scholarly journals Structural Characterization of Movpe Grown Algan/Gan for Hemt Formation

2018 ◽  
Vol 57 (1) ◽  
pp. 72-81 ◽  
Author(s):  
V.N. Popok ◽  
T.S. Aunsborg ◽  
R.H. Godiksen ◽  
P.K. Kristensen ◽  
R.R. Juluri ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Charge Carrier Concentration ◽  
Electrical Performance ◽  
Clear Understanding ◽  
Si Substrates ◽  
Transfer Of Technology ◽  
Dislocation Densities ◽  
Unusual Phenomenon ◽  
Aln Buffer

Abstract Results on structural, compositional, optical and electrical characterization of MOVPE grown AlGaN/GaN heterostructures with focus on understanding how the AlN buffer synthesis affects the top films are reported. The study demonstrates very good correlation between different methods providing a platform for reliable estimation of crystalline quality of the AlGaN/GaN structures and related to that electrical performance which is found to be significantly affected by threading dislocations (TD): higher TD density reduces the electron mobility while the charge carrier concentration is found to be largely unchanged. The attempt to vary the ammonia flow during the AlN synthesis is found not to affect the film composition and dislocation densities in the following heterostructures. An unusual phenomenon of considerable diffusion of Ga from the GaN film into the AlN buffer is found in all samples under the study. The obtained results are an important step in optimization of AlGaN/GaN growth towards the formation of good quality HEMT structures on sapphire and transfer of technology to Si substrates by providing clear understanding of the role of synthesis parameter on structure and composition of the films.

Process and Simulation of TiSi2/n+/p Silicon Shallow Junctions

1991 ◽  
Vol 235 ◽  
Author(s):  
Ying Wu ◽  
W. Savin ◽  
T. Fink ◽  
N. M. Ravindra ◽  
R. T. Lareau ◽  
...  
Keyword(s):  
Electrical Characterization ◽  
Furnace Annealing ◽  
Si Substrates ◽  
Conventional Furnace ◽  
Mass Spec ◽  
Current Voltage ◽  
Shallow Junctions ◽  
Current Voltage Characteristics ◽  
Secondary Ion

ABSTRACTExperimental analysis and simulation of the formation and electrical characterization of TiSi2/+/p-Si shallow junctions are presented here. The formation of shallow n+-p junction, by ion implantation of As through Ti films evaporated on p-Si substrates followed by Rapid Thermal Annealing (RTA) and conventional furnace annealing has been performed in these experiments. Structural techniques such as Secondary Ion Mass Spec-troscopy (SIMS) and Rutherford Backscattering (RBS) experiments have been employed to characterize these devices. RUMP simulations were used to analyze and interpret the RBS data. Current-voltage characteristics have been simulated using PISCES simulator.

Fabrication and Electrical Characterization of Heterojunction Mn-Doped GaN Nanowire Diodes on n-Si Substrates (GaN:Mn NW/n-Si)

2009 ◽  
Vol 38 (4) ◽  
pp. 505-510 ◽  
Author(s):  
Tae-Hong Kim ◽  
Chan-Oh Jang ◽  
Han-Kyu Seong ◽  
Heon-Jin Choi ◽  
Sang-Kwon Lee
Keyword(s):  
Electrical Characterization ◽  
Si Substrates ◽  
Gan Nanowire ◽  
Mn Doped

Some Observations on the Electrical Characterization of the Heteroepitaxially Grown Cubic SiC

1989 ◽  
Vol 162 ◽  
Author(s):  
B. Molnar ◽  
G. Kelner
Keyword(s):  
Activation Energy ◽  
Secondary Ion Mass Spectrometry ◽  
Nitrogen Concentration ◽  
Electrical Characterization ◽  
Impurity Band ◽  
Thin Layers ◽  
Si Substrates ◽  
Nitrogen Concentrations ◽  
Band Conduction

ABSTRACTThis paper re-examines the electrical characterization of thin layers of cubic SiC, grown on (100) Si substrates. The resistivity and Hall coefficient for undoped SiC layers were measured between 10 K and 500 K. Electron spin resonance (ESR) and secondary ion mass spectrometry (SIMS) were used to identify and determine the nitrogen concentrations, which were higher than 1017/cm3. In all the samples examined the Hall measurements indicated impurity band conduction. Therefore, the temperature dependence of the resistivity has been used to derive an activation energy el. The value of el found to be in the range of 0.032–0.025 eV. The observed decrease in activation energy has been correlated with an increase in nitrogen concentration. The presence of substantial nitrogen leads to impurity band conduction and it is the most likely reason for the conflicting values reported for the dominant donor ionization energy by Hall and PL measurements.

