Advances in high Speed Plating for Vertical Glass Panel Fine-Line Plating

2019 ◽  
Author(s):  
Christian Dunkel ◽  
Herbert Otzlinger ◽  
Onishi Tetsuya ◽  
Raoul Schroeder
Keyword(s):  
High Speed ◽  
Glass Panel ◽  
Fine Line ◽  
Vertical Glass

scholarly journals Influence of microadditive of carbon dioxide on the kinetics of boiling-up of superheated w-pentane

2021 ◽  
Vol 2039 (1) ◽  
pp. 012027
Author(s):  
S A Perminov ◽  
E V Lipnyagov ◽  
M A Parshakova
Keyword(s):  
High Speed ◽  
Gas Adsorption ◽  
Glass Tube ◽  
Initial Value ◽  
Active Centers ◽  
High Speed Video ◽  
Inner Surface ◽  
Vertical Glass ◽  
Attainable Superheat ◽  
Kinetics Of

Abstract The effect of a low-boiling impurity (CO2 gas <1.5% mol) on the kinetics of boiling-up of superheated n-pentane in a vertical glass tube have been studied by high-speed video (2050 fps). The method of continuous pressure decrease from 2.00 to 0.10 MPa (in the temperature range of 100.2-145.1 °C), as well as the method of measuring the lifetimes of superheated liquids at 0.10 MPa (90.2-134.1 °C) have been used. The inner surface of the tube has two visible defects, one of which defines the boundary of the attainable superheat. After degassing the system, the defects of tube cease to play an appreciable role, the active centers are redistributed. The temperature of the attainable superheat increases from the initial value by 20 °C in tests with gas and by 10 °C in subsequent tests without it. The result obtained may be related to physical gas adsorption on the glass surface during the process of evacuation of the system.

Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection

2019 ◽  
Vol 2019 (1) ◽  
pp. 000216-000222
Author(s):  
Chun-Hsien Chien ◽  
Chien-Chou Chen ◽  
Wen-Liang Yeh ◽  
Wei-Ti Lin ◽  
Cheng-Hui Wu ◽  
...  
Keyword(s):  
Stress Test ◽  
Dielectric Materials ◽  
Circuit Board ◽  
Strip Line ◽  
Organic Substrates ◽  
Next Generation ◽  
Glass Panel ◽  
Process Technology ◽  
Fine Line ◽  
Ic Foundry

Abstract In 1965, Gordon E. Moore, the co-founder of Intel stated that numbers of transistors on a chip will double every 18 months and his theory called the Moore's Law. The law had been the guiding principle of chip design over 50 years. The technology dimension is scaling very aggressively in IC foundry. For example, TSMC announced their 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance computing applications. It is scheduled to start risk production in the second half of 2019.[1] To overview the semiconductor supply chain included IC foundry, wafer bumping, IC carrier, PCB (Printed circuit board) and OSAT (oversea assembly and testing)… etc., the IC carrier and PCB technology dimension scaling are far behind than the IC foundry since many reasons for the traditional industry. The industry needs different kinds of breakthrough approaches for the scaling of via and strip line in next generation interconnection. Traditional organic substrates faces many challenges of warpage, surface roughness and material dimension stability issues for manufacturing and high density I/Os with very fine line interconnections. To breakthrough these challenges, the materials of glass carrier, new photo-imagable dielectric (PID) and advanced equipment were evaluated for the fine line and fine via interconnection. In the papers, there are many PID and non-PID materials were surveyed and compared for fine via (&lt; 10μm) interconnection or low loss of high frequency application. The first candidate was chosen for redistribution layers (RDL) fabrication by using 370mm × 470mm glass panels. Semi additive process (SAP) was used for direct metallization on glass panel with different build-up dielectric materials to form daisy chain test vehicles. The process, fabrication integration and electrical measurement results of daisy chain showed good continuity and electric resistance in the glass panel substrate. The reliability of the thermal cycling test (TCT) and highly accelerated stress test (HAST) were evaluated as well in this study.

Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging

2016 ◽  
Vol 2016 (1) ◽  
pp. 000190-000195 ◽  
Author(s):  
Alvin Lee ◽  
Jay Su ◽  
Baron Huang ◽  
Ram Trichur ◽  
Dongshun Bai ◽  
...  
Keyword(s):  
High Speed ◽  
Process Integration ◽  
Cost Effective ◽  
Wafer Level ◽  
Molding Compound ◽  
Fine Line ◽  
Glass Substrates ◽  
Laser Ablation Process ◽  
Wafer Level Packaging ◽  
Increasing Demand

Abstract With increasing demand for mobile devices to be lighter and thinner and consume less power while operating at high speed and high bandwidth, many equipment suppliers and assembly participants have invested great efforts to achieve fine-line fan-out wafer-level packaging (FOWLP). However, the inherent warp of reconstituted wafers, which can contribute to poor die placement accuracy and/or delamination at the interface of the build-up layer and carrier, remains a major challenge. In this study, the interactions among laser release layer, glass carrier, and build-up layer were evaluated for optimization of redistribution layer (RDL)–first FOWLP as a foundation to move toward fine-line FOWLP. In this study, a series of experiments incorporating glass carrier, laser release layer, and build-up layers were carried out to determine the optimal setup for RDL-first FOWLP. First, glass carriers (300 mm × 300 mm × 0.7 mm) with coefficients of thermal expansion of 3 and 8 ppm/°C were treated with 150-nm laser release layers. After deposition of 0.1 μm of sacrificial material on the glass carrier, 8-μm build-up layers were coated and patterned by lithography to electroplate Cu interconnections with a density of approximately 10% of the surface area. Subsequent to die attachment, molding compound was applied on top to form a 200-μm protective overcoat. The reconstituted wafer was then separated from the glass carrier through a laser ablation process using a 308-nm laser to complete the design of experiments (DOE). An experiment to study the correlation of glass carrier, laser release layer, build-up layers, and molding compound in RDL-first FOWLP processes is discussed to address full process integration on 300-mm glass substrates. The combination of glass carrier, laser release layer, build-up layer, and molding compound will pave the way for realizing cost-effective RDL-first FOWLP on panel-size substrates.

