Effect of ZrB2 nanopellets on microstructure, dielectric, mechanical and thermal stability of polyimide

2021 ◽  
pp. 095400832199417
Author(s):  
Lin Pan ◽  
Jinghua Yin ◽  
Jialong Li ◽  
Yanpeng Li ◽  
He Zhao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stability ◽  
Dielectric Constant ◽  
Performance Improvement ◽  
In Situ Polymerization ◽  
Coefficient Of Thermal Expansion ◽  
Zirconium Boride ◽  
Heat Accumulation ◽  
Insulation Property ◽  
Strong Electron

Zirconium boride (ZrB2) with high electrical, thermal conductivity, chemical stability and low coefficient of thermal expansion has been considered promising boride ceramic. In this study, the new type polyimide(PI)-based composites filled with ZrB2 nanopellets were prepared via in-situ polymerization. The results show that the ZrB2 nanopellets are dispersed uniformly in the PI matrix and the ZrB2/PI composites with 0.5 wt.% loading exhibits outstanding dielectric, mechanical properties and thermal stability. A mechanism related to the microstructure is proposed to explain the performance improvement. ZrB2 with strong electron affinity could trigger charges to accumulate on its surface, which promotes the interface polarization and consequently enhance dielectric constant. The strong interactions between ZrB2 and PI beneficial to stress effectively transfer from the PI matrix to the ZrB2. The dense structure of the composites and the intrinsically high thermal conductivity of ZrB2 are conducive to heat transfer in the matrix and reduce heat accumulation. The dielectric constant, tensile strength and elongation at break of the composites are increased by 17.5%, 63% and 59.4% compared to pure PI. Meanwhile, the ZrB2/PI composites possess superior electrical insulation property. The comprehensive performance improvement of the composites share a broader prospect for its application in engineering.

scholarly journals Research on Thermal Stability and Properties of Ca3ZrSi2O9 as Potential T/EBC Materials

Coatings ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 583
Author(s):  
Yangyang Pan ◽  
Bo Liang ◽  
Yaran Niu ◽  
Dijuan Han ◽  
Dongdong Liu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Stability ◽  
Fracture Toughness ◽  
Room Temperature ◽  
Coefficient Of Thermal Expansion ◽  
Atmospheric Plasma ◽  
Thermal Barrier ◽  
Mechanical And Thermal Properties ◽  
Self Healing ◽  
Barrier Coating

In this study, a new coating material for thermal barrier coating (TBC) or environment barrier coating (EBC) application, Ca3ZrSi2O9 (CZSO), was synthesized and prepared by atmospheric plasma spray (APS) technology. The evolution of the phases and microstructures of the coatings with different thermal-aged were characterized by XRD, XRF, EDS and SEM, respectively. The thermal stability was measured by TG-DTA and DSC. The mechanical and thermal properties, including Vickers hardness (HV), fracture toughness (KIC), thermal conductivity () and coefficient of thermal expansion (CTE) were focused on. It was found that the as-sprayed CZSO coating contained amorphous phase. Crystalline transformation happened at 900–960 ∘C and no mass changes took place from room temperature (RT) to 1300 ∘C. The phenomena of microcrack self-healing and composition uniformity were observed during thermal aging. The of coating was very low at about 0.57–0.80 Wm−1K−1 in 200–1200 ∘C. The combined properties indicated that the CZSO coating might be a potential T/EBC material.

Cryogenic thermal insulating and mechanical properties of rigid polyurethane foams blown with hydrofluoroolefin: Effect of perfluoroalkane

2021 ◽  
pp. 0021955X2110626
Author(s):  
Tae Seok Kim ◽  
Yeongbeom Lee ◽  
Chul Hyun Hwang ◽  
Kwang Ho Song ◽  
Woo Nyon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Cell Size ◽  
Thermal Insulation ◽  
Coefficient Of Thermal Expansion ◽  
Lower Surface ◽  
Polyurethane Foams ◽  
Insulation Material ◽  
Pu Foams

