Giant reduction in thermal conductivity of extended type-I silicon clathrates and prominent thermal effect of 6d guest Wyckoff positions

2017 ◽  
Vol 5 (40) ◽  
pp. 10578-10588 ◽  
Author(s):  
Yufei Gao ◽  
Xiaoliang Zhang ◽  
Yanguang Zhou ◽  
Ming Hu
Keyword(s):  
Thermal Conductivity ◽  
Thermal Effect ◽  
High Performance ◽  
Type I ◽  
Silicon Clathrates ◽  
Extended Type ◽  
Reduction Effect

Clathrates exhibit exceptional properties such as high-performance thermoelectrics. The extension of cages and guest atoms in 6d Wyckoff positions (other than 2a positions) both have huge reduction effect on the thermal conductivity of Type-I clathrates, which provides important guidance to exploring new kinds of silicon clathrates for advanced thermoelectrics.

Transport Properties of Type II Sodium-Silicon Clathrates

2005 ◽  
Vol 886 ◽  
Author(s):  
Matt Beekman ◽  
Jan Grkyo ◽  
George S. Nolas
Keyword(s):  
Thermal Conductivity ◽  
Sodium Content ◽  
Type I ◽  
Type Ii ◽  
Conductivity Measurements ◽  
Scanning Calorimetry ◽  
Resistivity Measurements ◽  
Silicon Clathrates ◽  
Covalently Bonded ◽  
First Time

ABSTRACTWe have synthesized the type II silicon clathrates Na1Si136 and Na8Si136, and report on the electrical and thermal transport in these materials. The crystal structure consists of a covalently bonded silicon framework in which sodium guest atoms are encapsulated inside the silicon host framework. Differential scanning calorimetry measurements show the compounds decompose above 600°C to diamond-structure silicon. Temperature dependant electrical resistivity measurements show the specimens to have an insulating character, with magnitudes that decrease with increasing sodium content. For the first time, thermal conductivity measurements on type II sodium-silicon clathrates are presented. The thermal conductivity is very low for both specimens, and for Na8Si136 exhibits a clear dip in the range from 50 to 70 K. These data suggest that the “rattling” behavior observed in type I clathrates may also be present in type II clathrates.

OLIN C197

Alloy Digest ◽  
1999 ◽  
Vol 48 (1) ◽  
Keyword(s):  
Thermal Conductivity ◽  
Wear Resistance ◽  
Physical Properties ◽  
Tensile Properties ◽  
High Performance ◽  
Corrosion And Wear ◽  
Contact Forces ◽  
High Current ◽  
Lower Strength ◽  
Current Carrying Capability

Abstract Olin C197 is a second-generation high performance alloy developed by Olin Brass. It has a strength and bend formability similar to C194 (see Alloy Digest Cu-360, September 1978), but with 25% higher electrical and thermal conductivity. High conductivity allows C197 to replace brasses and bronzes in applications where high current-carrying capability is required. Also, the strength of C197 provides higher contact forces when substituted for many lower strength coppers. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion and wear resistance as well as forming and joining. Filing Code: CU-627. Producer or source: Olin Brass.

Study of Transcrystallization in Polymer Composites

1989 ◽  
Vol 170 ◽  
Author(s):  
Benjamin S. Hsiao ◽  
J. H. Eric
Keyword(s):  
Thermal Conductivity ◽  
Free Energy ◽  
Carbon Fiber ◽  
Plasma Treatment ◽  
Polymer Composites ◽  
High Performance ◽  
Interfacial Strength ◽  
Fiber Surface ◽  
Semicrystalline Polymers ◽  
First Case

AbstractTranscrystallization of semicrystalline polymers, such as PEEK, PEKK and PPS, in high performance composites has been investigated. It is found that PPDT aramid fiber and pitch-based carbon fiber induce a transcrystalline interphase in all three polymers, whereas in PAN-based carbon fiber and glass fiber systems, transcrystallization occurs only under specific circumstances. Epitaxy is used to explain the surface-induced transcrystalline interphase in the first case. In the latter case, transcrystallization is probably not due to epitaxy, but may be attributed to the thermal conductivity mismatch. Plasma treatment on the fiber surface showed a negligible effect on inducing transcrystallization, implying that surface-free energy was not important. A microdebonding test was adopted to evaluate the interfacial strength between the fiber and matrix. Our preliminary results did not reveal any effect on the fiber/matrix interfacial strength of transcrystallinity.

scholarly journals Decoupling electron and phonon transport in single-nanowire hybrid materials for high-performance thermoelectrics

2021 ◽  
Vol 7 (20) ◽  
pp. eabe6000
Author(s):  
Lin Yang ◽  
Madeleine P. Gordon ◽  
Akanksha K. Menon ◽  
Alexandra Bruefach ◽  
Kyle Haas ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Transport ◽  
Electrical Transport ◽  
High Performance ◽  
Figure Of Merit ◽  
Phonon Transport ◽  
Core Shell ◽  
Nanowire Diameter ◽  
High Performing ◽  
Polycrystalline Thin Films

