A low-voltage low-power threshold voltage monitor for CMOS process sensing

2010 ◽  
Vol 68 (1) ◽  
pp. 51-57 ◽  
Author(s):  
Luís Henrique de Carvalho Ferreira
2017 ◽  
Vol MCSP2017 (01) ◽  
pp. 7-10 ◽  
Author(s):  
Subhashree Rath ◽  
Siba Kumar Panda

Static random access memory (SRAM) is an important component of embedded cache memory of handheld digital devices. SRAM has become major data storage device due to its large storage density and less time to access. Exponential growth of low power digital devices has raised the demand of low voltage low power SRAM. This paper presents design and implementation of 6T SRAM cell in 180 nm, 90 nm and 45 nm standard CMOS process technology. The simulation has been done in Cadence Virtuoso environment. The performance analysis of SRAM cell has been evaluated in terms of delay, power and static noise margin (SNM).


2021 ◽  
Vol 11 (2) ◽  
pp. 19
Author(s):  
Francesco Centurelli ◽  
Riccardo Della Sala ◽  
Pietro Monsurrò ◽  
Giuseppe Scotti ◽  
Alessandro Trifiletti

In this paper, we present a novel operational transconductance amplifier (OTA) topology based on a dual-path body-driven input stage that exploits a body-driven current mirror-active load and targets ultra-low-power (ULP) and ultra-low-voltage (ULV) applications, such as IoT or biomedical devices. The proposed OTA exhibits only one high-impedance node, and can therefore be compensated at the output stage, thus not requiring Miller compensation. The input stage ensures rail-to-rail input common-mode range, whereas the gate-driven output stage ensures both a high open-loop gain and an enhanced slew rate. The proposed amplifier was designed in an STMicroelectronics 130 nm CMOS process with a nominal supply voltage of only 0.3 V, and it achieved very good values for both the small-signal and large-signal Figures of Merit. Extensive PVT (process, supply voltage, and temperature) and mismatch simulations are reported to prove the robustness of the proposed amplifier.


2012 ◽  
Vol 203 ◽  
pp. 469-473
Author(s):  
Ruei Chang Chen ◽  
Shih Fong Lee

This paper presents the design and implementation of a novel pulse width modulation control class D amplifiers chip. With high-performance, low-voltage, low-power and small area, these circuits are employed in portable electronic systems, such as the low-power circuits, wireless communication and high-frequency circuit systems. This class D chip followed the chip implementation center advanced design flow, and then was fabricated using Taiwan Semiconductor Manufacture Company 0.35-μm 2P4M mixed-signal CMOS process. The chip supply voltage is 3.3 V which can operate at a maximum frequency of 100 MHz. The total power consumption is 2.8307 mW, and the chip area size is 1.1497×1.1497 mm2. Finally, the class D chip was tested and the experimental results are discussed. From the excellent performance of the chip verified that it can be applied to audio amplifiers, low-power circuits, etc.


2021 ◽  
Vol 3 (4) ◽  
Author(s):  
S. Chrisben Gladson ◽  
Adith Hari Narayana ◽  
V. Thenmozhi ◽  
M. Bhaskar

AbstractDue to the increased processing data rates, which is required in applications such as fifth-generation (5G) wireless networks, the battery power will discharge rapidly. Hence, there is a need for the design of novel circuit topologies to cater the demand of ultra-low voltage and low power operation. In this paper, a low-noise amplifier (LNA) operating at ultra-low voltage is proposed to address the demands of battery-powered communication devices. The LNA dual shunt peaking and has two modes of operation. In low-power mode (Mode-I), the LNA achieves a high gain ($$S21$$ S 21 ) of 18.87 dB, minimum noise figure ($${NF}_{min.}$$ NF m i n . ) of 2.5 dB in the − 3 dB frequency range of 2.3–2.9 GHz, and third-order intercept point (IIP3) of − 7.9dBm when operating at 0.6 V supply. In high-power mode (Mode-II), the achieved gain, NF, and IIP3 are 21.36 dB, 2.3 dB, and 13.78dBm respectively when operating at 1 V supply. The proposed LNA is implemented in UMC 180 nm CMOS process technology with a core area of $$0.40{\mathrm{ mm}}^{2}$$ 0.40 mm 2 and the post-layout validation is performed using Cadence SpectreRF circuit simulator.