The effect of perfluoroalkane (PFA) on the morphology, thermal conductivity, mechanical properties and thermal stability of rigid polyurethane (PU) foams was investigated under ambient and cryogenic conditions. The PU foams were blown with hydrofluorolefin. Morphological results showed that the minimum cell size (153 μm) was observed when the PFA content was 1.0 part per hundred polyols by weight (php). This was due to the lower surface tension of the mixed polyol solution when the PFA content was 1.0 php. The thermal conductivity of PU foams measured under ambient (0.0215 W/mK) and cryogenic (0.0179 W/mK at −100°C) conditions reached a minimum when the PFA content was 1.0 php. The low value of thermal conductivity was a result of the small cell size of the foams. The above results suggest that PFA acted as a nucleating agent to enhanced the thermal insulation properties of PU foams. The compressive and shear strengths of the PU foams did not appreciably change with PFA content at either −170°C or 20°C. However, it shows that the mechanical strengths at −170°C and 20°C for the PU foams meet the specification. Coefficient of thermal expansion, and thermal shock tests of the PU foams showed enough thermal stability for the LNG carrier’s operation temperature. Therefore, it is suggested that the PU foams blown by HFO with the PFA addition can be used as a thermal insulation material for a conventional LNG carrier.

Porous reaction-sintered AlN tapes for high-performance microelectronics application

2002 ◽  
Vol 17 (2) ◽  
pp. 306-314 ◽  
Author(s):  
F. Y. C. Boey ◽  
A. I. Y. Tok ◽  
W. J. Clegg
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
High Performance ◽  
Coefficient Of Thermal Expansion ◽  
Linear Trend ◽  
Dielectric Constants ◽  
Sintering Behavior ◽  
Low Dielectric ◽  
Novel Approach ◽  
Controlled Porosity

A novel approach was undertaken in producing porous AlN microelectronics tapes with high thermal conductivity and low dielectric constant. This method involved polymer microspherical powders used as a sacrificial mold to introduce controlled porosity into the green tapes during pyrolysis. The Al2O3-rich porous green tapes were then reaction sintered at 1680 °C for 12 h to create porous AlN tapes. This work builds upon a previously developed novel reaction sintering process that densified and converted Al2O3-rich tapes (Al2O3–20 wt% AlN–5 wt% Y2O3) to AlN tapes at a relatively low sintering temperature of 1680 °C. The sintering behavior of the porous tapes was investigated, and the effects of the microsphere particle size and volume addition were studied. The microspheres successfully contributed to the significant reduction of tape density by porosity, and this contributed to lowering its dielectric constant. Dielectric constants of the AlN tapes were reduced to about 6.8 to 7.7 while thermal conductivity values were reasonable at about 46 to 60 W/mK. Coefficient of thermal expansion (CTE) values showed a linear trend according to phase composition, with the porous AlN tapes exhibiting CTE values of 4.4 × 10−6 to 4.8 × 10−6/°C, showing good CTE compatibility with silicon at 4.0 × 10−6/°C. The added porosity did not significantly affect the CTE values.

scholarly journals Temperature Effects on the Dielectric Properties and Breakdown Performance of h-BN/Epoxy Composites

Materials ◽  
2019 ◽  
Vol 12 (24) ◽  
pp. 4112 ◽  
Author(s):  
Yongzhe Tang ◽  
Peng Zhang ◽  
Mingxiao Zhu ◽  
Jiacai Li ◽  
Yuxia Li ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Boron Nitride ◽  
Mass Fraction ◽  
Breakdown Strength ◽  
Hexagonal Boron Nitride ◽  
Glassy State ◽  
Internal Heat ◽  
Heat Accumulation ◽  
Different Temperatures

Epoxy–boron nitride composites are promising insulating materials, and it is highly important to understand their insulating performances at different temperatures with different nano-doping amounts. In this study, we investigated the effects of different mass fractions of epoxy–micron hexagonal boron nitride composites on their thermal conductivity, as well as the effects of temperature and mass fraction on their insulating performances. The results demonstrated that the thermal conductivity of epoxy–micron hexagonal boron nitride composites was superior to that of neat epoxy. The thermal conductivity of epoxy–micron hexagonal boron nitride composites increased with the mass fraction of hexagonal boron nitride, and their dielectric constant and dielectric loss increased with temperature. The dielectric constant of epoxy–micron hexagonal boron nitride composites decreased as the mass fraction of hexagonal boron nitride increased, while their dielectric losses decreased and then increased as the mass fraction of hexagonal boron nitride increased. Due to internal heat accumulation, the alternating current breakdown strength of epoxy–micron hexagonal boron nitride composites increased and then decreased as the mass fraction of hexagonal boron nitride increased. Additionally, as the temperature increased, the composites transitioned from the glassy state to the rubbery or viscous state, and the breakdown strength significantly degraded.

scholarly journals Synthesis and Characterization of BaTiO3/Polypyrrole Composites with Exceptional Dielectric Behaviour

