scholarly journals Analysis of GaN-based HEMTS with AlN buffer layers by using Raman spectroscopy

2021 ◽  
pp. 2141010
Author(s):  
Cheng Che Lee ◽  
Hsin Jung Lee ◽  
Hsin Che Lee ◽  
Wei Yu Lee ◽  
Wei Ching Chuang
Keyword(s):  
Raman Spectroscopy ◽  
Buffer Layer ◽  
Epitaxial Layer ◽  
Drain Current ◽  
Buffer Layers ◽  
Crystal Quality ◽  
Subthreshold Slope ◽  
Gan Hemts ◽  
Aln Buffer

In this paper, AlGaN/GaN HEMTs with an AlN buffer layer were fabricated. Analyses on the crystal quality of the GaN epitaxial layer by Raman spectroscopy have been purposed. By introducing an AlN layer on sapphire substrate, the maximum drain current of the HEMT increased from 481 mA/mm to 522 mA/mm at [Formula: see text] V. Subthreshold slope was reduced from 638.3 mV/decade to 240.9 mV/decade and the electron mobility increased from 1109 cm2 V[Formula: see text]s[Formula: see text] to 1781 cm2 V[Formula: see text]s[Formula: see text]. These results showed that using an AlN buffer layer can improve the crystal quality of the GaN epitaxial layer, thus optimize the device performances of the GaN-based HEMTs.

Study of the growth mechanism and properties of InN films grown by MOCVD

2003 ◽  
Vol 798 ◽  
Author(s):  
Abhishek Jain ◽  
Joan M. Redwing
Keyword(s):  
Thin Films ◽  
Buffer Layer ◽  
Growth Temperature ◽  
Room Temperature ◽  
Growth Conditions ◽  
Buffer Layers ◽  
Film Morphology ◽  
Buffer Layer Thickness ◽  
Aln Buffer

ABSTRACTThin films of InN were grown on (0001) Sapphire by MOCVD. The effect of growth conditions and buffer layer on the film morphology was studied. Growth temperature and TMI flow rate were important factors in the growth of InN. The use of a low temperature AlN buffer layer was also found to improve the morphology and crystal quality of the films. Thin (<40Å) AlN buffer layers produced the best results while polycrystalline InN was obtained when the buffer layer thickness exceeded 60Å. Delamination of the InN films was observed to occur at growth temperature, which limited the thickness of the films to less than 300 nm. A room temperature mobility of 792 cm2/Vs and an electron concentration of 2.1×1019 cm-3 were measured in an approximately 200 nm thick InN layer grown on sapphire.

Characteristics of Silicon Photodetector Using Epitaxial Wafer with High Resistivity and Long Recombination Lifetime

1993 ◽  
Vol 302 ◽  
Author(s):  
Yoshimaro Fujii ◽  
Akira Usami ◽  
Keisuke Kaneko ◽  
Takao Wada
Keyword(s):  
Buffer Layer ◽  
Epitaxial Layer ◽  
Interface Region ◽  
Crystal Quality ◽  
High Resistivity ◽  
High Quality ◽  
Recombination Lifetime ◽  
Depth Profiles ◽  
Pin Photodiode

ABSTRACTFor the high quality Si Photodetector, the high resistivity epitaxial wafer using the low resistivity substrate were studied. The buffer layer was introduced in the interface, and it was very effective on the crystal quality of the epitaxial layer. Recombination lifetime in the epitaxial layer became very uniform and long even in the interface region which was confirmed by measuring the lifetime depth profiles. Then Si PIN Photodiode was fabricated on the above high quality epitaxial wafer and its optoelectric characteristics was evaluated.

Effects of the Sputtering Time of AlN Buffer Layer on the Quality of ZnO Thin Films

2014 ◽  
Vol 881-883 ◽  
pp. 1117-1121 ◽  
Author(s):  
Xiang Min Zhao
Keyword(s):  
Thin Films ◽  
Buffer Layer ◽  
Rf Magnetron Sputtering ◽  
Buffer Layers ◽  
Zno Thin Films ◽  
Zno Films ◽  
Si Substrates ◽  
Atomic Force ◽  
Structure Morphology ◽  
Aln Buffer

ZnO thin films with different thickness (the sputtering time of AlN buffer layers was 0 min, 30 min,60 min, and 90 min, respectively) were prepared on Si substrates using radio frequency (RF) magnetron sputtering system.X-ray diffraction (XRD), atomic force microscope (AFM), Hall measurements setup (Hall) were used to analyze the structure, morphology and electrical properties of ZnO films.The results show that growth are still preferred (002) orientation of ZnO thin films with different sputtering time of AlN buffer layer,and for the better growth of ZnO films, the optimal sputtering time is 60 min.

