Joining Active Metals with Al2O3 by Use of Solders

2013 ◽  
Vol 664 ◽  
pp. 667-671
Author(s):  
Roman Koleňák ◽  
Michal Prach
Keyword(s):  
Active Element ◽  
Metallic Substrate ◽  
Soldering Temperature ◽  
Diffusion Bond ◽  
Soldering Process ◽  
Soldering Time ◽  
Temperature Capability

The work deals with joining active metals as Ti, Zr and Hf with Al2O3ceramics. The solubility of these active metals in selected Sn and In based solders was studied at a selected soldering temperature. Capability of active metals to wet Al2O3ceramics and to form a diffusion bind was ascertained. Soldering was performed with Sn, Sn5Ag, In and In30Sn solders, which were enriched by an active element from metallic substrate of the joint in soldering process. Soldering temperature in vacuum varied from 770 to 870 °C and soldering time was selected from 8 to 20 min. It was found out that the most suitable metal for active solders is Ti, because it is dissolved in Sn solder already at temperature 780 °C. Wetting of ceramic Al2O3substrate and formation of a diffusion bond was achieved already at temperature 830 °C/8 min. Diffusion bond with Zr was formed just at temperature 870 °C/20 min. and it was impossible to form a diffusion bond with Hf.

Crack Reduction in Tabbing and Stringing Processes for Solar Cells

2018 ◽  
Vol 777 ◽  
pp. 126-131 ◽  
Author(s):  
Atcharapha Kongwiriyaphaisan ◽  
Viboon Tangwarodomnukun
Keyword(s):  
Solar Cells ◽  
Solar Cell ◽  
Adhesion Force ◽  
Substrate Surface ◽  
Production Yield ◽  
Silicon Solar Cells ◽  
Mechanical Loads ◽  
Soldering Temperature ◽  
Soldering Time ◽  
Cell Manufacturing

Wafer cracking is considered to be an important loss in solar cell manufacturing as it crucially affects the production yield as well as the efficiency of solar cells fabricated. There is a certain chance of cracking in wafer when the substrate undergoes some thermal and/or mechanical loads during its fabrication. This research therefore aims to decrease the solar cells cracking in tabbing and stringing processes as the two processes are responsible for a great number of cracks in the substrate. A set of experiments was performed in this study, where soldering temperature and time were tested and the amount of cracks in solar cells was quantified. The findings showed that the use of 185°C soldering temperature with the soldering time of 1,200 ms can reduce the number of cracks in the tabbing and stringing of silicon solar cells. With this setup, the adhesion force between tabbing ribbons and substrate surface can also be promoted, thus preventing the delamination problem in the cell panels.

Effects of Soldering Temperature on IMCs Formation between Sn-0.7Cu Solder and Cu Substrate

2015 ◽  
Vol 713-715 ◽  
pp. 2685-2688
Author(s):  
Zhi Xian Min ◽  
Xiao Wu Hu ◽  
Ying Xia Qiu
Keyword(s):  
Microstructural Analysis ◽  
Intermetallic Phases ◽  
Cu Substrate ◽  
Soldering Temperature ◽  
Soldering Process ◽  
Fitting Method ◽  
Ε Phase ◽  
Four Levels ◽  
The Relationship ◽  
Scanning Electron

The interfacial reaction and growth of intermetallic compounds (IMCs) between the eutectic Sn-0.7 wt.% Cu solder and Cu substrate during soldering process were investigated experimentally. The Sn-0.7Cu/Cu couples were fabricated with soldering temperature varied at four levels of 300, 340 and 360°C. Microstructural analysis is conducted to analyze the IMCs thickness and morphology using scanning electron microscope. Two intermetallic phases were observed during soldering at the interface: η-phase (Cu6Sn5) and ε-phase (Cu3Sn) IMC layers, except for the solder joints which were fabricated at low temperature. The thickness of the η and ε IMC phases increase with increasing the soldering temperature. It’s found that the increase in total IMC layer thickness obeys a linear relationship with soldering temperature. And the relationship between X and T was given as X = 0.0866×T – 22.5 by means of linear fitting method.

Growth of Cu-Zn5 and Cu5Zn8 Intermetallic Compounds in the Sn-9Zn/Cu Joint during Liquid State Aging

2010 ◽  
Vol 173 ◽  
pp. 90-95 ◽  
Author(s):  
Ramani Mayappan ◽  
Rosyaini A. Zaman ◽  
Zalina Z. Abidin ◽  
Fatinnajihah Alias Asmawati ◽  
Mohd Nazree Derman
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
X Ray ◽  
Soldering Temperature ◽  
Soldering Time ◽  
Free Solder ◽  
Thickness Measurements ◽  
Scanning Electron

The phase and intermetallic thickness of Cu-Zn5 and Cu5Zn8 has been investigated under liquid state aging using reflow method. Both intermetallics were formed by reacting Sn-9Zn lead free solder with copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. The morphology of the Cu5Zn8 phase was rather flat but when the soldering temperature and time increases, the morphology becomes scallop. Intermetallic thickness measurements show that the thickness of Cu-Zn5 decreases with increasing soldering time and temperature. Whereas, the thickness of Cu5Zn8 intermetallic increases with soldering time and temperature.