scholarly journals The structure and function of the sucker systems of hill stream loaches

2019 ◽  
Author(s):  
Jay Willis ◽  
Theresa Burt de Perera ◽  
Cait Newport ◽  
Guillaume Poncelet ◽  
Craig J Sturrock ◽  
...  
Keyword(s):  
Total Internal Reflection ◽  
High Speed ◽  
Structural Variation ◽  
High Flow ◽  
Skeletal Structure ◽  
Video Capture ◽  
Flow Rates ◽  
Frustrated Total Internal Reflection ◽  
Vertical Glass ◽  
And Function

AbstractHill stream loaches (family Balitoridae and Gastromyzontidae) are thumb-sized fish that effortlessly exploit environments where flow rates are so high that potential competitors would be washed away. To cope with these extreme flow rates hill stream loaches have evolved adaptations to stick to the bottom, equivalent to the downforce generating wings and skirts of F1 racing cars, and scale architecture reminiscent of the drag-reducing riblets of Mako sharks. Hill stream loaches exhibit far more diverse flow-modifying morphological features than fast pelagic predators, suggesting as yet unknown drag reducing systems remain to be discovered. Here we describe the skeletal structure of Sewellia lineolata and Gastromyzon punctulatus and contrast that with other fish that face similar hydrodynamic challenges. We identify a major structural variation within Balitoridae pelvic sucker attachment positions which may explain fundamental constraints on the parallel development of different genera and which has not been described before. We also use high speed video capture, CT scans and Frustrated Total Internal Reflection to image and measure the sucker system in live operation and describe how it functions on a familiar activity for hill stream loaches (climbing waterfalls). We show how they can drag 3 to 4 times their own bodyweight up a vertical glass waterfall. Adaptations to high flow rates are the inspiration for this study, because there are many engineering applications where the ability to deal with high flow rates are important - either by reducing drag, or by generating the forces needed to hold an animal in place.

I-1 fine line MOS technology for high speed integrated circuits

1983 ◽  
Vol 30 (11) ◽  
pp. 1564-1564 ◽  
Author(s):  
G.E. Smith
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
Fine Line

Development of Electronic Substrates for Medical Device Applications

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001527-001546 ◽  
Author(s):  
Frank D. Egitto ◽  
Rabindra N. Das ◽  
Francesco Marconi ◽  
Bill Wilson ◽  
Voya R. Markovich
Keyword(s):  
Flexible Electronics ◽  
High Speed ◽  
High Performance ◽  
Electronic Materials ◽  
High Reliability ◽  
Fine Line ◽  
Flexible Materials ◽  
Novel Approach ◽  
Micro Pillars ◽  
Electronic Substrates

There is a strong desire to develop advanced electronic substrates that can meet the growing demand for miniaturization, high-speed performance, and flexibility for medical devices. To accomplish this, new packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and high reliability, while being pushed into smaller and smaller footprints. As a result, the microelectronics industry is moving toward alternative, innovative approaches as solutions for squeezing more function into smaller packages. In the present study, we are developing flexible packages for a variety of medical applications. Here we discuss several classes of flexible materials that can be used to form high-performance flexible packaging. In addition, copper thinner than 5 μm is routinely used, with copper layers as thin as 0.2 μm used as a seed layer for semi-additive approaches. The use of semi-additive circuitization facilitates manufacture of fine-line circuit features, and traces narrower than 12μm have been produced routinely. A smooth copper-polymer interface is ideal for high speed applications and for fine line etching. Selection of an appropriate material provides good copper adhesion to the base film. Flexible materials with 1 or 2 metal layers provide the smallest possible roll diameter for systems such as catheters. Compatibility with well developed, high performance electronic materials represents a key advantage of flexible electronics systems that are enabled by high density fine line structures rather than unusual materials. Electrical interconnection between the chip and package can be made by a number of means. Solder-coated Cu-micro pillars for a variety of finer pitch applications are being developed. Cu micro pillars are grown through the dielectric or silicon and subsequently coated with solder to produce finer pitch 3D-interconnects. The paper also describes a novel approach for the fabrication of flexible electronics on PDMS substrates. The paper discusses the fabrication of PDMS substrates using different circuit patterns and geometries. Rozalia/Ron ok move from 2.5/3D to FC/WLP 12-21-11.

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

Vacuum System to Minimize the Specimen Contamination of High-Performance EM

1977 ◽  
Vol 35 ◽  
pp. 68-69
Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh
Keyword(s):  
Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
High Vacuum ◽  
Vacuum System ◽  
Pump System ◽  
Pumping System ◽  
Diffusion Pump ◽  
Almost All ◽  
Cascade Type

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.

The on-line use of histogram data for high-speed correction and alignment of electron microscope images

1984 ◽  
Vol 42 ◽  
pp. 556-557
Author(s):  
William Krakow
Keyword(s):  
Power Spectrum ◽  
High Speed ◽  
Direct Memory Access ◽  
Digital Television ◽  
Contrast Transfer Function ◽  
The Past ◽  
High Resolution Tem ◽  
On Line ◽  
Correction Of Astigmatism ◽  
The Fourier Transform

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.

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