Energy and Eco-Sustainability using Pressure-less Silver Sintering for RF Power Electronics

2019 ◽  
Vol 2019 (1) ◽  
pp. 000344-000359
Author(s):  
Evan A. Hueners ◽  
Richard D. Hueners ◽  
Anthony D. F. O' Sullivan ◽  
M. Redzuan Zin
Keyword(s):  
Power Electronics ◽  
High Speed ◽  
Bond Line ◽  
Acoustic Microscopy ◽  
Rf Power ◽  
Technical Requirements ◽  
Die Attach ◽  
Effective Manner ◽  
Confocal Scanning ◽  
Silver Sintering

Abstract Energy & Eco-Sustainability using Pressureless Silver Sintering for RF Power Electronics A virtually void free die attach was successfully achieved using a fixed but critical volume of Ag sinter paste by a process of pressureless sintering on a multi-axis cartesian style bonder, retro-fitted with with a high-speed jetting dispenser. While this process potentially offered an ideal combination of cost-effectiveness, control and speed, it required the development of additional software protocols to secure the level of performance demanded of the dispenser to meet exacting technical requirements. This proprietary adaptation we term “Fixed BLT” software, and over five test pieces we were consistently able to deliver a fixed height bond-line of circa 70% of bond height, translating as 50 um before sinter and 30 um after. In each case the result was a virtually bond free void secured in a timely, repeatable, commercially effective manner. The absence of voids was verified through industry standard non-destructive analysis utilizing confocal scanning acoustic microscopy (CSAM).

Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy

2013 ◽  
Vol 53 (9-11) ◽  
pp. 1617-1621 ◽  
Author(s):  
Wissam Sabbah ◽  
Stéphane Azzopardi ◽  
Cyril Buttay ◽  
Régis Meuret ◽  
Eric Woirgard
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
Die Attach ◽  
Germanium Alloy ◽  
Silver Sintering

scholarly journals Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling

2021 ◽  
Vol 11 (15) ◽  
pp. 7012
Author(s):  
Michele Calabretta ◽  
Alessandro Sitta ◽  
Salvatore Massimo Oliveri ◽  
Gaetano Sequenzia
Keyword(s):  
Silicon Carbide ◽  
Process Optimization ◽  
Acoustic Microscopy ◽  
Experimental Methodology ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Element Analysis ◽  
Electric Parameter ◽  
Die Attach ◽  
Silver Sintering

The increasing demand in automotive markets is leading the semiconductor industries to develop high-performance and highly reliable power devices. Silicon carbide MOSFET chips are replacing silicon-based solutions through their improved electric and thermal capabilities. In order to support the development of these novel semiconductors, packaging technologies are evolving to provide enough reliable products. Silver sintering is one of the most promising technologies for die attach. Due to their superior reliability properties with respect to conventional soft solder compounds, dedicated reliability flow and physical analyses should be designed and employed for sintering process optimization and durability assessment. This paper proposes an experimental methodology to optimize the pressure value applied during the silver sintering manufacturing of a silicon carbide power MOSFET molded package. The evaluation of the best pressure value is based on scanning electron microscopy performed after a liquid-to-liquid thermal shock reliability test. Furthermore, the sintering layer degradation is monitored during durability stress by scanning the acoustic microscopy and electric measurement of a temperature sensitive electric parameter. Moreover, mechanical elastoplastic behavior is characterized by uniaxial tensile test for a bulk sample and finite element analysis is developed to predict the mechanical behavior as a function of void fraction inside sintering layer.

AlGaN/GaN HEMTs: RECENT DEVELOPMENTS AND FUTURE DIRECTIONS

2008 ◽  
Vol 18 (04) ◽  
pp. 913-922 ◽  
Author(s):  
SIDDHARTH RAJAN ◽  
UMESH K. MISHRA ◽  
TOMÁS PALACIOS
Keyword(s):  
Field Effect ◽  
High Speed ◽  
Digital Circuits ◽  
Field Effect Transistors ◽  
Rf Power ◽  
Power Performance ◽  
Future Directions ◽  
Recent Developments ◽  
Gan Hemts ◽  
State Of Art

This paper provides an overview of recent work and future directions in Gallium Nitride transistor research. We discuss the present status of Ga -polar AlGaN / GaN HEMTs and the innovations that have led to record RF power performance. We describe the development of N -polar AlGaN / GaN HEMTs with microwave power performance comparable with state-of-art Ga -polar AlGaN / GaN HEMTs. Finally we will discuss how GaN -based field effect transistors could be promising for a less obvious application: low-power high-speed digital circuits.