scholarly journals Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder

Crystals ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 59 ◽  
Author(s):  
Zhihuan Zhao ◽  
Guanghao Gong ◽  
Mingming Jiang ◽  
Chuanzhong Chen ◽  
Yingyue Pan ◽  
...  
Keyword(s):  
Cross Sections ◽  
Eutectic Reaction ◽  
Eutectic Structure ◽  
Effect Of Temperature ◽  
Sem Images ◽  
Soldering Temperature ◽  
Soldering Process ◽  
Xrd Diffraction ◽  
Alloy Solder ◽  
Negative Impacts

In this study, soldering is conducted between a chip and a CLCC-3 shell base with a sheet-like AuGa0.03 alloy solder as the encapsulating material. X-ray images of chip soldering samples, XRD diffraction analysis of the joints, SEM images reflecting the microstructures of the joints, and EDS of the cross sections of the chip soldering samples show that with gradually increasing soldering temperature, the phase composition is not affected, and all the joint structures are an Au + Si eutectic structure; the Au–Si eutectic reaction occurs during the soldering process. No deposition of meta-stable phases, such as Au7Si, Au5Si, or Au3S, is found. A soldering temperature of 420 °C can reduce the negative impacts of secondary cap welding soldering on the joint and improve the structure and mechanical properties of the joint.

Design of Lead-Free Solders and Pollution Control of Lead

2014 ◽  
Vol 881-883 ◽  
pp. 1435-1438 ◽  
Author(s):  
Gui Sheng Gan ◽  
Chang Hua Du ◽  
Chun Tian Li
Keyword(s):  
Pollution Control ◽  
Surface Film ◽  
Lead Content ◽  
Lead Free ◽  
Soldering Temperature ◽  
Soldering Process ◽  
Lead Production ◽  
Lead Free Solders

Due to increase refined lead production and slow industrialization of lead-free solders, hazard of lead to human and environment still existed. Based on pollutions of lead depending on the volatility and the solubility of lead, the new ways to prevent and reduce the pollution of lead were put forward. The lead content in lead-solders could be reduced appropriately and the dense surface film could be formed by micro-alloying in the view of material for reducing the pollution. Low soldering temperature and the optimal soldering process or equipment could also be taken to reduce the pollution of lead.

Comparison of Wettability for Sn-Based Solders on Copper and Aluminum Substrates

2011 ◽  
Vol 687 ◽  
pp. 15-20
Author(s):  
Li Meng Yin ◽  
Jian Wei Xian ◽  
Zong Xiang Yao
Keyword(s):  
Surface Tension ◽  
Solder Alloy ◽  
Active Element ◽  
Cu Substrate ◽  
Soldering Temperature ◽  
Wetting Properties ◽  
Wetting Time ◽  
Aluminum Substrates ◽  
Wetting Force ◽  
Better Than

The wetting properties of four typical Sn-based solders, i.e., Sn-37Pb, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-9Zn, on copper (Cu) and aluminum (Al) substrates at 250 °C, 260 °C and 270 °C were evaluated and compared by wetting balance method. The experimental results show that the wetting time of all solders on Cu substrate is shorter than that on Al substrate, but the wetting force of the solders with Cu substrate is bigger than that with Al substrate except Sn-9Zn solder. In addition, the wettability of the solders on Al substrate increases with increasing soldering temperature, and the wetting force of Sn-9Zn increases most obviously among four solders and reach 3.68 mN at 270 °C. The results also show that the wettability of the solders on Cu substrate mainly depends on surface tension of solder alloy, however, it depends on both surface tension and interaction with Al on Al substrate. Due to the active element Zn riches on the surface of Sn-9Zn solder, and Zn solid solutes into Al more easily, the wettability of Sn-9Zn solder on Al substrate is better than other three solders.

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

2014 ◽  
Vol 137 (1) ◽  
Author(s):  
Leila Ladani ◽  
Ousama Abdelhadi
Keyword(s):  
Elastic Modulus ◽  
Solder Joints ◽  
Electron Backscatter Diffraction ◽  
Plastic Properties ◽  
Soldering Temperature ◽  
Nano Indentation ◽  
Soldering Process ◽  
Loading Direction ◽  
Solid Liquid ◽  
Backscatter Diffraction

The elastic and plastic mechanical properties of intermetallic compound (IMC) phases of a lead-free Sn3.5Ag/Cu-substrate soldering system are investigated in different sized joints using nano-indentation. The specimens were prepared using solid–liquid interdiffusion soldering process with joint sizes ranging from 15 to 450 μm. Solder joints were subjected to 360 °C soldering temperature for 20 min and then air cooled to room temperature to create testable IMCs thicknesses. Nano-indentation was used to extract the elastic and plastic properties of Cu6Sn5, Cu3Sn, and Ag3Sn IMCs and β-tin and copper materials. Cu–Sn IMCs formed in specimens with smaller joint size show higher elastic modulus, hardness, and yield strength and lower work hardening exponent. This was attributed to the dimensional constraints associated with decreasing joint size and the local stresses developed during fabrication in joints with different sizes. Local elastic modulus and hardness of single grains of Cu6Sn5 were obtained using a combination of nano-indentation and electron backscatter diffraction (EBSD) techniques. Grains with c-axis at a 45 deg angle with respect to the nano-indentation loading direction show higher elastic modulus (∼8.70% higher) and hardness (8.85% higher) compared to the grains that have a c-axis that is almost perpendicular to the nano-indentation loading direction.