Structural and Electrical Characterization of Doped Zirconia Nanostructured Fibres

2012 ◽  
Vol 545 ◽  
pp. 285-289
Author(s):  
Adrian Lowe ◽  
Deborah Eve Kho Siu Chu ◽  
Li Lu
Keyword(s):  
Grain Size ◽  
Electrical Characterization ◽  
Electrospinning Process ◽  
Electrical Performance ◽  
Energy Storage Materials ◽  
Impedance Response ◽  
Average Grain Size ◽  
Tetragonal Form ◽  
Cv Measurements

Pure and lithium-doped zirconia fibres have been produced using the electrospinning process. These fibres are seen to be mesoporous in nature and possess a dense outer skin that correlates with the existance of tetragonal structure. This tetragonal form exists in materials below a certain average grain size and also correlates well with capacitance retention, CV measurements and impedance response. During electrical performance, an initial irreversible solid electrolyte interface is believed to form and average grain size has a significant effect. This study suggests that in this mesoporous/skin form, electrospun zirconia fibres are promising energy storage materials.

Electrical characterization of low thermal budget gate oxides on Si/Si0.8Ge0.2/Si substrates

2002 ◽  
Vol 46 (7) ◽  
pp. 991-995 ◽  
Author(s):  
Alok Sareen ◽  
Ann-Chatrin Lindgren ◽  
Per Lundgren ◽  
Stefan Bengtsson
Keyword(s):  
Electrical Characterization ◽  
Gate Oxides ◽  
Thermal Budget ◽  
Si Substrates ◽  
Low Thermal Budget

Material Characterization of Epitaxial GaAs and Ge Films on (100) Si Substrates

1986 ◽  
Vol 67 ◽  
Author(s):  
M. Abdul Awal ◽  
El Hang Lee ◽  
G. L. Koos ◽  
E. Y. Chan ◽  
G. K. Celler ◽  
...  
Keyword(s):  
Material Characterization ◽  
Defect Density ◽  
Electrical Characterization ◽  
Electron Beam Evaporation ◽  
Cross Sectional ◽  
X Ray ◽  
Si Substrates ◽  
Exponential Decrease ◽  
Gaas Films

ABSTRACTWe report some results on the chemical, structural and electrical characterization of Ge and GaAs films, grown on Si (100) substrates by electron-beam evaporation and MOCVD, respectively. Good quality Ge films have been obtained at 700°C substrate temperature at a growth rate of 5 nm/sec in 5 × 10−7 torr. Similarly, good GaAs films were obtained at 650°C and at 0.3 nm/sec. RBS data for GaAs films (1.1 μm) show Xmin approaching 3.5%, and Ge films (1.5 μm) around 3.6%. Photoluminescence of the same films show peaks around 852 nm with FWHM of 14 meV. Cross-sectional TEM and etching show a near-exponential decrease in defect density away from the Ge/Si interface. Detailed characterization results of the S-R, I-V, C-V, and X-ray studies are also described.

scholarly journals Electrical Characterization of Conductive Threads for Textile Electronics

Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 967
Author(s):  
Adrian K. Stavrakis ◽  
Mitar Simić ◽  
Goran M. Stojanović
Keyword(s):  
Internet Of Things ◽  
Electronic Devices ◽  
Electrical Characterization ◽  
Maximum Power ◽  
Electrical Performance ◽  
Microscopic Scale ◽  
Mass Public ◽  
Power Handling ◽  
New Devices