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1273 ◽  
Author(s):  
Khalil Ahmed ◽  
Farah Kanwal ◽  
Shahid Ramay ◽  
Shahid Atiq ◽  
Rabia Rehman ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
In Situ Polymerization ◽  
Weight Ratio ◽  
Aqueous Dispersion ◽  
Polymerization Process ◽  
Dielectric Parameters ◽  
Host Matrix ◽  
Ft Ir ◽  
Tga Analysis

Higher concentrations of ceramic fillers induce brittleness in the ceramic/polymer hybrids which restrict their applications to limited fields especially when such hybrids are prepared for their use as dielectrics. We have synthesized and characterized different BaTiO3-polypyrrole (PPy) composites by changing the concentration of BaTiO3 from 1% by weight of PPy taken to 5 wt % to explore its effect on the dielectric parameters of the final product and found that the BaTiO3-polypyrrole composite with weight ratio of 0.05:1 exhibited highest dielectric constant, lowest dielectric loss and thermally most stable. All the composites were prepared using in-situ polymerization of pyrrole in an aqueous dispersion of low content of BaTiO3 in the presence of small amount of Hydrochloric acid. These composites were characterized for their microstructure and crystallinity by X-ray diffractometer (XRD), Fourier transform infrared (FT-IR) spectroscopy and scanning electron microscopy (SEM) while thermal stability by thermo gravimetric (TGA) analysis. An impedance analyser (LCR meter) was utilized to investigate the dielectric parameters. FT-IR data confirmed the presence of the two phases and their interaction, inferred from the shifting of normal PPy peaks. The data obtained from XRD confirmed the presence of crystallites of 2.8 to 5 nm with dominant crystallinity of the filler, TGA analysis (25 to 600 °C) confirmed the higher thermal stability induced on successive addition of the filler into the prepared composites as compared to that of pure PPy in a wide temperature range which is unusual for such a low % age addition of the filler. The SEM analysis together with XRD results reveal that the successive introduction of BaTiO3 particles produced crystallites of 2 to 5 nm size which bonded together and changed the hemispherical shaped larger grains of the matrix to regular shaped smaller grains. The dielectric constant of the composites was enhanced with filler contents from 178 to 522 at 1 MHz for 1 wt % and 5 wt % BaTiO3 respectively. It was concluded that the introduction of BaTiO3 into the polymer matrix with this new procedure has greatly affected the polymerization process, thermal stability, morphology and dielectric properties of the host matrix and has resulted in a novel series of the composites which may have broad applications.

A Study of Some Mechanical and Physical Properties for Palm Fiber/Polyester Composite

2020 ◽  
Vol 38 (3B) ◽  
pp. 104-114
Author(s):  
Samah M. Hussein
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Date Palm ◽  
Volume Fraction ◽  
Unsaturated Polyester ◽  
Dielectric Strength ◽  
Palm Fiber ◽  
Mechanical And Physical Properties ◽  
Polyester Composite

This research has been done by reinforcing the matrix (unsaturated polyester) resin with natural material (date palm fiber (DPF)). The fibers were exposure to alkali treatment before reinforcement. The samples have been prepared by using hand lay-up technique with fiber volume fraction of (10%, 20% and 30%). After preparation of the mechanical and physical properties have been studied such as, compression, flexural, impact strength, thermal conductivity, Dielectric constant and dielectric strength. The polyester composite reinforced with date palm fiber at volume fraction (10% and 20%) has good mechanical properties rather than pure unsaturated polyester material, while the composite reinforced with 30% Vf present poor mechanical properties. Thermal conductivity results indicated insulator composite behavior. The effect of present fiber polar group induces of decreasing in dielectric strength, and increasing dielectric constant. The reinforcement composite 20% Vf showed the best results in mechanical, thermal and electrical properties.

scholarly journals Strengthening Thermal Stability in V2O5-ZnO-BaO-B2O3-M(PO3)n Glass System (M = Al, Mg) for Laser Sealing Applications

2021 ◽  
Vol 11 (10) ◽  
pp. 4603
Author(s):  
Soyoung Kim ◽  
Karam Han ◽  
Seonhoon Kim ◽  
Linganna Kadathala ◽  
Jinhyeok Kim ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Thermal Expansion ◽  
Bond Strength ◽  
Coefficient Of Thermal Expansion ◽  
Glass Frit ◽  
Glass System ◽  
Fiber Types ◽  
Hermetic Sealing ◽  
Doped Glasses ◽  
Glass Panels

