scholarly journals EVALUATION OF SOME TECHNICAL INDICATORS OF THE LOCALLY MODIFIED SHELLER FOR CORN GRAIN

2018 ◽  
Vol 49 (6) ◽  
Author(s):  
Taha & et al.

This study was carried out during 2017, at the factory of shelling corn grains at Al-musayyib /Babylon governorate. The objective of this study was to evaluate some technical indicators of the locally modified sheller for corn grain by using sheller machine locally modified with different peripheral speed of shelling cylinder 900, 1100 and 1300 m/min, different clearance between shelling cylinder and concave 23 and 28 mm on some the properties, such as sheller productivity, quality productivity, power consumption and unshelled grains. This research was done by applying the split plot design experiment within RCBD using four replicates. The results showed the following: clearance between shelling cylinder and concave 28 mm indicated significant superiority up on the clearance between shelling cylinder and concave 23 mm with highest sheller productivity (2.474 ton/h) and quality (193.735 kg.h.kw-1), while the clearance between shelling cylinder and concave 23 mm had lower power consumption 11.62 kw and lower percentage of unshelled grains 2.53%. The increasing in the peripheral speed of shelling cylinder from 900 to 1100 and 1300 m/min increased the sheller productivity, quality and power consumption. The peripheral speed of shelling cylinder (1300 m/min) indicated significant superiority up on the peripheral speed of shelling cylinder 900 and 1100 m/min in achieving higher sheller productivity 3.039 ton/h and higher quality productivity 205.061 kg.h/kw. while the peripheral speed of shelling cylinder 900 m/min achieving lower power consumption 11.78 kw and lower percentage of unshelled grains 2.37 %.

2002 ◽  
Vol 11 (01) ◽  
pp. 51-55
Author(s):  
ROBERT C. CHANG ◽  
L.-C. HSU ◽  
M.-C. SUN

A novel low-power and high-speed D flip-flop is presented in this letter. The flip-flop consists of a single low-power latch, which is controlled by a positive narrow pulse. Hence, fewer transistors are used and lower power consumption is achieved. HSPICE simulation results show that power dissipation of the proposed D flip-flop has been reduced up to 76%. The operating frequency of the flip-flop is also greatly increased.


VLSI Design ◽  
1998 ◽  
Vol 8 (1-4) ◽  
pp. 219-223 ◽  
Author(s):  
Christoph Wasshuber ◽  
Hans Kosina ◽  
Siegfried Selberherr

One of the most promising applications of single-electronics is a single-electron memory chip. Such a chip would have orders of magnitude lower power consumption compared to state-of-the-art dynamic memories, and would allow integration densities beyond the tera bit chip.We studied various single-electron memory designs. Additionally we are proposing a new memory cell which we call the T-memory cell. This cell can be manufactured with state-of-the-art lithography, it operates at room temperature and shows a strong resistance against random background charge.


Author(s):  
K. V. Kireeva ◽  
I. A. Pushkaryev ◽  
N. M. Kostomakhin ◽  
T. A. Litvintseva

In order to effectively provide the body of cows with energy during the increasing the milk yield without the risk of acidosis, progressive animal breeders of the Altai Territory include wet flattened corn grain in the composition of concentrated feed. The question of the expediency and economic effectiveness of using wet flattened corn grain for cows of various physiological groups – first-calf heifers and mature animals continues to be debatable. Therefore, a comparative assessment of two options for feeding wet flattened corn grain to cows under the conditions of the Altai Territory is considered promising in modern animal husbandry and is of great practical interest. The purpose of the work was to identify the optimal and economically feasible option for using wet flattened corn grain in the rations of lactating cows. When using wet flattened corn grains in an amount of 7,1 % of the nutritional value of the ration the first-calf heifers during the period of increasing the milk yield, productivity has increased by 20,9 %. The average daily milk yield was 17,3 kg, which significantly exceeded the indicator of the control group (P > 0,95). The inclusion of wet flattened corn grains in the ration of mature cows in the amount of 1 kg for 30–35 days before calving, then 4,5 kg from 15 to 75 days after calving allows us to get the average daily milk yield of 30 kg or 20,3 % higher than that of the control group of herdmates (P > 0,95). The effectiveness of the use of wet flattened corn grain had significant indicators: the total profit from the sale of dairy products of the first-calf heifers of the experimental group amounted to 16 251,3 rubles/head, and from the sale of milk of mature cows of the experimental group it was 30 346,43 rubles/head.


Author(s):  
Mário Pereira Vestias

High-performance reconfigurable computing systems integrate reconfigurable technology in the computing architecture to improve performance. Besides performance, reconfigurable hardware devices also achieve lower power consumption compared to general-purpose processors. Better performance and lower power consumption could be achieved using application-specific integrated circuit (ASIC) technology. However, ASICs are not reconfigurable, turning them application specific. Reconfigurable logic becomes a major advantage when hardware flexibility permits to speed up whatever the application with the same hardware module. The first and most common devices utilized for reconfigurable computing are fine-grained FPGAs with a large hardware flexibility. To reduce the performance and area overhead associated with the reconfigurability, coarse-grained reconfigurable solutions has been proposed as a way to achieve better performance and lower power consumption. In this chapter, the authors provide a description of reconfigurable hardware for high-performance computing.


