◽  
Xinjun Wan ◽  
Xiaoxiao Wei
Keyword(s):  
Low Cost ◽  
Form Factors ◽  
Cost Effective ◽  
Microlens Array ◽  
Practical Method ◽  
Reduced Form ◽  
Wafer Level ◽  
Polycrystalline Aluminum ◽  
Microlens Arrays ◽  
Multiscale Structure

The design and manufacture of cost-effective miniaturized optics at wafer level, usingadvanced semiconductor-like techniques, enables the production of reduced form-factor cameramodules for optical devices. However, suppressing the Fresnel reflection of wafer-level microlensesis a major challenge. Moth-eye nanostructures not only satisfy the antireflection requirementof microlens arrays, but also overcome the problem of coating fracture. This novel fabricationprocess, based on a precision wafer-level microlens array mold, is designed to meet the demandfor small form factors, high resolution, and cost effectiveness. In this study, three different kinds ofaluminum material, namely 6061-T6 aluminum alloy, high-purity polycrystalline aluminum, and purenanocrystalline aluminum were used to fabricate microlens array molds with uniform nanostructures.Of these three materials, the pure nanocrystalline aluminum microlens array mold exhibited auniform nanostructure and met the optical requirements. This study lays a solid foundation for theindustrial acceptation of novel and functional multiscale-structure wafer-level microlens arrays andprovides a practical method for the low-cost manufacture of large, high-quality wafer-level molds.

scholarly journals Effect of Protocatechuic Acid on Euglena gracilis Growth and Accumulation of Metabolites

2020 ◽  
Vol 12 (21) ◽  
pp. 9158
Author(s):  
Xiaomiao Tan ◽  
Jiangyu Zhu ◽  
Minato Wakisaka
Keyword(s):  
Euglena Gracilis ◽  
Large Scale ◽  
Protocatechuic Acid ◽  
Biomass Yield ◽  
Growth Promotion ◽  
Low Cost ◽  
Cost Effective ◽  
Control Group ◽  
Biological Functions ◽  
First Time

The development of efficient, environmentally friendly, low-cost approaches used to boost the growth of microalgae is urgently required to meet the increasing demands for food supplements, cosmetics, and biofuels. In this study, the growth promotion effects of protocatechuic acid (PCA) in the freshwater microalga Euglena gracilis were confirmed for the first time. PCA is a simple phenolic compound derived from natural plants and has a range of biological functions. The highest biomass yield, 3.1-fold higher than that of the control, used at 1.3 g·L−1, was obtained at 800 mg·L−1 of PCA. The yields of the metabolites chlorophyll a, carotenoids, and paramylon in the presence of PCA at 800 mg·L−1 were 3.1, 3.3, and 1.7 times higher than those of the control group, respectively. The highest paramylon yield was achieved at a lower dosage of PCA (100 mg·L−1), which is considered to be feasible for economic paramylon production. The growth and biosynthesis of metabolites stimulated by phytochemicals such as PCA could be an efficient and cost-effective strategy to enhance the productivity of microalgae in large-scale cultivations.

scholarly journals One year later: Highlighting the challenges and opportunities in disseminating a breathing-retraining digital behaviour change intervention

2020 ◽  
Vol 6 ◽  
pp. 205520762093644
Author(s):  
Ben Ainsworth ◽  
Anne Bruton ◽  
Mike Thomas ◽  
Lucy Yardley
Keyword(s):  
Behaviour Change ◽  
Large Scale ◽  
Digital Health ◽  
Low Cost ◽  
Controlled Trial ◽  
Cost Effective ◽  
Challenges And Opportunities ◽  
Breathing Retraining ◽  
One Year ◽  
Randomised Controlled

Digital behaviour change interventions can provide effective and cost-effective treatments for a range of health conditions. However, after rigorous evaluation, there still remain challenges to disseminating and implementing evidence-based interventions that can hinder their effectiveness ‘in the real world’. We conducted a large-scale randomised controlled trial of self-guided breathing retraining, which we then disseminated freely as a digital intervention. Here we share our experience of this process after one year, highlighting the opportunities that digital health interventions can offer alongside the challenges that must be addressed in order to harness their effectiveness. Whilst such treatments can support many individuals at extremely low cost, careful dissemination strategies should be proactively planned in order to ensure such opportunities are maximised and interventions remain up to date in a fast-moving digital landscape.

scholarly journals Evaluation of an Easy-to-Install, Low-Cost Dendrometer Band for Citizen-Science Tree Research

2019 ◽  
Vol 117 (4) ◽  
pp. 317-322
Author(s):  
Michael G Just ◽  
Steven D Frank
Keyword(s):  
Citizen Science ◽  
Urban Areas ◽  
Large Scale ◽  
Low Cost ◽  
Acer Rubrum ◽  
Cost Effective ◽  
Stem Growth ◽  
Growth Monitoring ◽  
Eastern United States ◽  
Highly Correlated

AbstractTree-stem growth is an important metric for evaluating many ecological and silvicultural research questions. However, answering these questions may require monitoring growth on many individual trees that span changing environments and geographies, which can incur significant costs. Recently, citizen science has been successfully employed as a cost-effective approach to collect data for large-scale projects that also increases scientific awareness. Still, citizen-science-led tree-growth monitoring requires the use of tools that are affordable, understandable, and accurate. Here, we compare an inexpensive, easy-to-install dendrometer band to two other bands that are more expensive with more complex installations. We installed a series of three dendrometers on 31 red maples (Acer rubrum) in two urban areas in the eastern United States. We found that the stem-growth measurements reported by these dendrometers were highly correlated and, thus, validate the utility of the inexpensive band.

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