Author(s):  
Ming-Cheng Liu ◽  
Paul C.-P. Chao ◽  
Soh Sze Khiong

In this paper a low power all-digital clock and data recovery (ADCDR) with 1Mhz frequency has been proposed. The proposed circuit is designed for optical receiver circuit on the battery-less photovoltaic IoT (Internet of Things) tags. The conventional RF receiver has been replaced by the visible light optical receiver for battery-less IoT tags. With this proposed ADCDR a low voltage, low power consumption & tiny IoT tags can be fabricated. The proposed circuit achieve the maximum bandwidth of 1MHz, which is compatible with the commercial available LED and light sensor. The proposed circuit has been fabricated in TSMC 0.18um 1P6M standard CMOS process. Experimental results show that the power consumption of the optical receiver is approximately 5.58uW with a supply voltage of 1V and the data rate achieves 1Mbit/s. The lock time of the ADCDR is 0.893ms with 3.31ns RMS jitter period.


2007 ◽  
Vol E90-C (10) ◽  
pp. 2044-2050 ◽  
Author(s):  
L. H.C. FERREIRA ◽  
T. C. PIMENTA ◽  
R. L. MORENO

Electronics ◽  
2020 ◽  
Vol 9 (6) ◽  
pp. 928 ◽  
Author(s):  
Taehoon Kim ◽  
Sivasundar Manisankar ◽  
Yeonbae Chung

Subthreshold SRAMs profit various energy-constrained applications. The traditional 6T SRAMs exhibit poor cell stability with voltage scaling. To this end, several 8T to 16T cell designs have been reported to improve the stability. However, they either suffer one of disturbances or consume large bit-area overhead. Furthermore, some cell options have a limited write-ability. This paper presents a novel 8T static RAM for reliable subthreshold operation. The cell employs a fully differential scheme and features cross-point access. An adaptive cell bias for each operating mode eliminates the read disturbance and enlarges the write-ability as well as the half-select stability in a cost-effective small bit-area. The bit-cell also can support efficient bit-interleaving. To verify the SRAM technique, a 32-kbit macro incorporating the proposed cell was implemented with an industrial 180 nm low-power CMOS process. At 0.4 V and room temperature, the proposed cell achieves 3.6× better write-ability and 2.6× higher dummy-read stability compared with the commercialized 8T cell. The 32-kbit SRAM successfully operates down to 0.21 V (~0.27 V lower than transistor threshold voltage). At its lowest operating voltage, the sleep-mode leakage power of entire SRAM is 7.75 nW. Many design results indicate that the proposed SRAM design, which is applicable to an aggressively-scaled process, might be quite useful in realizing cost-effective robust ultra-low voltage SRAMs.


Author(s):  
Mohd Tafir Mustaffa

Comparator is one of the main blocks that play a vital task in the performance of analog to digital converters (ADC) in all modern technology devices. High-speed devices with low voltage and low power are considered essential for industrial applications. The design of a low-power comparator with high speed is required to accomplish the requirements mostly in electronic devices that are necessary for high-speed ADCs. However, a high-speed device that leads the scaling down of CMOS process technology will consume more power. Thus, power reduction techniques such as multi-threshold super cut-off stack (MTSCStack), dual-threshold transistor stacking (DTTS), a bulk-driven, and a bulk-driven differential pair were studied in this work. This study aims to find and build the combination of these techniques to produce a comparator that can operate in low power without compromising existing performance using the 0.13-µm CMOS process. A comparator with a combination of MTSCStack, DTTS, and NMOS bulk-driven differential pair shows the most promising result of 6.29 µW for static power, 17.15 µW for dynamic power, and 23.44 µW for total power.


2021 ◽  
Author(s):  
Pratibha Aggarwal ◽  
Bharat Garg

Abstract Adders are one of the most important digital components used in any arithmetic applications. Many improvements in past have been made to improve its architecture. In this paper, we present two new symmetric designs for Energy efficient full adder cells featuring GDI (Gate-Diffusion Input) logic. The main design objectives for these adder modules are to operate at Low-Power with reduced area but also provide full-voltage swing. In the first (AEG-FA) design, a new approach of Inverted and Non-Inverted Carry-ins were taken to give complementary Carry-out and Sum with desired performance. These were then applied in different combinations to form higher bit width Adder architecture. This provides a higher degree of design freedom to target a wide range of applications, hence reducing design efforts. The second (PEG-FA) design is based on conventional approach which tries to reduce the critical path delay and lower switching activity in GDI circuit, providing Low-Power and high speed digital component at full voltage swing circuit. Many of the previously reported adders in literature suffered from the problems of low-swing and high noise when operated at low supply voltages. These two new designs successfully operate at low voltage with high signal integrity and driving capability. In order to evaluate the performance of proposed full adders, we incorporated 8-bit ripple carry adders. The studied circuits are optimized for energy efficiency using 45 nm CMOS process technology. The comparison between these novel circuits with standard full adder cells shows improvement in terms of Area, Delay, Power and Power-Delay-Product (PDP), Area-Delay Product (ADP), Area-Power Product (APP). At architecture level proposed adder shows 12.8% over CMOS, 14.8% over hybrid and 11.4% over other GDI logic power savings, by having almost 55% reduction in area.


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