Today, the most common way of laser sealing is using a glass frit paste and screen printer. Laser sealing using glass frit paste has some problems, such as pores, nonuniform height, imperfect hermetic sealing, etc. In order to overcome these problems, sealing using fiber types of sealant is attractive for packaging devices. In this work, (70-x)V2O5-5ZnO-22BaO-3B2O3-xM(PO3)n glasses (mol%) incorporated with xM(PO3)n concentration (where M = Mg, Al, n = 2, 3, respectively) were fabricated and their thermal, thermomechanical, and structural properties were investigated. Most importantly, for this type of sealing, the glass should have a thermal stability (ΔT) of ≥80 °C and the coefficient of thermal expansion (CTE) between the glass and panel should be 1.0 ppm/°C. The highest thermal stability ΔT of the order of 93.2 °C and 112.9 °C was obtained for the 15 mol% of Mg(PO3)2 and Al(PO3)3 doped glasses, respectively. This reveals that the bond strength and connectivity is more strongly improved by trivalent Al(PO3)3. The CTE of a (70-x)V2O5-5ZnO-22BaO-3B2O3-xAl(PO3)3 glass system (mol%) (where x = 5–15, mol%) is in the range of 9.5–15.5 (×10−6/K), which is comparable with the CTE (9–10 (×10−6/K)) of commercial DSSC glass panels. Based on the results, the studied glass systems are considered to be suitable for laser sealing using fiber types of sealant.

scholarly journals Preparation and Thermal Conductivity of Epoxy Resin/Graphene-Fe3O4 Composites

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2013
Author(s):  
Zhong Wu ◽  
Jingyun Chen ◽  
Qifeng Li ◽  
Da-Hai Xia ◽  
Yida Deng ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Epoxy Resin ◽  
Thermomechanical Properties ◽  
Packaging Materials ◽  
Mass Ratio ◽  
Degree Of Orientation ◽  
Ep Matrix ◽  
Electrical Insulation Properties

By modifying the bonding of graphene (GR) and Fe3O4, a stable structure of GR-Fe3O4, namely magnetic GR, was obtained. Under the induction of a magnetic field, it can be orientated in an epoxy resin (EP) matrix, thus preparing EP/GR-Fe3O4 composites. The effects of the content of GR and the degree of orientation on the thermal conductivity of the composites were investigated, and the most suitable Fe3O4 load on GR was obtained. When the mass ratio of GR and Fe3O4 was 2:1, the thermal conductivity could be increased by 54.8% compared with that of pure EP. Meanwhile, EP/GR-Fe3O4 composites had a better thermal stability, dynamic thermomechanical properties, and excellent electrical insulation properties, which can meet the requirements of electronic packaging materials.

Enhanced dielectric properties and thermostability in polyimide composites with core-shell structured polyimide@BaTiO3 nanoparticles

2021 ◽  
pp. 095400832199352
Author(s):  
Wei Deng ◽  
Guanguan Ren ◽  
Wenqi Wang ◽  
Weiwei Cui ◽  
Wenjun Luo
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
Energy Density ◽  
Breakdown Strength ◽  
In Situ Polymerization ◽  
Dielectric Materials ◽  
High Energy ◽  
Amic Acid ◽  
High Energy Density ◽  
Core Shell

Polymer composites with high dielectric constant and thermal stability have shown great potential applications in the fields relating to the energy storage. Herein, core-shell structured polyimide@BaTiO3 (PI@BT) nanoparticles were fabricated via in-situ polymerization of poly(amic acid) (PAA) and the following thermal imidization, then utilized as fillers to prepare PI composites. Increased dielectric constant with suppressed dielectric loss, and enhanced energy density as well as heat resistance were simultaneously realized due to the presence of PI shell between BT nanoparticles and PI matrix. The dielectric constant of PI@BT/PI composites with 55 wt% fillers increased to 15.0 at 100 Hz, while the dielectric loss kept at low value of 0.0034, companied by a high energy density of 1.32 J·cm−3, which was 2.09 times higher than the pristine PI. Moreover, the temperature at 10 wt% weight loss reached 619°C, demonstrating the excellent thermostability of PI@BT/PI composites. In addition, PI@BT/PI composites exhibited improved breakdown strength and toughness as compared with the BT/PI composites due to the well dispersion of PI@BT nanofillers and the improved interfacial interactions between nanofillers and polymer matrix. These results provide useful information for the structural design of high-temperature dielectric materials.

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