Organic-inorganic hybrids have recently emerged as a class of high-performing thermoelectric materials that are lightweight and mechanically flexible. However, the fundamental electrical and thermal transport in these materials has remained elusive due to the heterogeneity of bulk, polycrystalline, thin films reported thus far. Here, we systematically investigate a model hybrid comprising a single core/shell nanowire of Te-PEDOT:PSS. We show that as the nanowire diameter is reduced, the electrical conductivity increases and the thermal conductivity decreases, while the Seebeck coefficient remains nearly constant—this collectively results in a figure of merit, ZT, of 0.54 at 400 K. The origin of the decoupling of charge and heat transport lies in the fact that electrical transport occurs through the organic shell, while thermal transport is driven by the inorganic core. This study establishes design principles for high-performing thermoelectrics that leverage the unique interactions occurring at the interfaces of hybrid nanowires.

Polyimide-Silica Hybrid Aerogels with High Mechanical Strength for Thermal Insulation Applications

2011 ◽  
Vol 1306 ◽  
Author(s):  
Wenting Dong ◽  
Wendell Rhine ◽  
Shannon White
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Ambient Conditions ◽  
Separation Membranes ◽  
Low Dielectric ◽  
Aging Conditions ◽  
Hybrid Aerogels ◽  
Mechanical Strengths ◽  
The Relationship ◽  
Silica Hybrid

ABSTRACTHigh performance polyimides have been widely investigated as materials with excellent thermal, mechanical, and electronic properties due to their highly rigid structures. Aspen has developed an approach to prepare polyimide aerogels which have applications as low dielectric constant materials, separation membranes, catalyst supports and insulation materials. In this paper, we will discuss the preparation of polyimide-silica hybrid aerogel materials with good mechanical strengths and low thermal conductivities. The polyimide-silica hybrid aerogels were made by a two-step process and the materials were characterized to determine thermal conductivity and compressive strength. Results show that compressive moduli of the polyimide-silica hybrid aerogels increase dramatically with density (power law relationship). Thermal conductivity of the aerogels is dependent on the aging conditions and density, with the lowest value achieved so far being ~12 mW/m-K at ambient conditions. The relationship between aerogel density and surface area, thermal stability, porosity and morphology of the nanostructure of the polyimide-silica hybrid aerogels are also described in this paper.

scholarly journals Polycrystalline SnSe with a thermoelectric figure of merit greater than the single crystal

2021 ◽  
Author(s):  
Chongjian Zhou ◽  
Yong Kyu Lee ◽  
Yuan Yu ◽  
Sejin Byun ◽  
Zhong-Zhen Luo ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Single Crystal ◽  
High Performance ◽  
Figure Of Merit ◽  
Waste Heat ◽  
Electric Energy ◽  
Cost Effective ◽  
Tin Selenide ◽  
Tin Oxides ◽  
Thermally Conductive

AbstractThermoelectric materials generate electric energy from waste heat, with conversion efficiency governed by the dimensionless figure of merit, ZT. Single-crystal tin selenide (SnSe) was discovered to exhibit a high ZT of roughly 2.2–2.6 at 913 K, but more practical and deployable polycrystal versions of the same compound suffer from much poorer overall ZT, thereby thwarting prospects for cost-effective lead-free thermoelectrics. The poor polycrystal bulk performance is attributed to traces of tin oxides covering the surface of SnSe powders, which increases thermal conductivity, reduces electrical conductivity and thereby reduces ZT. Here, we report that hole-doped SnSe polycrystalline samples with reagents carefully purified and tin oxides removed exhibit an ZT of roughly 3.1 at 783 K. Its lattice thermal conductivity is ultralow at roughly 0.07 W m–1 K–1 at 783 K, lower than the single crystals. The path to ultrahigh thermoelectric performance in polycrystalline samples is the proper removal of the deleterious thermally conductive oxides from the surface of SnSe grains. These results could open an era of high-performance practical thermoelectrics from this high-performance material.

Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Performance ◽  
Thermal Transport ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
Three Dimensional ◽  
Nano Crystalline ◽  
Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

scholarly journals A “hairy” polymer/3D-foam hybrid for flexible high performance thermal gap filling applications in harsh environments

RSC Advances ◽  
2017 ◽  
Vol 7 (62) ◽  
pp. 39292-39298
Author(s):  
M. Loeblein ◽  
L. Jing ◽  
M. Liu ◽  
J. J. W. Cheah ◽  
S. H. Tsang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Harsh Environments ◽  
Mechanical Support ◽  
Gap Filling ◽  
Foam Composite

A new polymer/3D-foam-composite is presented for filling large gaps with high conformity and thermal conductivity, while rendering strong mechanical support.

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

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