A study on the intermetallic growth of fine-pitch Cu pillar/SnAg solder bump for 3D-TSV interconnection
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2016 ◽
Vol 2016
(DPC)
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pp. 001663-001681
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2014 ◽
Vol 2014
(DPC)
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pp. 001643-001669
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2014 ◽
Vol 2014
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pp. 000247-000250
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2012 ◽
Vol 2012
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pp. 000455-000463
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2011 ◽
Vol 2011
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pp. 000828-000836
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