Key Parameter Optimization in Wave Soldering

2011 ◽  
Vol 323 ◽  
pp. 84-88 ◽  
Author(s):  
Wan Gang Wang ◽  
Yong Peng ◽  
Xiao Ping Wang
Keyword(s):  
Printed Circuit Board ◽  
High Reliability ◽  
Peak Height ◽  
Productive Efficiency ◽  
Circuit Board ◽  
Soldering Temperature ◽  
Soldering Process ◽  
Wave Soldering ◽  
Productive Process ◽  
Through Hole

Wave soldering is mainly used in electronic assembling process of traditional through-hole cartridge printed-circuit board and hybrid packaged process combining surface mounting with through-hole cartridge components. Compared with manual welding, wave soldering has advantages of high productive efficiency, good welding quality and high reliability. Wave soldering process is a complex and systematic project. During the practical productive process, flux coating quantity, preheat temperature of printed board, soldering temperature and time, uphill height of printed board and peak height should be strictly controlled and its process parameter should be comprehensively regulated in order to achieve better soldering quality.

scholarly journals Mechanisms of structural-phase transformations during crystallization of solder melt under conditions of magnetic-dynamic influences for carbide tools

2021 ◽  
pp. 40-47
Author(s):  
Anatoliy Kuzey ◽  
Vladimir Lebedev ◽  
Pavel Tsykunov ◽  
Andrey Slipchuk
Keyword(s):  
Contact Interaction ◽  
Structural Phase ◽  
High Strength ◽  
Grain Structure ◽  
Hard Alloys ◽  
Soldering Temperature ◽  
Hardening Mechanism ◽  
Soldering Process ◽  
Magnetic Dynamic ◽  
Copper Zinc

The processes of melt formation were studied by methods of optical and electron scanning microscopy. These processes occur during induction brazing of a hard alloy to a steel holder and contact interaction of low-melting (copper-zinc system alloy) and refractory (iron-nickel) components of the solders. It is shown that the effect of a thermal and magnetic-dynamic high-frequency electromagnetic field on the components of the composite solder is how a high-strength solder joint is formed. The structure is forming by disperse hardening mechanism. The research of the contact interaction process for low-melting and high-melting components of solders during the soldering process of the tool showed that the formation of solder in brazed seams occurs through a number of stages and this does not lead to the formation of microstructures that are characteristic of alloys based on copper-iron-phosphorus, copper-zinc-nickel and copper-zinc-iron. Thus, the use of composite solders can reduce the soldering temperature by 40-50 K and increase the concentration of alloying species in the solder and change its structure. These advantages of composite solders reduce the thermal impact on contact materials, increase the strength of the weld and allow you to control the thickness of the brazed weld, and this is important when soldering hard alloys of WC-TiC (TaC) systems. High initial dissolution rates of nickel particles in the copper-zinc melt and the solubility of copper, zinc in nickel lead to the formation in the melt of quasi-liquid particles of the nickel alloy. When the melt is cooled, particles other than the surrounding alloy composition are formed. They are morphologically related to the grain structure of the solder. The formed alloy (solder) has the structure of a composite material in which the metal particles are enriched in nickel, and have the role of a reinforcing element.

Soldering to Gold Thin Films Using Indium Rich Silver Eutectic Alloys

2021 ◽  
Vol 875 ◽  
pp. 81-87
Author(s):  
Muhammad Mansoor ◽  
Hamid Zaigham ◽  
Khalid Mehmood Ghauri ◽  
Liaqat Ali
Keyword(s):  
Thin Films ◽  
Semiconductor Devices ◽  
Vital Role ◽  
Soldering Temperature ◽  
Soldering Process ◽  
Gold Thin Films ◽  
Soldering Alloys ◽  
Electrical Connections ◽  
Mechanical Strengths ◽  
Wetting Behaviors

Performance of the semiconductor devices is solicited by reliable metallic electrical connections. Any bad electrical connection may one of the major sources of noise and low mechanical strength, hence reducing the performance and life of the device. Apart from the successful synthesis or development of semiconductor devices or solders; the technique to carry out soldering process plays a vital role to attain reliable and reproducible electrical connections. This paper demonstrates the soldering process on gold thin films using In-3.0%Ag eutectic soldering alloys considering the three fundamental aspects of the process i.e. scavenging, wetting and aging. Scavenging and wetting behaviors of the solder were evaluated at various temperatures and different fluxes, respectively. Effect of aging was evaluated by shear testing after aging for various durations. It was observed that using the soldering temperature somewhere between 160-190 °C with 20 wt.% salicylic acid flux is favorable for better wetting and scavenging characteristics. A post solder aging (at 95 °C for 12 hours) seamed to facilitate improvement in mechanical strengths.

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