In recent years, advancements in technology are constantly driving the miniaturization of electronic devices, not only in the renowned domain of Internet-of-Things but also in other fields such as that of flexible and textile electronics. As the latter forms a great ecosystem for new devices, that could be functional such as heating garments or sensory, many suppliers have already started producing and bringing to market conductive threads that can be used by researchers and the mass public for their work. However, to date, no extensive characterization has been carried out with respect to the electrical performance of such threads and that is what this article is aiming to amend. Four commercially available threads by two different suppliers were put under test, to establish their limitations in terms of maximum power handling, both continuous and instantaneous. They were subsequently examined at a microscopic scale as well, to verify any potential caveats in their design, and any hidden limitations. A preliminary profile for each of the four threads was successfully established.

scholarly journals A high electrical performance of DG-MOSFET transistors in 4H-SiC and 6H-SiC 130 nm technology by BSIM3v3 model

2019 ◽  
Vol 70 (2) ◽  
pp. 145-151
Author(s):  
Mourad Hebali ◽  
Menaouer Bennaoum ◽  
Mohammed Berka ◽  
Abdelkader Baghdad Bey ◽  
Mohammed Benzohra ◽  
...  
Keyword(s):  
Low Power ◽  
Low Voltage ◽  
Electrical Characterization ◽  
Electrical Performance ◽  
Subthreshold Slope ◽  
Ultra Low Power ◽  
Dg Mosfet ◽  
Subthreshold Operation ◽  
Very High

Abstract In this paper, the electrical performance of double gate DG-MOSFET transistors in 4H-SiC and 6H-SiC technologies have been studied by BSIM3v3 model. In which the I–V and gm–V characteristics and subthreshold operation of the DGMOSFET have been investigated for two models (series and parallel) based on equivalent electronic circuits and the results so obtained are compared with the single gate SG-MOSFET, using 130 nm technology and OrCAD PSpice software. The electrical characterization of DG-MOSFETs transistors have shown that they operate under a low voltage less than 1.2 V and low power for both models like the SG-MOSFET transistor, especially the series DG-MOSFET transistor is characterized by an ultra low power. The different transistors are characterized by an ultra low OFF leakage current of pA order, very high ON/OFF ratio of and high subthreshold slope of order 0.1 V/dec for the transistors in 6H-SiC and 4H-SiC respectively. These transistors also proved higher transconductance efficiency, especially the parallel DG-MOSFET transistor.

Electrical characterization of TSVs with varying process knobs and temporary bond/adhesive system robustness studies for 2.5D/3D manufacturing

2013 ◽  
Vol 2013 (1) ◽  
pp. 000233-000233
Author(s):  
Niranjan Kumar
Keyword(s):  
Electrical Parameter ◽  
Electrical Characterization ◽  
Adhesive System ◽  
Parameter Extraction ◽  
Electrical Performance ◽  
Process Window ◽  
Film Properties ◽  
Wafer Processing ◽  
The Impact

TSVs are used to carry power/ground and signals straight to the heart of the logic/memory devices where all the intricate and busy architectures lie. I consider it like the downtown area inside a city where the real estate is more expensive and requires intricate design and execution. As a result in case of the TSVs, there is no room for electrical degradation and stress interaction with transistor devices (keep out zone). The Cu protrusion, it's interaction with the intricate local interconnects (M1 and below structures), the current leakage, capacitance, reliability, become highly critical to fully achieve the power per watt advantage of the TSVs. As a result, a thorough electrical characterization of TSVs with varying film properties and the process window becomes very critical for integration with the 20nm node (and below) devices. In this paper we will discuss implementation of modified oxide liner, barrier/seed, ECD fill and CMP of films to achieve robust TSVs for electrical parameter extraction. We will closely examine the impact of these film properties on the electrical performance and its repeatability to achieve wide process windows. Such studies are expected to improve manufacturing yields of TSV product wafers at fabs/foundries. Alternately, we will present detailed metrology studies of two temporary bond method/adhesive systems as it progresses through the thin wafer downstream processes (via-reveal processes). This exercise is targeted to address productivity and yield challenges with thin wafer processing (backside via-reveal process). We will attempt to demonstrate a robust temporary bond/adhesive system that exhibits no thin wafer damage/wrinkling and no edge profile degradation issues over repeated runs (production like). This study will help to characterize the adhesive and low temperature passivation film interfaces in details to support the thin wafer processing robustness for TSV manufacturing.

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