Confocal scanning acoustic microscopy in air at normal conditions at frequencies close to the phonon cut-off regime

1999 ◽  
Vol 263-264 ◽  
pp. 588-594 ◽  
Author(s):  
T.J Kim ◽  
Z Kojro ◽  
M Pluta ◽  
M Schmachtl ◽  
M Schubert ◽  
...  
Keyword(s):  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Confocal Scanning

Machine Learning Acoustic Emission Based Monitoring of Cold Forging for Smart Manufacturing: A Review

2021 ◽  
Vol 2 (3) ◽  
Keyword(s):  
Machine Learning ◽  
Acoustic Emission ◽  
Product Quality ◽  
High Speed ◽  
High Rate ◽  
Cold Forging ◽  
Smart Manufacturing ◽  
Forming Process ◽  
Cold Forming ◽  
Effective Manner

Cold forging is a high-speed forming technique used to shape metals at near room temperature. and it allows high-rate production of high strength metal-based products in a consistent and cost-effective manner. However, cold forming processes are characterized by complex material deformation dynamics which makes product quality control difficult to achieve. There is no well defined mathematical model that governs the interactions between a cold forming process, material properties, and final product quality. The goal of this work is to provide a review for the state of research in the field of using acoustic emission (AE) technology in monitoring cold forging process. The integration of AE with machine learning (ML) algorithms to monitor the quality is also reviewed and discussed. It is realized that this promising technology didn’t receive the deserving attention for its implementation in cold forging and that more work is needed.

scholarly journals HIGH-SPEED ROLLING STOCK OF UKRAINE

2021 ◽  
pp. 32-42
Author(s):  
О.М. Safronov ◽  
Keyword(s):  
High Speed ◽  
Brake System ◽  
Rolling Stock ◽  
Joint Stock Company ◽  
The European Union ◽  
Stock Company ◽  
Passenger Traffic ◽  
Technical Requirements ◽  
The World ◽  
Electric Train

A brief history of the development of high-speed passenger traffic in the countries of the world is shown, it is shown that the length of high-speed highways (SMM) in the world is 44 thousand km. Despite the fact that Ukraine is not included in the list of 28 countries with the SMM, a two-system electric train ECR1 "Tarpan" was created on the basis of the PUBLIC JOINT STOCK COMPANY "KRYUKOVSKY RAILWAY CAR BUILDING WORKS" (PJSC "KVBZ") for the speed of movement of more than 200 km / h. A description of the electric train and the peculiarities of the brake system are given. It is shown that the brake system corresponds to world counterparts for high-speed trains about what evidence test results, which, due to the lack of ATS, were carried out for a speed of 160 km / h. The results of the settlement research, using the mathematical model and the results of the driving brake tests, showed that the braking pathway of the electric train at a speed of 200 km / h is 1539 m, and at a speed of 300 km / h - 3172 m. The obtained brake path values comply with the technical requirements of the European Union TSI . Studies confirm that Ukraine has high-speed rolling stock for speeds up to 300 km / h. Key words: high-speed rolling stock, electric train, brake system, brake path, speed

Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging

2021 ◽  
Author(s):  
Sri Krishna Bhogaraju ◽  
Hiren R. Kotadia ◽  
Fosca Conti ◽  
Armin Mauser ◽  
Thomas Rubenbauer ◽  
...  
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Electronics Packaging ◽  
Die Attach

Network-on-Chip for Low Power MAP Decoder Using Folded Technique and CORDIC Algorithm for 5G Network

2021 ◽  
pp. 96-108
Author(s):  
Shiyamala S. ◽  
Vijay Soorya J. ◽  
Sanjay P. S. ◽  
Sathappan K.
Keyword(s):  
Turbo Codes ◽  
High Speed ◽  
Life Time ◽  
Full Adder ◽  
Network On Chip ◽  
Cordic Algorithm ◽  
Effective Manner ◽  
Constraint Length ◽  
On Chip ◽  
Map Decoder

With different constraint length (K), time scale, and code rate, modified MAP (maximum a posteriori) decoder architecture using folding technique, which has a linear life time chart, is developed, and dedicated turbo codes will be placed in a network-on-chip for various wireless applications. Folded techniques mitigated the number of latches used in interleaving and deinterleaving unit by adopting forward and backward resource utilizing method to M-2, where M is the number of rows and end-to-end delay get reduced to 2M. By replacing conventional full adder by high speed adder using 2 x 1 multiplexer to calculate the forward state metrics and reverse state metrics will minimize the power consumption utilization in an effective manner. In s similar way, CORDIC (Coordinated ROtation DIgital Computer) algorithm is used to calculate the LLR value and confer a highly precise value with less computational complexity by means of only shifting and adding methods.

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