Author(s):  
Mário Pereira Vestias

High-Performance Reconfigurable Computing systems integrate reconfigurable technology in the computing architecture to improve performance. Besides performance, reconfigurable hardware devices also achieve lower power consumption compared to General-Purpose Processors. Better performance and lower power consumption could be achieved using Application Specific Integrated Circuit (ASIC) technology. However, ASICs are not reconfigurable, turning them application specific. Reconfigurable logic becomes a major advantage when hardware flexibility permits to speed up whatever the application with the same hardware module. The first and most common devices utilized for reconfigurable computing are fine-grained FPGAs with a large hardware flexibility. To reduce the performance and area overhead associated with the reconfigurability, coarse-grained reconfigurable solutions has been proposed as a way to achieve better performance and lower power consumption. In this chapter we will provide a description of reconfigurable hardware for high performance computing.


2012 ◽  
Vol 2012 (1) ◽  
pp. 000542-000547 ◽  
Author(s):  
Reza Asgari

2.5D/3D devices are the next major packaging technologies, driven by the need for more functionality, lower power consumption and smaller footprint. Many device manufacturers are devoting capital to develop their own processes and some are already shipping devices such as FPGA (Field Programmable Gate Array) on interposers. 3D packages often require hundreds of thousands of I/O per die. Micro Pillar bumps and C4 bumps are the main bump geometries used in 3D packages as their small pitch and size allow the required number of I/Os. Inspecting these bumps throughout the process is critical because failure after chip to chip or chip to wafer bonding is very costly. This paper describes the use of a camera and laser triangulation to provide complete 2D and 3D measurement and inspection capability.


2019 ◽  
Vol 29 (05) ◽  
pp. 2030005
Author(s):  
Constantinos Efstathiou ◽  
Kiamal Pekmestzi ◽  
Nikolaos Moshopoulos

In this work, the design of the diminished-1 modulo [Formula: see text] adders, subtractors and adders/subtractors are examined. Some of the existing modulo [Formula: see text] adders, subtractors and adder/subtractors are redesigned and improved. Compared to other existing implementations, the proposed subtractor and adder/subtractors offer reduced area complexity and lower power consumption, while operating at the same speed. All the considered architectures are modified parallel-prefix adders with fast input carry processing. The totally parallel-prefix and carry look ahead implementation of the proposed arithmetic units are also discussed.


2018 ◽  
Vol 7 (3) ◽  
pp. 1189
Author(s):  
Mr Aaron D’costa ◽  
Dr Abdul Razak ◽  
Dr Shazia Hasan

Digital multiplier circuits are used in computers. A multiplier is an electronic circuit used in digital electronics to multiply two binary numbers. Multiplier circuits are used in ALU for binary multiplication of signed and unsigned numbers. The delay, area and power consumption are the 3 most important design specifications a chip designer has to consider. Delay of the circuit is directly proportional to the delay of a multiplier. Increased delay in the multiplier leads to higher delay in the circuit. Therefore research is carried out as to how to reduce the delay of the multiplier block so as to reduce the delay of whole circuit. The main purpose is to deal with high speed and lower power consumption even after decreasing the silicon area. This makes them well-suited for numerous complex and convenient VLSI circuit implementations. The fact however, remains that area and speed are two contradictory performance restrictions. Hence, increase in speed always results in the use of more and complex hardware. Different arithmetic techniques can be used to implement different multiplier circuits. The focus of this paper is to implement various multiplier circuit and compare them. The timing signals can be observed using software such as Modelsim and Xilinx.  


2012 ◽  
Vol 51 (1-3) ◽  
pp. 606-608 ◽  
Author(s):  
Dionísio da Silva Biron ◽  
Camila Cherubini ◽  
Venina dos Santos ◽  
Lucas Gomes ◽  
Andréa Schneider ◽  
...  

2013 ◽  
Vol 22 (10) ◽  
pp. 1340025
Author(s):  
TENG WANG ◽  
LEI ZHAO ◽  
ZI-YI HU ◽  
ZHENG XIE ◽  
XIN-AN WANG

In this paper, a novel decomposition approach and VLSI implementation of the chroma interpolator with great hardware reuse and no multipliers for H.264 encoders are proposed. First, the characteristic of the chroma interpolation is analyzed to obtain an optimized decomposition scheme, with which the chroma interpolation can be realized with arithmetic elements (AEs) which are comprised of only adders. Four types of AEs are developed and a pipelining hardware design is proposed to conduct the chroma interpolation with great hardware reuse. The proposed design was prototyped within a Xilinx Virtex6 XC6VLX240T FPGA with a clock frequency as high as 245 MHz. The proposed design was also synthesized with SMIC 130 nm CMOS technology with a clock frequency of 200 MHz, which could support a real-time HDTV application with less hardware cost and lower power consumption.


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