The Influence of Growth Temperature on Oxygen Concentration in GaN Buffer Layer

2008 ◽  
Vol 1068 ◽  
Author(s):  
Ewa Dumiszewska ◽  
Wlodek Strupinski ◽  
Piotr Caban ◽  
Marek Wesolowski ◽  
Dariusz Lenkiewicz ◽  
...  
Keyword(s):  
High Temperature ◽  
Buffer Layer ◽  
Oxygen Concentration ◽  
Growth Temperature ◽  
Low Temperatures ◽  
Buffer Layers ◽  
Crystalline Quality ◽  
Temperature Growth ◽  
Gan Buffer Layer

ABSTRACTThe influence of growth temperature on oxygen incorporation into GaN epitaxial layers was studied. GaN layers deposited at low temperatures were characterized by much higher oxygen concentration than those deposited at high temperature typically used for epitaxial growth. GaN buffer layers (HT GaN) about 1 μm thick were deposited on GaN nucleation layers (NL) with various thicknesses. The influence of NL thickness on crystalline quality and oxygen concentration of HT GaN layers were studied using RBS and SIMS. With increasing thickness of NL the crystalline quality of GaN buffer layers deteriorates and the oxygen concentration increases. It was observed that oxygen atoms incorporated at low temperature in NL diffuse into GaN buffer layer during high temperature growth as a consequence GaN NL is the source for unintentional oxygen doping.

Preparation of InN by Means of AP-HCVD Using In Buffer Layers

2007 ◽  
Vol 1040 ◽  
Author(s):  
Hiroaki Yokoo ◽  
Naoki Wakiya ◽  
Naonori Sakamoto ◽  
Takato Nakamura ◽  
Hisao Suzuki
Keyword(s):  
Electrical Property ◽  
Surface Morphology ◽  
Buffer Layer ◽  
Atmospheric Pressure ◽  
Indium Nitride ◽  
Buffer Layers ◽  
Crystal Quality ◽  
X Ray Diffraction ◽  
X Ray ◽  
Quality Surface

AbstractWe have grown indium nitride (InN) films using In buffer layer on an a-plane sapphire substrate under atmospheric pressure by halide CVD (AP-HCVD). Growth was carried out by two steps: deposition In buffer layer at 900 °C and subsequent growth of InN layer at 650 °C. In order to compare, we also grown InN films on an a-plane sapphire. The InN films are investigated on crystal quality, surface morphology and electrical property using high-resolution X-ray diffraction (HR-XRD), X-ray pole figure, scanning electron microscope (SEM), Hall measurement. The results show that the crystal quality, surface morphology and electrical property of InN films are improved by using In buffer layer.

GaN ON SILICON SUBSTRATE WITH AlN BUFFER LAYER FOR UV PHOTODIODE

2012 ◽  
Vol 21 (01) ◽  
pp. 1250014 ◽  
Author(s):  
L. S. CHUAH ◽  
S. M. THAHAB ◽  
Z. HASSAN
Keyword(s):  
Schottky Barrier ◽  
Buffer Layer ◽  
Barrier Height ◽  
Silicon Substrate ◽  
Dark Current ◽  
Schottky Barrier Height ◽  
Buffer Layers ◽  
Current Ratio ◽  
Principal Mechanism ◽  
Aln Buffer

Nitrogen plasma-assisted molecular beam epitaxy (PAMBE) deposited GaN thin films on (111) n-type silicon substrate with different thickness AlN buffer layers are investigated and distinguished by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and Raman scattering. The thickness of AlN buffer layer ranged from 200 nm to 300 nm. Besides that, the electrical characteristics of the GaN thin film for ultraviolet detecting utilizations are studied by calculating the photo current/dark current ratio on a metal-semiconductor-metal (MSM) photodiode with and without the illumination of Hg-lamp source. The devices have been tested over room temperature (RT). The photocurrent analysis, together with the study of Schottky barrier height (SBH) development, ascertain that the principal mechanism of photo transport is thermionic emission. The photocurrent value is rigorously dependent on Schottky barrier height. The GaN/AlN(200 nm)/n-Si MSM photodiode produces the highest photo/dark current ratio for the lowest strain that consists of the GaN film grown on the AlN (200 nm) buffer layer.

scholarly journals Effect of Buffer Layer and III/V Ratio on the Surface Morphology of Gan Grown by MBE

1999 ◽  
Vol 4 (S1) ◽  
pp. 417-422 ◽  
Author(s):  
E. C. Piquette ◽  
P. M. Bridger ◽  
R. A. Beach ◽  
T. C. McGill
Keyword(s):  
Surface Morphology ◽  
Buffer Layer ◽  
Flux Ratio ◽  
Plasma Source ◽  
Growth Conditions ◽  
Nitrogen Plasma ◽  
Layer Growth ◽  
Buffer Layers ◽  
Flat Surfaces ◽  
Aln Buffer

The surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and “loop” defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than 1 nm RMS.

Growth of 4H-SiC Epitaxial Layer through Optimization of Buffer Layer

2018 ◽  
Vol 924 ◽  
pp. 84-87 ◽  
Author(s):  
Nicolò Piluso ◽  
Andrea Severino ◽  
Ruggero Anzalone ◽  
Maria Ausilia di Stefano ◽  
Enzo Fontana ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Leakage Current ◽  
Breakdown Voltage ◽  
Epitaxial Layer ◽  
Electrical Parameters ◽  
Crystallographic Defects

In this work the deposition of buffer layer has been studied in order to increase the quality of the epitaxial layer and improve the performance of device. The comparison between two different thicknesses of buffer layer reveals a decrease of crystallographic defects and an improvement of electrical parameters of MOSFET device as leakage current and breakdown voltage.

Sign in / Sign up

Export Citation Format

Share Document